2024年-2034年3D电子/增材电子：技术、企业参与者和市场
IDTechEx的这份报告旨在评估那些能够使集成电子取代PCB的竞争性技术。它涵盖在3D表面添加电子的新技术（LDS、气溶胶技术、阀门喷射/分配技术、LIFT工艺和新兴技术）、模内电子（IME）和3D全打印电子技术、材料和应用。此外，报告还提供了29条市场预测线，介绍了30多家相关企业，并对它们的准备水平进行了评估，深入剖析了当前面临的技术挑战与潜在机遇。通过这份报告，我们可以对新兴的3D/增材电子领域获得清晰而深入的了解。
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