18 Feb 2016
Interview with Henkel at the IDTechEx Printed Electronics USA Event
Video interview with Henkel at the IDTechEx Printed Electronics USA Event.
6 Aug 2008
Henkel's Wafer Backside Coating revolutionizes die attach processes
Utilizing the proven materials deposition techniques of stencil printing, screen printing and spin coating, Henkel's WBC solution allows packaging specialists to efficiently coat the back of wafers with die attach materials down to 20 microns in thickness.