Direct Write of Multifunctional Materials and Devices in UTC Products
Grand Ballroom G
11:55 - 12:20
There is an increasing interest in fabricating low-cost sensors and electronic components for distributed networks of physical objects, represented as the Internet of Things (IoT). As a result, traditional printing methods are being adapted to enable creation of functional devices in a wide variety of materials. UTRC is exploring advanced 'direct write' fabrication methods for aerospace and commercial/industrial applications, and this presentation will provide an overview of representative demonstration examples.
Speaker Biography (Marcin Piech)
Dr. Marcin Piech, Staff Engineer for the Applied Physics Group, Dr. Piech has spent the past 10 years at UTRC working on many interdisciplinary projects including fabrication of a compact ionization source, optical smoke detector modeling, solar-blind UV flame sensor, and recently, incorporation of printed electronics solutions into UTC applications. He has experience in areas including chemistry, soft-matter physics, colloidal engineering, nanoparticle synthesis, gas, flame and chemical detection. Dr. Piech received B.S. degrees in Chemistry and Mathematics from Bates College in Lewiston, ME, and earned a Ph.D. degree in Chemical Engineering from Yale University in New Haven, CT. He has additional post-doctoral experience in nanomaterials synthesis, functionalization and characterization from Sandia Laboratories in Albuquerque, NM.
Company Profile (United Technologies Research Center)
United Technologies Research Center (UTRC), the corporate research center for United Technologies Corporation, is headquartered in East Hartford, CT. UTRC plays a key role as the corporation's innovation engine, focusing on advanced technologies. The center employs approximately 600 research scientists, engineers, and support staff (85% of technical staff have advanced degrees). UTRC performs basic, applied and exploratory research in a broad spectrum of technologies including chemical sciences, fluid mechanics, electronics materials and structures, information technology, and systems technology. The center has component and system level modeling tools, material development laboratories, fabrication and characterization laboratories, and combustion test facilities for component and prototype system testing.