全体概要および結論では、開発計画と展開予定ならびに当該技術の基本事項について説明しています。これには批判的分析、比較検証表、ロードマップ 2021-2041年、RIS 見通し 2021-2041年が盛り込まれています。補完的見通し。

 

第2章のイントロダクションは、6Gの背景、進捗およびトレンドならびに再プログラム可能インテリジェント・サーフェスが6Gの成功にとって必須のものであるかを説明しています。

 

第3章は、6Gにとって必須となるメタマテリアルならびにメタサーフェスと呼ばれる2Dバージョンを扱っています。セミパッシブ・バージョン（ほとんど電気不要）がもっとも重要である理由をご確認ください。

 

第4章『再構成可能インテリジェント・サーフェス』は完成されたデバイスを紹介します。それらはトラック、屋内壁面、屋根などの多層薄膜となります。進捗と可能性そして6G RIS によりスマートシティがどのようなものとなるかに関する最新の分析をご覧ください。 RIS 開発メーカーとプログラムの把握。プリンテッドと薄膜エレクトロニクスそしてテラヘルツ対応デバイスの市場機会をご確認ください。

 

第5章は、6G RIS を対象とするプリンテッド技術と薄膜技術の選択肢を紹介しています。メタサーフェス、薄膜デバイスおよび必要とされる連結装置を対象とする微細金属パターン形成技術も取り扱っています。

 

第6章は、必要とされる絶縁体およびポリマーを網羅しています。例えば、一部のメタサーフェスは液晶ポリマーを採用しており、それらは5G向けの低誘電損失材料から得た教訓によるものです。

 

6G Communications will be a dead duck if it cannot deploy smart surfaces everywhere to deliver the tricky far-infrared signals necessary to hugely advance smartphones, entertainment, medicine, Internet of Things, ICT. Yet nothing has been done to appraise the mass production, costing, volume technologies and timelines of those surfaces or to forecast the commercial opportunity. The new IDTechEx report, "6G Communications Reconfigurable Intelligent Surfaces Roadmap, Materials, Market 2021-2045" puts that right. Call them RIS.

 

6G is the sixth generation of wireless mobile technology. It is sometimes called 6G Networks because the ambitions of those researching and funding the subject go far beyond improved radio telephony. Researchers promise the terahertz beams will charge your phone, work unpowered devices, position to better that one centimeter and sense everything everywhere but what is affordable and practicable and when? Research with clunky parts like copper sheet, printed circuit boards and conventional components give no visibility on this. It sits awkwardly with Samsung and others promising mass deployment in 2030.

 

There is some skepticism because 2021 sees 5G engaging only slowly. IDTechEx wrote the definitive reports on 5G materials and commercialisation. With 6G, the implications for computing, networks and even global energy consumption become considerable when a radically different approach to hardware is forced upon us. The power, performance, size and space constraints make it essential that the new reconfigurable metasurfaces succeed in what will be their first mass application. Get it right and a trillion-dollar new industry awaits. Printed and flexible electronics is key, giving that industry and the advanced materials industry a multi-billion dollar opportunity.

 

At 205 information-packed pages, this is a drill-down report from the IDTechEx overview report, "6G Communications Markets, Devices, Materials 2021-2041". The IDTechEx report, "6G Communications Reconfigurable Intelligent Surfaces Roadmap, Materials, Market 2021-2045" is prepared by our PhD-level, multilingual researchers across the world. Its focus is commercialisation and benefits to society presented in a manner easily understood by those not steeped in the subject. No equations but a host of research papers appraised and referenced for those wishing to go deeper. Many new infograms, graphs and photographs derive from global interviews, conferences and analysis over many years but particularly 2021. IDTechEx has led market and science analysis of the enabling technologies for 21 years, including consultancy for the big names.

 

The report answers questions such as:

 

The 35 page Executive Summary and Conclusions is sufficient for those in a hurry seeking the promises, the basics, critical analysis, comparison tables, roadmap, RIS and backup forecasts. The 24 page Introduction is a light-hearted presentation in everyday language and images but getting over a great deal of vital information. It is an antidote to the appalling mathematical obscurity of most that has been published so far, with even RIS described by an increasing, large number of long words for the same thing. The rest of the report has to go into more detail but this is eased by a comprehensive glossary at the start of the report.

 

The 21 page Chapter 3 is on metamaterials and their 2D version called metasurfaces that are so essential for 6G, particularly the semi-passive versions. How do they work? What are the pros and cons of ever more advanced versions for possible use in 6G? Who has achieved what and where? What are the typical patterns and drivers?

 

The 45 page Chapter 4 Reconfigurable Intelligent Surfaces takes you into the complete devices - multilayer thin films on trucks, indoor walls, roofing and more. We summarise recent appraisals of progress and possibilities from a host of referenced researchers, adding our own expert opinions and predictions. We add our new ideas such as providing the power by a photovoltaics overlayer, how to print the active devices, what a smart city looks like with 6G, identifying companies involved that can incorporate RIS in their hardware. Learn why other technologies can redirect and enhance emissions but not meet the 6G requirements in shape and cost. Nowhere near. The RIS developers and programs are identified. Discussion is in the context of relevant progress with printed and thin film electronics, 5G and terahertz devices generally.

 

Chapter 5 uses 45 pages for a deep dive into the candidate technologies for the vital fine metal patterning for both metasurfaces, thin film devices and interconnects involved. It starts will illustrations of many metasurfaces and their patterning needs. Many companies and their capabilities are profiled. IDTechEx has drill down reports on these technologies and companies for those seeking even more.

 

The 23 page Chapter 6 covers dielectrics and polymers needed. For example some metasurfaces employ liquid crystal polymers and there are lessons from low loss materials for 5G, the subject of another IDTechEx report.

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