15 Jan 2023
CondAlign is an early-stage Norwegian company that is about to commercially launch its field-aligned anisotropic electrically conductive adhesive film. This enables low temperature component attachment with pitches as fine as 25 um. IDTechEx caught up with Moreton Lindberget, VP of Sales and Marketing.
23 Mar 2021
Electrically Conductive Adhesives in Wearable Electronic Applications
Investigating the fields of Component and Electrode Attachments in the Wearables Industry
8 Mar 2021
Where are the Innovations in Thermal Interface Materials
Thermal management is one of the most important topics in a wide range of applications; from electric vehicle battery packs through to consumer electronics, there is a pressing need to dissipate heat efficiently. Thermal interface materials (TIM) come in numerous types and play a crucial role in the thermal transfer from a heat source. This article looks at what the major innovations are for these materials and why those developments are significant.
12 Aug 2020
CondAlign has developed a technology for making anisotropic conductive films, in which electrically and/or thermally conductive particles are aligned by applying an electric field during film manufacture.
8 Oct 2019
CondAlign have developed a material agnostic process for aligning additives in polymeric resins. IDTechEx interviewed Guttorm Osborg (CEO), Dr Henrik Hemmen (CTO), and Morten Lindberget (VP Business Development and Sales). This profile will give a focus on their work for TIM developments.
13 Dec 2018
Technology for making anisotropic conductive films by CondAlign
New enabling alignment technology ready for the market. Potential applications in Medical Technology, Display Technology and Thermal Interface Materials. Raghu Das from IDTechEx interviews CTO Dr. Hemmen about the status of the technology, customer value and market.
3 Dec 2012
Electric field alignment of nanoparticles from CondAlign
Norwegian based company CondAlign has developed an electric field control technology which allows the rapid alignment of conductive nanoparticles.