RFMOD
RFMOD
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RFMOD Technology and IP is designed to underpin disruptive RF products with unprecedented levels of functionality, performance, value and size
RFMOD is now offering its patented semiconductor packaging portfolio to industrial partners through its licensed partner programme.
RFMOD Design Service leverages tried and tested practice in Chip, Package, System co-design to create potent solutions for high volume, small size, cost critical markets such as Mobile, "Wearables" and the "Internet of Things IoT"
With 25 years' experience in RF/Mixed signal and High-speed Digital package design and with an in-depth knowledge of semiconductor and package manufacturing processes RFMOD can help your project through the critical phases of development. From Chip-floor-planning to mask, from Multi-Project wafer test-chip to prototype and onto full production.
RFMOD is delighted to announce BeanIoT™ at the show
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2016
28 Apr 2016
RFMOD, United Kingdom
2015
29 Apr 2015
Announcing BeanIoT™ - Defining Form, Fit and Function of IoT Leaf-Nodes
RFMOD, United Kingdom
1 Apr 2015
Wearable, automotive and IoT drive sensor growth at IDTechEx Show!
The last decade has seen the cost of sensors fall to an average sales price of 50 cents from several dollars, driven first by the increase in sensors for automotive followed by consumer electronics such as smart phones. The next phase of volume growth will be driven by wearable technology, IoT and driver assisted/autonomous vehicles. This is also driving work on new types of sensors, such as flexible, larger area ones.