RFMOD Technology and IP is designed to underpin disruptive RF products with unprecedented levels of functionality, performance, value and size
RFMOD is now offering its patented semiconductor packaging portfolio to industrial partners through its licensed partner programme.
RFMOD Design Service leverages tried and tested practice in Chip, Package, System co-design to create potent solutions for high volume, small size, cost critical markets such as Mobile, "Wearables" and the "Internet of Things IoT"
With 25 years' experience in RF/Mixed signal and High-speed Digital package design and with an in-depth knowledge of semiconductor and package manufacturing processes RFMOD can help your project through the critical phases of development. From Chip-floor-planning to mask, from Multi-Project wafer test-chip to prototype and onto full production.
RFMOD is delighted to announce BeanIoT™ at the show