Cisco

Cisco

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Cisco (NASDAQ: CSCO) is the worldwide technology leader that has been making the Internet work since 1984. Our people, products and partners help society securely connect and seize tomorrow's digital opportunity today. Discover more at newsroom.cisco.com and follow us on Twitter at @Cisco.
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2025
10 Jun 2025

Groq

Groq is a California-based fabless chip designer that focuses on designing chips for developers and enterprises to deliver AI inference. Groq is known for designing the Language Processing Unit (LPU), a novel architecture purpose-built to accelerate AI inference.
24 Apr 2025

AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts

IDTechEx Report: Jameel Rogers
15 Apr 2025

NVIDIA: Telecommunications

NVIDIA is a global leader in artificial intelligence (AI) and accelerated computing that is becoming an important technology partner in the telecommunications industry. While it does not provide traditional network equipment, NVIDIA supports telecom operators through AI infrastructure, automation tools, and simulation technologies that enable more efficient, software-defined networks. This company profile explores NVIDIA's position, partnerships, and activities within the telecom space.
9 Apr 2025

The Packaging Technologies Behind NVIDIA's 3D-Stacked CPO

At GTC 2025, NVIDIA announced two new networking switch platforms - Spectrum-X Photonics and Quantum-X Photonics - based on Co-Packaged Optics (CPO) technology. Both platforms incorporate TSMC's 3D hybrid bonding technology for its CPO, and these will be the world's first 3D-stacked silicon photonics engine.
27 Jan 2025

Silicon Photonics and Photonic Integrated Circuits 2025-2035: Technologies, Market, Forecasts

IDTechEx Report: Dr Yu-Han Chang
6 Jan 2025

Google: Optical Circuit Switches and Data Center Fabrics

At Microtech Ventures' 2024 Microfab Summit Dr. Kevin Yasumura, Principal Engineer and Technical Lead for MEMS and Optical Switching Development at Google, spoke about the tech giant's Lightwave Fabric architecture for data centers. This talk focused on Google's optical circuit switches and its role in this architecture.
2024
13 Dec 2024

Hardware for HPC, Data Centers, and AI 2025-2035: Technologies, Markets, Forecasts

IDTechEx Report: Dr Shababa Selim, Dr Yu-Han Chang, Jameel Rogers and Yulin Wang
23 Oct 2024

Materials and Processing for Advanced Semiconductor Packaging 2025-2035: Technologies, Players, Forecasts

IDTechEx Report: Dr Yu-Han Chang
17 Oct 2024

Advanced Semiconductor Packaging 2025-2035: Forecasts, Technologies, Applications

IDTechEx Report: Dr Yu-Han Chang
16 Oct 2024

Sensor Market 2025-2035: Technologies, Trends, Players, Forecasts

IDTechEx Report: Dr Tess Skyrme, Dr Jack Howley, Dr Xiaoxi He, Dr Conor O'Brien, Yulin Wang and John Li
15 Oct 2024

University of Washington: Vikram Iyer Group

IDTechEx spoke to Vikram Iyer, Assistant Professor at the University of Washington. His research group has developed a new printed circuit board, which enables recycling of both circuit components and the circuit substrate.
11 Oct 2024

Chiplet Technology 2025-2035: Technology, Opportunities, Applications

IDTechEx Report: Dr Xiaoxi He and Dr Yu-Han Chang
26 Sep 2024

Thermal Management for Data Centers 2025-2035: Technologies, Markets, and Opportunities

IDTechEx Report: Yulin Wang and Dr James Edmondson
22 Aug 2024

Co-Packaged Optics (CPO): Evaluating Different Packaging Technologies

The rise of co-packaged optics is transforming modern data centers and high-performance networks by addressing critical challenges such as bandwidth density, energy efficiency, and scalability. CPO enhances interconnect bandwidth and energy efficiency by integrating optics and electronics within a single package, significantly shortening electrical link lengths.
23 Jul 2024

Co-Packaged Optics (CPO) Market Outlook & Packaging Technology Trends

Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64x400 Gbps or 32x800 Gbps pluggable optical transceiver modules. However, these high-speed modules, within their current form factors, pose significant challenges. Issues include the required densities of electrical and optical connectors, as well as escalating power consumption.
10 Jul 2024

Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts

IDTechEx Report: Dr Yu-Han Chang
16 May 2024

Thermal Interface Materials 2024-2034: Technologies, Markets, and Forecasts

IDTechEx Report: Yulin Wang and Dr James Edmondson
7 May 2024

PIC-Based Transceivers Roadmap

Innovation map for photonic integrated circuits-based (PIC-based) transceivers.
21 Feb 2024

nu quantum

nu quantum is a spin-out from the University of Cambridge 'building the entanglement fabric essential to scaling quantum computers'.
10 Jan 2024

Quantum Communication Market 2024-2034: Technology, Trends, Players, Forecasts

IDTechEx Report: Dr Tess Skyrme