3D 적층 전자의 신흥 기술 및 새로운 응용분야

The progression of additively manufactured electronics from 2D multilayer towards 3D printed electronics enables electronics to become increasingly integrated within devices rather than inserted as a separate component. Key drivers of adopting 3D and additive electronics manufacturing include mass customisation, integration of electronic functionality, and simplification of the manufacturing and assembly process.
 
However, the market adoption for these 3D electronics manufacturing technologies has been relatively slow. To gain a thorough understanding of the technologies, their challenges, and the market opportunities of 3D/additive electronics, this webinar will address each of the three main approaches: applying electronics to a 3D surface, in-mold electronics, and fully printed 3D electronics.
 
This webinar will include:
  • An overview of 3D electronics including electronics on 3D surfaces, in-mold electronics and fully additive electronics
  • Technology benchmarking on conventional and emerging metallization methods
  • Discussion of the status, challenges and opportunities across the whole 3D electronics industry
  • Market opportunities and outlook
 
This webinar shares some of the research from the new IDTechEx report, "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets".

Presenter

Dr Zixin Wang
Dr Zixin Wang
Technology Analyst
IDTechEx