Background
7 Jun 2020

Henkel
Henkel offers sintered die attach pastes. This is predominantly a nano ink but includes micro-sized particles too.
Youtube
18 Feb 2016

Interview with Henkel at the IDTechEx Printed Electronics USA Event
Video interview with Henkel at the IDTechEx Printed Electronics USA Event.
External press release
6 Aug 2008

Henkel's Wafer Backside Coating revolutionizes die attach processes
Utilizing the proven materials deposition techniques of stencil printing, screen printing and spin coating, Henkel's WBC solution allows packaging specialists to efficiently coat the back of wafers with die attach materials down to 20 microns in thickness.