2024-2034年5G和6G封装天线（AiP）：技术、趋势和市场
IDTechEx最新发布的报告《2024-2034年5G和6G封装天线（AiP）：技术、趋势、市场》对5G和6G毫米波的AiP技术进行了详尽深入的研究。该报告重点关注各类基板和封装方法。此外还探讨了100 GHz以上的天线集成应用，并通过多项案例研究展示如何解决行业挑战。基于IDTechEx的专业知识，该报告为未来几代无线技术的天线封装发展前景提供了宝贵的见解。
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