Market and Technology Trends in Advanced Semiconductor Packaging

Today, data is exploding at every level and in almost every industry. Machine learning and AI are crucial data enablers in a wide range of applications, including data centres, 5G, and autonomous cars. To operate these programmes, a powerful processor is necessary, with an integrated circuit (IC) made on Si serving as the basis.

 

For decades, IC design house would build a chip with all functionalities integrated on a single die; however, as Moore's law slows (chip density are no longer doubling every two years), scaling monolithic IC becomes increasingly complex and costly. This forces IC manufacturers to pursue "advanced semiconductor packaging technologies". In comparison to conventional packaging technologies, advanced semiconductor packaging technologies, such as 2.5DIC and 3DIC, promises higher chip connection and lower power consumption, enabling the IC vendor to continue to supply high performance chips at a reasonable price.

 

In this webinar, Dr. Yu-Han Chang will present IDTechEx's latest data and prospects for the advanced semiconductor packaging industry, which will include research from IDTechEx's latest market research study "Advanced Semiconductor Packaging 2023-2033".

 

This webinar will provide an overview of the current state of the advanced semiconductor packaging industry. The contents include: