전기차용 파워일렉트로닉스 시장은 2035년까지 360억 달러 규모로 성장할 것으로 전망

전기차용 파워 일렉트로닉스 기술, 주요 기업 및 시장 전망 2025-2035

Si IGBT 와 SiC MOSFET 의 공급망 분석, 자동차 GaN 기업, 인버터, 온보드 충전기(OBC), DC-DC 컨버터를 포함하여 전기차용 전력 전자제품에 대한 향후 10년간 시장 예측 및 전망을 포괄하는 보고서


모두 보기 설명 목차, 표 및 그림 목록 가격 Related Content
이번 전기차(EV)용 파워 일렉트로닉스 보고서는 EV 산업에서 와이드 밴드갭(WBG) 반도체의 동향과 응용 분야, 실리콘 카바이드(SiC)의 급속한 채택, 그리고 갈륨 나이트라이드(GaN)의 잠재력을 탐구합니다. 원자재부터 자동차 OEM에 이르기까지 기존의 Si IGBT와 혁신적인 SiC MOSFET에 대한 EV 전력 전자장치 공급망을 분석하고, 합작 투자와 협업이 빠르게 발전하고 있는 급변하는 환경에서 인버터 기술, 800V 아키텍처, 그리고 온보드 충전기(OBC) 및 DC-DC 컨버터와 같은 저전력 응용 분야를 위한 WBG의 장점을 다룹니다. 예측기간은 2024년부터 2035년까지이며, 2035년에는 시장규모가 360억 달러에 달할 것으로 예상됩니다.
이 보고서는 다음과 같은 주요 정보를 제공합니다.
 
  • 전기 자동차(EV) 전력 전자장치의 발전에 대한 인사이트: 인버터, 온보드 충전기(OBC) 및 DC-DC 컨버터
  • 와이드 밴드갭(WBG) 반도체 GaN 및 SiC의 도입
  • SiC MOSFET 및 Si IGBT용 공급망
  • 800V 아키텍처 분석 및 파워 일렉트로닉스의 통합
  • US$ 및 GW 단위의 세분화된 10년 예측
 
이 보고서에서 다루는 주요 내용/목차는 아래와 같습니다.
 
1) 핵심 요약
2) 전력 전자 개발, SiC 및 GaN
3) SiC MOSFET 공급망
4) Si IGBT 공급망
5) 자동차 분야의 GaN 기업
6) EV 파워 일렉트로닉스의 열 관리
7) 인버터, 온보드 충전기, DC-DC 컨버터의 10년 예측
 
This report provides an analysis of the power electronics market for electric vehicles, with insights regarding the adoption of SiC MOSFETs in the inverter, onboard charger, and DC-DC converter, from 200mm wafers (8 inch), to trends in automotive OEMs. GaN adoption in the automotive sector is also looked at, and potential technologies are analyzed. IDTechEx forecasts the power electronics market by voltage (600V, 1200V) and technology (Si, SiC, GaN).
 
The demand for electric vehicles (EVs) will grow rapidly over the next decade, and the EV power electronics market will grow even faster. To tackle consumer concerns about battery electric vehicles (BEVs) compared to internal combustion engines, automotive OEMs are looking for ways to increase range and speed up charging. Aside from battery and motor technologies, wide bandgap (WBG) semiconductors, silicon carbide (SiC) and gallium nitride (GaN), have the potential to revolutionize EV powertrains in displacing the incumbent silicon (Si) IGBTs and MOSFETs with 800V architectures and significant efficiency gains.
 
IDTechEx's report Power Electronics for Electric Vehicles 2025-2035 analyzes the growth potential and future trends in WBG technologies, from the rapid scaling of SiC MOSFETs to the potential of GaN to consolidate itself in the EV power electronics market. The report includes granular forecasts detailing unit sales, power (GW), and market size (US$) demand segmented by inverters, onboard chargers (OBC), and DC-DC converters by voltage (600V, 1200V) and semiconductor technology (Si, SiC, GaN).
 
IDTechEx forecasts the EV power electronics market to grow with a double-digit CAGR from 2023-2035. Source: Power Electronics for Electric Vehicles 2025-2035
 
SiC supply chain
SiC has an established supply chain from raw material to wafer, to processing technologies to device packaging. This, however, doesn't mean that there isn't room for developments in the SiC supply chain. SiC wafer supply is an area dominated by US companies, and OEMs are looking to multisource their SiC to guarantee supply and cost. The transition from 150mm to 200mm SiC wafers will significantly increase production capacity, which is vital for the automotive industry. Furthermore, there is a push to globalize the SiC supply chain, with companies in Europe and Asia scaling up wafer operations.
 
SiC MOSFETs will continue to be more expensive than Si IGBTs, despite significant reductions in prices over the past 5 years. This is due to infrastructure requirement, the much higher price of SiC wafers, and energy-intensive processing steps. IDTechEx does a cost analysis of implementing SiC MOSFETs in EVs, examining the impact at both the device and vehicle levels. Collaboration is happening across the supply chain: OEMs are borrowing EV platforms from others, device manufacturers are investigating innovative ways to increase yields, and suppliers are acquiring other companies to vertically integrate and strengthen their supply chain control. OEMs are collaborating with automotive semiconductor suppliers to get the most out of their powertrains.
 
SiC MOSFET adoption in the EV market
Si IGBTs have been the singular option for the traction inverter for 20 years, accompanied by Si MOSFETs and diodes for the onboard charger and DC-DC converter. They have proven to be reliable at the medium-high power levels for the inverter, yet current generation EVs are transitioning to SiC MOSFETs, and ramping in market share will continue to grow, with IDTechEx predicting that SiC MOSFETs will be the majority of the EV inverter market by 2035 Compared with Si IGBT, SiC MOSFETs offer several desirable features, including high temperature operation, better thermal conductivity, faster switching speeds potentially increasing EV ranges by 7%, and smaller die and general form factor for weight and volume savings. Development in SiC MOSFET technology, from packaging to trench technologies has improved massively over the past 10 years, to tackle concerns over supply chain, thermal management, and reliability. More information on the SiC MOSFETs and supply chain analysis, please refer to Power Electronics for Electric Vehicles 2025-2035.
 
SiC MOSFETs will continue to eat up market share, with 1200V MOSFETs enabling 800V architectures. Source: Power Electronics for Electric Vehicles 2025-2035
 
OBCs and DC-DC converters operate at powers an order of magnitude lower than inverters, yet the advantages of SiC MOSFET persist: higher power density, a reduction in losses, and a slight increase in range. Moreover, SiC in the OBC allows for faster charging, and in the DC-DC converter, transfers power more efficiently to the low voltage battery, making the auxiliary power-hungry devices in an EV (infotainment, heat pumps, headlights) less wasteful. This drives SiC MOSFET adoption in the OBC and DC-DC converters, and the lower power requirements mean that IDTechEx predicts GaN to enter this market earlier than for inverters.
 
GaN Technologies for Automotive
GaN HEMTs and FETs have a role in the automotive semiconductor market. The extent of this role depends on certain developments needed to maximize the potential of a material that can convert power more efficiently than SiC. Currently, most GaN devices on the market are limited to 650V and are lateral in construction. To maximize the potential of automotive GaN, steps need to be taken to make it feasible at higher voltages, especially as 800V architectures gain market share in the mainstream EV sector. Whether through improvements in engineering technology or at the device level, IDTechEx analyzes ways that GaN can realize its potential in the automotive industry. Alternatives to GaN-on-Si devices are investigated, and companies analyzed. IDTechEx's latest research Power Electronics for Electric Vehicles 2025-2035 includes a 10-year forecast of GaN in power electronics for EVs, expecting significant headway for OBCs and DC-DC converters, with inverters to come later.
 
Power Electronics Innovations
While ongoing improvements at the device level continue, OEMs and tier-one suppliers also focus on enhancing EV performance. Key questions include reducing size of the wiring and costs of the passive components, as well as understanding the most effective cooling methods? The integration of power electronics with the powertrain represents a key growth area for EVs, aiming to maximize performance while minimizing cost. IDTechEx examines available market solutions and active components in this space. The degree of integration varies widely, ranging from mechanical integration to electronic integration, with the potential to consolidate all power electronics into a single unit.
This report provides the following key information:
 
  • Insights into advances in electric vehicle (EV) power electronics: the inverter, onboard charger (OBC) and DC-DC converter
  • Adoption of wide bandgap (WBG) semiconductors GaN and SiC
  • Supply chain for SiC MOSFETs and Si IGBTs
  • Analysis of 800V architectures and integration of power electronics
  • Granular 10 year forecasts in US$ and GW
Report MetricsDetails
Historic Data2015 - 2024
CAGRThe global market for power electronics in electric vehicles will reach US$36 billion by 2035, representing a CAGR of 17% from 2025-2035.
Forecast Period2025 - 2035
Forecast UnitsUS$, GW
Regions CoveredWorldwide
Segments CoveredSiC MOSFET, Si IGBT, GaN, GaN HEMT, Inverters, Onboard Chargers, DC-DC Converters
IDTechEx의 분석가 액세스
모든 보고서 구입에는 전문가 분석가와의 최대 30분의 전화통화 시간이 포함되어, 보고서의 주요 결과를 귀하가 제시하는 비즈니스 문제에 연결하도록 돕습니다. 이 전화통화는 보고서를 구매한 후 3개월 이내에 사용해야합니다.
추가 정보
이 보고서에 대해 궁금한 점이 있으시면 언제든지 research@IDTechEx.com으로 보고서 팀에 문의하거나, 영업 관리자에게 문의하십시오

AMERICAS (USA): +1 617 577 7890
ASIA (Japan): +81 3 3216 7209
ASIA (Korea): +82 10 3896 6219
EUROPE (UK) +44 1223 812300
Table of Contents
1.EXECUTIVE SUMMARY
1.1.Report Introduction
1.2.Power Electronics in Electric Vehicles
1.3.Benchmarking Silicon, Silicon Carbide & Gallium Nitride Semiconductors
1.4.Automotive GaN Device Suppliers are Growing
1.5.GaN vs SiC potential in the Inverter
1.6.Inverter Power Density Increases Over Time
1.7.200mm SiC Wafer Production Worldwide
1.8.Vertical Integration: Acquisitions and Collaborations
1.9.SiC Impact on the Inverter Cost
1.10.Si IGBT and SiC MOSFET Price Comparison
1.11.SiC MOSFET by Automotive OEMs and Suppliers - Leading OEMs (1)
1.12.Si IGBT Suppliers to Leading OEMs (1)
1.13.SiC Drives 800V Platforms
1.14.800V charging speeds
1.15.800V Platforms SiC and Si IGBT Inverters
1.16.Integration of Power Electronics
1.17.Integrated OBC with DC-DC converter
1.18.Traction Integrated Onboard Charger
1.19.Comparison of Single-Sided Cooling and Double-Sided Cooling
1.20.Market Share of Single and Double-Sided Cooling: 2024-2034
1.21.Inverter Market Share 2022-2035: GaN 600V, Si IGBT 600V, SiC MOSFET 600V, 1200V
1.22.OBC Forecast: Si, SiC, GaN 2022-2035 (GW)
1.23.DC-DC Converter Forecast: Si, SiC, GaN 2022-2035 (GW)
1.24.Inverter, OBC, DC-DC Converter Forecast 2022-2035 (GW)
1.25.Inverter, OBC, DCDC Converter Forecast 2022-2035 (US$ billion)
2.ELECTRIC VEHICLE MARKETS: REGIONAL TRENDS AND FUTURE GROWTH
2.1.Electric Vehicle Definitions
2.2.Electric Vehicles: Typical Specs
2.3.Exponential Growth in Regional EV Markets
2.4.Regional Trends: China
2.5.Regional Trends: EU + UK + EFTA
2.6.EU Emissions and Targets
2.7.Regional Trends: US
2.8.Hybrid Car Sales Peak
2.9.Powertrain Tailpipe Emissions Comparison
2.10.Cars - Total Cost of Ownership
2.11.Chip Shortages - 2020 to 2023
2.12.Chip Shortages - Automaker Reactions
2.13.Chip Shortages - Electric Vehicles
3.OVERVIEW OF EV POWER ELECTRONICS AND WBG SEMICONDUCTORS
3.1.Introduction and Benchmarking Si, SiC and GaN
3.1.1.What is Power Electronics?
3.1.2.Power Electronics Use in Electric Vehicles
3.1.3.Transistor History & MOSFET Overview
3.1.4.Wide Bandgap (WBG) Semiconductor Advantages & Disadvantages
3.1.5.Benchmarking Silicon, Silicon Carbide & Gallium Nitride Semiconductors
3.1.6.Advantages of SiC Material
3.1.7.Si IGBT and SiC MOSFET Price Comparison
3.1.8.SiC and GaN Device Cost Comparison
3.1.9.Limitations of SiC Power Devices
3.1.10.GaN's Potential to Reach High Voltage
3.1.11.Qromis Engineered Substrate for GaN Power: QST
3.1.12.SiC & GaN have Substantial Room for Improvement
3.1.13.GaN to Become Preferred OBC Technology
3.1.14.How GaN is implemented into an OBC
3.1.15.GaN Systems' Onboard Charger
3.1.16.Challenges for GaN Devices
3.1.17.SiC Power Roadmap
3.1.18.Applications Summary for WBG Devices
3.2.GaN Companies
3.2.1.Automotive GaN Device Suppliers are Growing
3.2.2.Enhancement Mode vs Depletion Mode
3.2.3.GaN Systems
3.2.4.Texas Instruments and STMicroelectronics
3.2.5.Transphorm
3.2.6.VisIC Technologies
3.2.7.Efficient Power Conversion
3.2.8.Nexperia
3.2.9.GaN vs SiC potential in the Inverter
3.2.10.Ricardo: GaN in the Automotive Market
3.2.11.Innoscience
3.2.12.Power Integrations
3.2.13.Other GaN Companies: Qromis, QPT, BelGaN, Cambridge GaN Devices, Odyssey Semiconductor
3.3.Inverter, OBC, Converter Design & Si, SiC, GaN Outlook
3.3.1.Inverter Overview
3.3.2.Pulse Width Modulation
3.3.3.Traditional EV Inverter
3.3.4.Discretes & Modules
3.3.5.Inverter Printed Circuit Boards
3.3.6.Inverter Components and Cost
3.3.7.Electric Vehicle Inverter Benchmarking
3.3.8.Electric Vehicle Inverter Benchmarking 2
3.3.9.SiC Impact on the Inverter Package
3.3.10.Inverter Forecast 2022-2035 (GW): GaN 600V, Si IGBT 600V, SiC MOSFET 600V, 1200V
3.3.11.OBC Forecast: Si, SiC, GaN 2022-2035 (GW)
3.3.12.DC-DC Converter Forecast: Si, SiC, GaN 2022-2035 (GW)
3.3.13.Onboard Charger Circuit Components
3.3.14.Tesla Onboard Charger / DC-DC Converter
3.3.15.OBC by Level: 4kW, 6-11.5kW, 16-22kW 2023-2035
4.SIC SUBSTRATE MANUFACTURING CHAIN
4.1.Introduction
4.2.Si IGBT Production: Raw Material to EV
4.3.SiC MOSFET Production: Raw Material to EV
4.4.SiC-Specific Equipment
4.5.From 150mm to 200mm: Potential Cost Advantages
4.6.200mm Wafer Die Count Advantage
4.7.200mm SiC Wafer Production Worldwide
4.8.Vertical Integration: Acquisitions and Collaborations
4.9.Denso: Research and Development for Faster SiC Crystal Growth
4.10.Siltectra: Cold Split Technology
4.11.SmartSiC Technology from SOITEC
4.12.Summary of SmartSiC Advantages
4.13.Sumitomo Metal Mining: SiCkrest
4.14.Sumitomo Metal Mining: SiCkrest (2)
5.TRENDS IMPACTING POWER ELECTRONICS
5.1.Introduction
5.1.1.Improving the efficiency of power electronics
5.1.2.Efficiency and thermal gains, 800V
5.1.3.Examples of SiC in the automotive industry
5.2.SiC and 800V
5.2.1.SiC Drives 800V Platforms
5.2.2.800V charging speeds
5.2.3.GMC Hummer: 800V charging without 800V architecture
5.2.4.Other Split Battery Pack Vehicles: Tesla, Porsche, Ford
5.2.5.Tesla Cybertruck: Split Battery with 800V Architecture
5.2.6.Porsche Taycan: Boost Converter
5.2.7.Preh - charging technology for 800V EVs
5.2.8.400V SiC Platforms
5.2.9.800V Platforms SiC and Si IGBT Inverters
5.2.10.800V Adoption 2023
5.2.11.800V Model Announcements in China (2022-2024)
5.2.12.800V For & Against
5.2.13.DCFC Impact on Li-ion Cells
5.2.14.Fast Charge Cell Design Hierarchy - Levers to Pull
5.2.15.DC fast charging levels
5.2.16.800V Platform Discussion & Outlook
5.3.Integration of Power Electronics
5.3.1.Vitesco and Renault: High Voltage Box and One Box
5.3.2.Integrated OBC with DC-DC converter
5.3.3.Renault Zoe: 43kW AC Charging
5.3.4.Traction Integrated Onboard charger
5.3.5.Traction iOBC suppliers
5.3.6.Hyundai E-GMP: 800V, SiC and power electronics integration
5.3.7.BorgWarner: Combined Inverter and DC-DC Converter
5.3.8.Si IGBT and SiC MOSFET Price Comparison
5.3.9.SiC Diodes: Onboard Charger
5.3.10.Other Hybrid SiC Suppliers
5.3.11.SiC Diodes: Inverter
5.4.Mixing Si IGBTs and SiC MOSFETs
5.4.1.SiC Impact on the Inverter Cost
5.4.2.SiC MOSFET vs Si IGBT: Overall Vehicle Cost
6.SUPPLY CHAIN FOR POWER SEMICONDUCTOR MATERIALS, DEVICES & OEMS
6.1.SiC MOSFET and Si IGBT Suppliers
6.1.1.Automotive Power SC Supplier Market Shares
6.1.2.Supply Developments: Infineon
6.1.3.Supply Developments: STMicroelectronics
6.1.4.Supply Developments: Wolfspeed
6.1.5.Supply Developments: ROHM
6.1.6.Supply Developments: Onsemi
6.1.7.SiC MOSFET by Automotive OEMs and Suppliers - Leading OEMs
6.1.8.SiC MOSFET by Automotive OEMs and Suppliers - Emerging OEMs
6.1.9.Si IGBT Suppliers to Leading OEMs
6.1.10.Si IGBT Suppliers to Emerging OEMs
6.1.11.New SiC Fabrication Centres
6.2.Device Suppliers
6.2.1.Infineon CoolSiC Efficiency Gains
6.2.2.Infineon Establishing Major OEM Partnerships
6.2.3.ROHM Semiconductor Expands SiC Production Capacity
6.2.4.ROHM: SiC Partnerships with OEMs and Tier Ones
6.2.5.STMicroelectronics Releases ACEPACK in Race for Market Leadership
6.2.6.STMicro Portfolio for EV Power Electronics
6.2.7.Wolfspeed: Major Investment & OEM Partnerships for SiC
6.2.8.Onsemi EliteSiC
6.2.9.Navitas GeneSiC
6.2.10.Benchmarking GeneSiC and its Trench Assisted Planar Configurations
6.2.11.Qorvo
6.2.12.Qorvo SiC FET vs SiC MOSFET
6.2.13.Trench vs Planar
6.3.Tier-1 Suppliers
6.3.1.Delphi Technologies Supply Luxury Automakers with Viper SiC Module
6.3.2.BorgWarner
6.3.3.BorgWarner Integrated Drive Module for Ford
6.3.4.BorgWarner Design Wins
6.3.5.Dana
6.3.6.Vitesco
6.3.7.Vitesco Power Electronics Products
6.3.8.Equipmake
6.3.9.LG-Magna
6.3.10.Hitachi Double Sided IGBTs to Major OEM
6.3.11.Continental / Jaguar Land Rover
6.3.12.Helix CTI-4: Lotus Evija
6.3.13.McLaren IPG5-x
6.4.Automotive OEMs
6.4.1.Hyundai Diversifies SiC Supply for Best-Selling 800V E-GMP Platform
6.4.2.GM From Bolt & Volt to Ultium
6.4.3.Volvo Heavy Duty SiC Inverter
6.4.4.Mercedes In House Development
7.POWER ELECTRONICS PACKAGES: EV USE-CASES
7.1.Toyota Prius 2004-2010
7.2.2008 Lexus
7.3.Honda Accord 2014
7.4.Toyota Prius 2010-2015
7.5.Nissan Leaf 2012
7.6.Honda Fit (by Mitsubishi)
7.7.Toyota Prius 2016 Onwards
7.8.Cadillac 2016 (by Hitachi)
7.9.Chevrolet Volt 2016 (by Delphi)
7.10.BMW i3 (by Infineon)
7.11.JAC iEV4
7.12.Chinese NEV Uses Infineon
7.13.Huachen Xinri
7.14.Tesla Model X: Infineon IGBTs before SiC
7.15.800V Si IGBT Choices
7.16.Porsche Taycan
7.17.Nissan Ariya 2021
7.18.Jaguar I-PACE
7.19.Jaguar I-PACE Power Module and Cooling
7.20.Wuling Hongguang Mini EV
7.21.Danfoss
7.22.Rivian R1T
7.23.Lexus RZ
7.24.Ford F-150 Lightning
7.25.BYD Atto 3 (2022): 8-in-1 Powertrain
7.26.BMW iX3
7.27.Tesla Cybertruck
7.28.STMicro
8.THERMAL MANAGEMENT FOR EV POWER ELECTRONICS
8.1.Introduction
8.1.1.Thermal Management Strategies in Power Electronics (1)
8.1.2.Thermal Management Strategies in Power Electronics (2)
8.1.3.Transistor History & MOSFET Overview - How Does it Affect Thermal Management
8.1.4.Summary of Cooling Approaches - (1)
8.1.5.Summary of Cooling Approaches - (2)
8.2.TIM1 and TIM2 in power electrics
8.2.1.Where are TIMs used in EV Power Electronics
8.2.2.TIM1 in Flip Chip Packaging
8.2.3.Solders as TIM1
8.2.4.Solder Options and Current Die Attach
8.2.5.Die-Attach Solution - Thermal Conductivity Comparison
8.2.6.Trend Towards Sintering
8.2.7.Silver Sintering Paste
8.2.8.Suppliers of metal sintering pastes
8.2.9.Properties and performance of solder alloys and sintered pastes
8.2.10.TIM2 - IDTechEx's Analysis on Promising TIM2
8.2.11.Yearly Market Size of TIMs Forecast (US$ Millions): 2024-2034
8.3.Liquid cooling - single and double sided
8.3.1.Single side, dual side, in-direct, and direct cooling
8.3.2.Key Summary of Single-Sided Cooling
8.3.3.Benefits and Drawbacks of Single-Sided Cooling
8.3.4.TIM2 Area Largely Similar for Single-Sided Cooling
8.3.5.onsemi - EliteSiC Power Module
8.3.6.ST Microelectronics - Tesla Model 3
8.3.7.Key Summary of Double-Sided Cooling (DSC)
8.3.8.Double-Sided Cooling Introduction
8.3.9.Double-Sided cooling examples
8.3.10.The Need for Double-Sided Cooling in Power Modules
8.3.11.Infineon's HybridPACK DSC
8.3.12.Inner Structure of HybridPACK DSC
8.3.13.onsemi - VE-Trac Family modules
8.3.14.CRRC
8.3.15.Hitachi Inverter - Double-Sided Cooling
8.3.16.Trend Towards Double-Sided Cooling for Automotive Applications
8.3.17.Transition to Double-Sided Liquid Cooling
8.3.18.Market Share of Single and Double-Sided Cooling: 2024-2034
9.FORECASTS
9.1.Exponential Growth in Regional EV Markets
9.2.Methodology
9.3.Inverters per Car Forecast 2022-2035
9.4.Inverters per Car: Regional
9.5.Multiple Motors / Inverters per Vehicle
9.6.Inverter Forecast 2022-2035 (GW): GaN 600V, Si IGBT 600V, SiC MOSFET 600V, 1200V
9.7.Inverter Market Share 2022-2035: GaN 600V, Si IGBT 600V, SiC MOSFET 600V, 1200V
9.8.Inverter Cooling Strategy Forecast (Units)
9.9.Discretes vs Power Modules Forecast for Inverters 2022-2035
9.10.OBC Forecast: Si, SiC, GaN 2022-2035 (GW)
9.11.DC-DC Converter Forecast: Si, SiC, GaN 2022-2035 (GW)
9.12.Inverter, OBC, DC-DC Converter Forecast 2022-2035 (GW)
9.13.Inverter, OBC, DC-DC Converter Unit Sales Forecast 2022-2035
9.14.Inverter, OBC, DC-DC Converter Forecast 2022-2035 (US$ billion)
9.15.OBC by Level: 4kW, 6-11.5kW, 16-22kW 2023-2035
9.16.Inverter, OBC & Converter, Si, SiC, GaN Cost Assumptions (US$ per kW)
10.COMPANY PROFILES
10.1.Advanced Electric Machines Ltd
10.2.Arteco: EV-Specific Water-Glycol Coolants
10.3.BMW
10.4.BYD Auto
10.5.Diamond Foundry: Electric Vehicle Inverters
10.6.Dynex Semiconductor (CRRC): EV Power Electronics
10.7.Efficient Power Conversion: GaN FETs
10.8.Efficient Power Conversion: GaN in Automotive
10.9.Elaphe: In-wheel Motors to Increase Drive Cycle Efficiency
10.10.Equipmake: Electric Motors and Power Electronics
10.11.GaN Systems
10.12.General Motors (2020)
10.13.Heraeus: Solutions for EV Power Electronics
10.14.Hyundai: E-GMP 800V Platform Success
10.15.Infineon: 750V SiC MOSFETs for Onboard Chargers
10.16.Infineon: Automotive Power Electronics
10.17.Infineon: Expanding SiC OEM Partnerships
10.18.Integral e-Drive
10.19.Lotus
10.20.Lucid Motors
10.21.Magna International
10.22.McLaren Automotive
10.23.Nexperia: GaN for EV Power Electronics
10.24.NXP Semiconductors
10.25.QPT: MHz Switching, Active Cooling GaN
10.26.Rivian: Electric Passenger Trucks
10.27.ROHM Semiconductor: Supplying Lucid Motors
10.28.STMicroelectronics: SiC Advantages and Supply Chain
10.29.Transphorm
10.30.Valeo (48V Powertrain)
10.31.Wolfspeed
10.32.Wolfspeed: Major SiC Supply Deals
 

Ordering Information

전기차용 파워 일렉트로닉스 기술, 주요 기업 및 시장 전망 2025-2035

£$¥
전자 (사용자 1-5명)
£5,650.00
전자 (사용자 6-10명)
£8,050.00
전자 및 1 하드 카피 (사용자 1-5명)
£6,450.00
전자 및 1 하드 카피 (사용자 6-10명)
£8,850.00
전자 (사용자 1-5명)
€6,400.00
전자 (사용자 6-10명)
€9,100.00
전자 및 1 하드 카피 (사용자 1-5명)
€7,310.00
전자 및 1 하드 카피 (사용자 6-10명)
€10,010.00
전자 (사용자 1-5명)
$7,000.00
전자 (사용자 6-10명)
$10,000.00
전자 및 1 하드 카피 (사용자 1-5명)
$7,975.00
전자 및 1 하드 카피 (사용자 6-10명)
$10,975.00
전자 (사용자 1-5명)
元50,000.00
전자 (사용자 6-10명)
元72,000.00
전자 및 1 하드 카피 (사용자 1-5명)
元58,000.00
전자 및 1 하드 카피 (사용자 6-10명)
元80,000.00
전자 (사용자 1-5명)
¥990,000
전자 (사용자 6-10명)
¥1,406,000
전자 및 1 하드 카피 (사용자 1-5명)
¥1,140,000
전자 및 1 하드 카피 (사용자 6-10명)
¥1,556,000
Click here to enquire about additional licenses.
If you are a reseller/distributor please contact us before ordering.
お問合せ、見積および請求書が必要な方はm.murakoshi@idtechex.com までご連絡ください。

보고서 통계

슬라이드 286
Companies 32
전망 2035
게시 Jun 2024
ISBN 9781835700426
 

콘텐츠 미리보기

pdf Document Webinar Slides
pdf Document Sample pages
 
 
 
 

Subscription Enquiry