2025年-2035年半导体先进封装的材料和工艺：技术、参与者、预测
该综合报告深度融合了IDTechEx在该领域的专业知识与丰富经验，在半导体先进封装领域所用材料及工艺方面提供了有价值的洞见。该报告探讨了关键的技术发展潮流，如2.5D封装工艺流程及应用于3D封装的新型铜-铜混合键合技术。此外，该报告对有机电介质在先进半导体封装模块中的未来十年市场趋势进行了详尽预测，并分析了单位及面积指标的变动趋势。
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