チップレット技術：半導体設計と集積に革命をもたらす
This webinar explores the innovative world of chiplet technology, examining its role in transforming semiconductor design and integration. It provides a comparison with traditional System-on-Chip (SoC) and System-in-Package (SiP) technologies, introduces the concept of heterogeneous integration, and discusses the drivers, advantages, challenges, and future insights related to chiplets.
Key points covered in the presentation:
- Definition and significance of chiplets in modern semiconductor design
- Comparison with SoC and SiP technologies
- Introduction to heterogeneous integration
- Drivers and advantages of adopting chiplet technology
- Brief overview of challenges in implementing chiplets
- Insights into the future potential and impact of chiplet technology
This webinar shares some of the research from the new IDTechEx report, "Chiplet Technology 2025-2035: Technology, Opportunities, Applications".
Presenter
Video
Report
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