2.5D Packaging Process Flow Know-How

This premium article aims to offer a comprehensive perspective on the fabrication processes involved in 2.5D packaging, which includes high-density fanout, Si bridge, and Si interposer technologies. Additionally, it addresses the growing emphasis on research and development (R&D) efforts to replace silicon (Si) with organic materials. A certain portion of the article is dedicated to discussing the emerging trend of fan-out packaging and the persistent challenges that need to be overcome in this field.