Smart RFID Labels with CMOS and Printed Sensors (Printed Electronics Europe 2014)

Dr Danick Briand, Team Leader
Ecole Polytechnique Federal de Lausanne
Switzerland
 
2014 4월1일.

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Berlin 2014 Presentation - Ecole Polytechnique Federal de Lausanne*

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Presentation Summary

  • Recent advances on printing smart sensing RFID labels for logistics
  • CMOS silicon sensors vs. printed sensors: pro and cons
  • Low temperature integration technologies for silicon chip to foil and foil to foil assembly
  • Semi-active RFID labels demonstrators with co-integration of silicon and printed components

Speaker Biography (Danick Briand)

Danick Briand received his B.Eng. degree and M.A.Sc. degree in engineering physics from École Polytechnique in Montréal, Canada, in collaboration with the Institut National Polytechnique de Grenoble (INPG), France, in 1995 and 1997, respectively. He obtained his Ph.D. degree in the field of micro-chemical sensing systems from the Institute of Microtechnology (IMT), University of Neuchâtel, Switzerland in 2001. He is currently the team leader of the EnviroMEMS, Energy and Enviromental MEMS group at EPFL IMT LMTS. He has been awarded the Eurosensors Fellowship in 2010. He has been author or co-author on more than 200 papers published in scientific journals and conference proceedings. His research interests include polymeric MEMS, Power MEMS and energy harvesting, autonomous smart sensing systems, and printed and flexible microsystems technologies.

Company Profile (Ecole Polytechnique Federale de Lausanne EPFL)

Ecole Polytechnique Federale de Lausanne EPFL logo
Our state-of-the-art foil processing and printing platform and unique expertise in microsystems at EPFL-LMTS allow cutting edge R&D on foil based smart systems. We are developing sensors, energy harvesting and integration technologies for the fabrication of energy efficient systems on polymeric, elastomeric, cellulosic and biodegradable substrates. Sensing, energy harvesting and storage, printing, and integration technologies for multi-layers flexible and stretchable hybrid systems are our core activities. We also have extended experience in transferring technology from R&D into viable products and processes for industry.
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