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| 1. | EXECUTIVE SUMMARY |
| 1.1. | 6G spectrum and network deployment strategy |
| 1.2. | 6G performance with respect to 5G |
| 1.3. | Global 6G government-aided initiatives - an overview |
| 1.4. | Summary of key 6G activities and future roadmap |
| 1.5. | DoCoMo, NTT sign 6G pact with Fujitsu, NEC, Nokia |
| 1.6. | Overview of key technologies that enable THz communication |
| 1.7. | Challenges regarding semiconductor for THz communications |
| 1.8. | Overview of Si vs III-V semiconductors for 6G |
| 1.9. | Overview of transistor performance metrics of different semiconductor technologies |
| 1.10. | Overview of semiconductor technology choice for THz RF |
| 1.11. | Power amplifier benchmark in beyond 200 GHz frequency band |
| 1.12. | State-of-the-art InP power amplifiers - the performance and the players |
| 1.13. | Three approaches to integrate InP on CMOS to make a >100 GHz beamforming transmitter |
| 1.14. | Summary table of key THz Technologies |
| 1.15. | Technology benchmark of phase antenna array in 28, 90, and 140 GHz. |
| 1.16. | 140 GHz THz prototype from Samsung and UCSB - IC and antenna fabrication details |
| 1.17. | D-Band (110 to 175 Hz) Phased-Array-on-Glass Modules from Nokia |
| 1.18. | Building a 140 GHz phase antenna array - what are the key factors? |
| 1.19. | An example of antenna processing unit designed for cell-free mMIMO |
| 1.20. | IDTechEx outlook of low-loss materials for 6G |
| 1.21. | Phased-array antenna module design trend for 6G |
| 1.22. | Benchmark of different types of non-terrestrial (NTN) technologies |
| 1.23. | Huawei test non-terrestrial 6G networking using LEO satellites |
| 1.24. | Metamaterials for RIS in telecommunication |
| 1.25. | 6G - an overview of key applications |
| 1.26. | Apple's patents on THz sensor for gas sensing and imaging |
| 1.27. | Integrated Sensing and Communication (ISAC) prototype from Huawei |
| 1.28. | 6G base stations market forecast |
| 1.29. | 5G base stations market forecast |
| 1.30. | Reconfigurable intelligent surfaces in telecommunications: Forecasts segments |
| 1.31. | Summary: Global trends and new opportunities in 6G |
| 2. | 6G INTRODUCTION |
| 2.1. | The evolution of mobile communications |
| 2.2. | Evolving mobile communication focus |
| 2.3. | 6G visions |
| 2.4. | 5G&6G development and standardization roadmap |
| 2.5. | 6G spectrum - which bands are considered? |
| 2.6. | Bands vs Bandwidth |
| 2.7. | Spectrum characteristics from 2G to 6G |
| 2.8. | 6G spectrum and network deployment strategy |
| 2.9. | 6G performance with respect to 5G |
| 2.10. | Beyond 5G Wireless - the pros and the cons |
| 2.11. | 6G - an overview of key applications |
| 2.12. | An overview of potential 6G services |
| 2.13. | 6G - Overview of key enabling technologies (1) |
| 2.14. | 6G - Overview of key enabling technologies (2) |
| 2.15. | Evolution of hardware components from 5G to 6G: technology benchmark of different communication frequencies |
| 2.16. | Summary: Global trends and new opportunities in 6G |
| 2.17. | DoCoMo, NTT sign 6G pact with Fujitsu, NEC, Nokia |
| 2.18. | Fujitsu teams with NTT and Docomo for 6G trials |
| 3. | 6G DEVELOPMENT ROADMAP IN 5 KEY REGIONS (CHINA, US, EU, JAPAN, AND SOUTH KOREA) |
| 3.1. | Global 6G government-aided initiatives - an overview |
| 3.2. | 6G development roadmap - South Korea |
| 3.3. | 6G development roadmap - Japan |
| 3.4. | 6G development roadmap - China |
| 3.5. | 6G development roadmap - EU |
| 3.6. | 6G development roadmap - US |
| 3.7. | Funding models to research the next mobile communication infrastructure |
| 4. | 6G INDUSTRY KEY ACTIVITIES/KEY ANNOUNCEMENT |
| 4.1. | Nokia's 6G activity |
| 4.2. | Ericsson's 6G activity (1) |
| 4.3. | Ericsson's 6G activity (2) |
| 4.4. | Huawei's 6G activity |
| 4.5. | Samsung's 6G activity |
| 4.6. | Samsung's strategy to 6G |
| 4.7. | DoCoMo, NTT sign 6G pact with Fujitsu, NEC, Nokia |
| 4.8. | Fujitsu teams with NTT and Docomo for 6G trials |
| 4.9. | Apple is planning ahead for 6G |
| 5. | 6G DEVICE TECHNOLOGY TREND |
| 5.1. | Overview of key technologies that enable THz communication |
| 6. | 6G RADIO SYSTEM ANALYSIS |
| 6.1. | Short and long term technical targets for 6G radio |
| 6.2. | Potential 6G transceiver architecture |
| 6.3. | Overview of key technical elements in 6G radio system |
| 6.4. | Bandwidth and Modulation |
| 6.5. | Bandwidth requirements for supporting 100 Gbps - 1 Tbps radios |
| 6.6. | Bandwidth and MIMO - challenges and solutions |
| 6.7. | Key parameters that affect the 6G radio's performance |
| 6.8. | Proof of concepts - achieving beyond 100 Gbps |
| 6.9. | Radio link range vs system gain |
| 6.10. | Hardware Gap |
| 6.11. | The biggest bottleneck in THz region |
| 6.12. | Saturated output power vs frequency (all semiconductor technologies) - 1 |
| 6.13. | Saturated output power vs frequency (all semiconductor technologies) - 1 |
| 6.14. | Receiver noise - hardware challenges |
| 6.15. | Choices of semiconductor for low noise amplifiers (LNA) in 6G |
| 6.16. | Phase noise - hardware challenges |
| 6.17. | Digital signal processing |
| 6.18. | Summary table of key THz Technologies |
| 6.19. | Summary table - key THz Characteristics |
| 7. | POWER CONSUMPTION ANALYSIS OF 6G RADIO |
| 7.1. | Building blocks for sub-THz radio |
| 7.2. | Power consumption calculation |
| 7.3. | Power consumption of PA scale with frequency |
| 7.4. | Higher frequency poses significant challenges in transmission distance |
| 7.5. | Power consumption in the transceiver side (1) |
| 7.6. | Power consumption in the transceiver side (2) |
| 7.7. | Power consumption in the receiver side |
| 7.8. | Summary (1) |
| 7.9. | Summary (2) |
| 8. | SEMICONDUCTORS FOR 6G |
| 8.1. | Introduction |
| 8.1.1. | What to consider when choosing semiconductor technologies for 6G applications |
| 8.1.2. | State of the art RF transistors performance |
| 8.2. | Si-based semiconductor: CMOS, SOI, SiGe |
| 8.2.1. | CMOS - the performance limitation |
| 8.2.2. | CMOS technology - Bulk vs SOI |
| 8.2.3. | State-of-the-art RF CMOS technology in research and industry |
| 8.2.4. | FDSOI Ecosystem - key players |
| 8.2.5. | Summary - RF CMOS SOI Technology |
| 8.2.6. | SiGe |
| 8.2.7. | State-of-the-art RF SiGe technology in research and industry (1) |
| 8.2.8. | Europe's effort in SiGe development |
| 8.2.9. | Infineon and STMicroelectronics approaches to next generation SiGe BiCMOS |
| 8.2.10. | Summary - RF SiGe technology |
| 8.3. | GaAs and GaN |
| 8.3.1. | Wide Bandgap Semiconductor Basics |
| 8.3.2. | GaN's opportunity in 6G |
| 8.3.3. | GaN-on-Si, SiC or Diamond for RF |
| 8.3.4. | GaN-on-Si power amplifier for 100 GHz? |
| 8.3.5. | State of the art GaN power amplifier |
| 8.3.6. | Summary of RF GaN Suppliers |
| 8.3.7. | RF GaN Fabrication Lines |
| 8.3.8. | GaAs's opportunity for 6G |
| 8.3.9. | State-of-the-art GaAs based amplifier |
| 8.3.10. | Summary of GaAs suppliers |
| 8.3.11. | GaAs vs GaN for RF Power Amplifiers |
| 8.3.12. | Power amplifier technology benchmark |
| 8.4. | InP |
| 8.4.1. | State-of-the-art InP technology |
| 8.4.2. | InP HEMT vs InP HBT |
| 8.4.3. | InP opportunities for 6G |
| 8.4.4. | Heterogenous integration of InP with SiGe BiCMOS |
| 8.4.5. | State-of-the-art InP power amplifiers - the performance and the players |
| 8.5. | Summary of semiconductors for THz communication |
| 8.5.1. | Overview of Si vs III-V semiconductors for 6G |
| 8.5.2. | Challenges regarding semiconductor for THz communications |
| 8.5.3. | Overview of transistor performance metrics of different semiconductor technologies |
| 8.5.4. | Power amplifier benchmark in beyond 200 GHz frequency band |
| 8.5.5. | Power amplifier benchmark in beyond 200 GHz frequency band (2) |
| 8.5.6. | Power amplifier technology benchmark in D band (110 GHz - 170 GHz) |
| 8.5.7. | Overview of semiconductor technology choice for THz RF |
| 8.5.8. | Summary |
| 9. | PHASE ARRAY ANTENNAS FOR 6G |
| 9.1. | Antenna types in 6G |
| 9.2. | Antenna approaches |
| 9.3. | Challenges in 6G antennas |
| 9.4. | Antenna gain vs number of arrays |
| 9.5. | Trade off between power and antenna array size |
| 9.6. | 5G phase array antenna |
| 9.7. | mmWave BFIC suppliers for 5G infrastructures |
| 9.8. | 6G 90 GHz phase array antenna - demonstration from Nokia |
| 9.9. | Technology benchmark of phase array in 28, 90, and 140 GHz. |
| 9.10. | 140 GHz phase array - transceiver analysis |
| 9.11. | 140 GHz phase array - the choice of semiconductor |
| 9.12. | Considerations when building a 140 GHz phase array |
| 10. | EXAMPLES OF STATE-OF-THE-ART D-BAND (110 - 175 GHZ) PHASE ARRAY MODULES |
| 10.1. | Samsung's latest THz prototyping wireless Platform with Adaptive Transmit and Receive Beamforming |
| 10.2. | 140 GHz THz prototype from Samsung - device architecture |
| 10.3. | 140 GHz THz prototype from Samsung and UCSB - IC and antenna fabrication details |
| 10.4. | UCSB 135 GHz MIMO hub transmitter array tile module |
| 10.5. | Mounting InP PA to the LTCC Carrier |
| 10.6. | Fully Integrated 2D Scalable TX/RX Chipset for D-Band (110 to 170GHz) Phased-Array-on-Glass Modules from Nokia |
| 10.7. | A proof-of-concept 130 GHz wireless 2x2 line-of-sight (LoS) MIMO - 1 |
| 10.8. | A proof-of-concept 130 GHz wireless 2x2 line-of-sight (LoS) MIMO - 2 |
| 10.9. | A 136-147 GHz Wafer-Scale Phased-Array Transmitter demo from UCSD - 1 |
| 10.10. | A 136-147 GHz Wafer-Scale Phased-Array Transmitter demo from UCSD - 2 |
| 10.11. | State-of-the-art D-band transmitters benchmark |
| 11. | PACKAGING TREND FOR 6G |
| 11.1. | Overview |
| 11.1.1. | Phased-array antenna module design trend for 6G generations |
| 11.1.2. | Three approaches to integrate InP on CMOS to make a >100 GHz beamforming transmitter |
| 11.1.3. | Trade-off among different integration technologies |
| 11.1.4. | Multiple transmitter coexistence for 5G and 6G RF FEM (from Skyworks Solutions) (1) |
| 11.1.5. | Multiple transmitter coexistence for 5G and 6G RF FEM (from Skyworks Solutions) (2) |
| 11.1.6. | Evolution of hardware components from 5G to 6G: antenna module design |
| 11.1.7. | Packaging challenges for freq. > 100 GHz base stations |
| 11.2. | Choices of antenna packages |
| 11.2.1. | High frequency integration and packaging trend |
| 11.2.2. | Example: Qualcomm mmWave antenna module |
| 11.2.3. | High frequency integration and packaging: Requirements and challenges |
| 11.2.4. | Three ways of mmWave antenna integration |
| 11.2.5. | Technology benchmark of antenna packaging technologies |
| 11.2.6. | AiP development trend |
| 11.2.7. | Two types of AiP structures |
| 11.2.8. | Two types of IC-embedded technology |
| 11.2.9. | Two types of IC-embedded technology - Players |
| 11.2.10. | Two types of IC-embedded technology - Players |
| 11.2.11. | University of Technology, Sydney: AME antennas in packages for 5G wireless devices |
| 11.2.12. | Additively manufactured antenna-in-package |
| 11.2.13. | Novel antenna-in-package (AiP) for mmWave systems |
| 11.2.14. | Design concept of AiP and its benefits (1) |
| 11.2.15. | Design concept of AiP and its benefits (2) |
| 11.2.16. | Stack-up AiP module on a system board |
| 11.2.17. | PCB embedding process for AiP |
| 11.2.18. | Section summary and remarks |
| 12. | LOW-LOSS MATERIALS FOR MMWAVE AND THZ |
| 12.1. | IDTechEx outlook of low-loss materials for 6G |
| 12.2. | Research approaches for 6G low-loss materials by material category |
| 12.3. | Thermoplastics for 6G: Georgia Tech |
| 12.4. | PTFE for 6G: Yonsei University, GIST |
| 12.5. | Thermosets for 6G: ITEQ Corporation, INAOE |
| 12.6. | PPE for 6G: Taiyo Ink, Georgia Institute of Technology |
| 12.7. | Silica for 6G: University of Oulu, University of Szeged |
| 12.8. | Glass for 6G: Georgia Tech |
| 12.9. | LTCC for 6G: Fraunhofer IKTS |
| 12.10. | Sustainable materials for 6G: University of Oulu |
| 12.11. | Metal interposers for 6G: Cubic-Nuvotronics |
| 12.12. | Roadmap development for low-loss materials for 6G |
| 12.13. | More info about 5G and 6G Low Loss Materials |
| 13. | 6G CELL-FREE MASSIVE MIMO |
| 13.1. | Considerations for 6G massive MIMO |
| 13.2. | Cell-free massive MIMO (Large-Scale Distributed MIMO) |
| 13.3. | Why cell-free mMIMO? |
| 13.4. | Benchmark of cellular mMIMO, network mMIMO, and cell-free mMIMO |
| 13.5. | Benefits and challenges of cell-free mMIMO implementation |
| 13.6. | An example of antenna processing unit designed for cell-free mMIMO |
| 14. | 6G NON-TERRESTRIAL NETWORKS (NTN): HAPS, LEO, GEO |
| 14.1. | 6G Non-Terrestrial networks (NTN) - An Overview |
| 14.2. | Benchmark of different types of NTN technologies |
| 14.3. | Features comparison: HAPS vs LEO vs GEO |
| 14.4. | Use cases of NTN |
| 14.5. | LEOS - Starlink |
| 14.6. | Airbus Zephyr HAPS |
| 14.7. | Apple spent $450M on SOS via LEO satellites from Globalstar for iPhone 14 models |
| 14.8. | China launches the "first 6G" test satellite into space |
| 14.9. | Huawei test non-terrestrial 6G networking using LEO satellites |
| 14.10. | South Korea's roadmap to launch LEO satellites |
| 14.11. | Overview of enabling technologies for non-terrestrial networks |
| 15. | HETEROGENEOUS SMART ELECTROMAGNETIC (EM) ENVIRONMENT |
| 15.1. | Heterogeneous smart electromagnetic (EM) environment |
| 15.2. | Overview of the main characteristics and parameters of smart EM devices |
| 16. | RECONFIGURABLE INTELLIGENT SURFACE (RIS) |
| 16.1. | Overview |
| 16.1.1. | Reconfigurable intelligent surface (RIS) for 6G |
| 16.1.2. | Reconfigurable intelligent surface (RIS) - an overview |
| 16.1.3. | RIS operation phases |
| 16.1.4. | Possible functionalities of RIS |
| 16.1.5. | Key drivers for reconfigurable intelligent surfaces |
| 16.1.6. | Challenges for fully functionalized RIS environments |
| 16.2. | Reconfigurable intelligent surface (RIS) - hardware |
| 16.2.1. | RIS Architecture |
| 16.2.2. | RIS vs traditional reflecting array antennas |
| 16.2.3. | Passive, semi-passive, and active RIS |
| 16.2.4. | Active, semi-passive, passive RIS - benchmark |
| 16.2.5. | RIS vs Relay |
| 16.2.6. | Technology benchmark of RIS with other smart EM devices |
| 16.3. | Reconfigurable intelligent surface (RIS) - applications |
| 16.3.1. | Where RIS can be used? |
| 16.3.2. | Typical RIS applications in wireless network |
| 16.3.3. | RISs can be applied in multiple locations |
| 16.3.4. | Examples of RIS prototypes |
| 16.3.5. | NANOWEB is an example of passive RIS |
| 16.3.6. | Major companies have shown interest in RIS |
| 16.3.7. | mmWave-based RIS technology for coverage challenge from ZTE |
| 16.3.8. | ZTE's RIS prototypes for outdoor coverage |
| 16.3.9. | ZTE's RIS prototypes for indoor |
| 16.3.10. | The current status of RIS |
| 16.3.11. | Huawei's 6G RIS prototype demo |
| 16.3.12. | Huawei's 6G RIS prototype demo results |
| 16.4. | RIS Forecast |
| 16.4.1. | Reconfigurable intelligent surfaces in telecommunications: Forecasts segments |
| 17. | METAMATERIALS |
| 17.1. | Metamaterials for RIS in telecommunication |
| 17.2. | Research history of metamaterials in RIS |
| 17.3. | Product segmentation: distinguishing between conductive and optical |
| 17.4. | Metamaterial tunability |
| 17.5. | Pivotal Commware: holographic beamforming in semi-active RIS |
| 17.6. | Materials and manufacturing for reconfigurable intelligent surfaces |
| 17.7. | Liquid crystal polymers (LCP) for RIS |
| 17.8. | Liquid crystal polymers (LCP) are a promising method for creating active metasurfaces |
| 17.9. | Alcan Systems develops transparent liquid crystal phased array antennas |
| 17.10. | Metamaterials in RIS: SWOT |
| 17.11. | Suitable materials for metamaterials in 5G and 6G RIS |
| 17.12. | Porter's five forces analysis of metamaterials in RIS |
| 17.13. | Multiple competing metamaterial manufacturing methods |
| 17.14. | RISE-6G investigates use of metamaterials in wireless communications |
| 17.15. | More info about Metamaterials |
| 18. | 6G USE CASES BEYOND MOBILE COMMUNICATION |
| 18.1. | 6G - an overview of key applications |
| 18.2. | Wireless cognition |
| 18.3. | THz Sensing - an overview |
| 18.4. | The principle of THz sensing and potential opportunities |
| 18.5. | Apple's patents on THz sensor for gas sensing and imaging |
| 18.6. | THz Imaging - an overview |
| 18.7. | THz sensing and imaging - examples from Terasense |
| 18.8. | THz precise positioning - an overview |
| 18.9. | Integrated Sensing and Communication (ISAC) prototype from Huawei (1) |
| 18.10. | Integrated Sensing and Communication (ISAC) prototype from Huawei (2) |
| 18.11. | Massive digital twinning for smart city |
| 18.12. | Overview of land-mobile service applications in the frequency range 275-450 GHz |
| 18.13. | Potential use cases in 275 - 450 GHz (1) |
| 18.14. | Potential use cases in 275 - 450 GHz (2) |
| 19. | MARKET FORECAST |
| 19.1. | 6G base stations market forecast |
| 19.2. | 5G base stations market forecast |
| 19.3. | More info about 5G |
| 19.4. | Reconfigurable intelligent surfaces in telecommunications: Forecasts segments |
| 20. | COMPANY PROFILES |
| 20.1. | Alcan systems |
| 20.2. | Ampleon |
| 20.3. | Atheraxon |
| 20.4. | Commscope |
| 20.5. | Ericsson (2020) |
| 20.6. | Ericsson (2021) |
| 20.7. | Freshwave |
| 20.8. | GaN Systems |
| 20.9. | Huawei |
| 20.10. | Kyocera |
| 20.11. | Metamaterials |
| 20.12. | Nokia |
| 20.13. | NXP Semiconductors |
| 20.14. | Omniflow |
| 20.15. | Picocom |
| 20.16. | Pivotal Commware |
| 20.17. | Renesas Electronics Corporation |
| 20.18. | Solvay |
| 20.19. | TMYTEK |
| 20.20. | ZTE |
| 슬라이드 | 307 |
|---|---|
| 전망 | 2043 |