Automotive industry, logistics, home-use, key players and suppliers, AI chip, battery, actuator, motor, screw, tactile sensor, camera, bearing, LiDAR, PEEK materials, cost analysis of components, 10-year volume and market size forecast
Ten-year forecasts of edge AI chips for different applications: automotive, consumer electronics, humanoid robots, predictive maintenance. Supply chain analysis, including CPUs, NPUs, GPUs. Autonomous driving, intelligent cockpits, AI smartphones, AI PCs.
20-year forecasts for materials opportunities in quantum computing, quantum sensing, and quantum communications. Technologies, key players, supply chain dynamics for superconductors, photonics, PICs, nanomaterials, and diamond for quantum applications.
Granular 10-year forecasts on BESS for data centers and C&I applications. Analyses on players, key projects, applications, battery storage technology trends & benchmarking, LFP Li-ion costs & manufacturing. Insights from dozens of primary interviews.
Global sensor market including future mobility, LiDAR, radar, cameras, IR; MEMS, wearables; AI, edge sensors; quantum sensors; printed sensors; gas sensors; battery sensors; silicon photonics, image sensors, with 10-year granular sensor market forecast
Low-loss materials for 5G, 6G, automotive radars, high-speed digital, with market assessment, player overview, trends, detailed benchmarks, and forecasts.
Granular ten-year forecast for data center cooling technologies and components, including air cooling, single-phase/two-phase D2C/immersion cooling and their associated components. Comprehensive analysis of TIM2 for data center components.
Market for secondary source critical material extraction technology, critical material recovery technology, rare earth recycling, lithium-ion battery technology metal recovery, critical semiconductor recovery, platinum group metal recovery
Glass in semiconductors technology benchmarks & analysis, supply-chain deep dive, market forecasts across carrier, panel, IC-substrate, interposer, IPD, RF-MEMS & photonic glass segments, challenges, opportunities and adoption outlook
Key players, technologies, applications, materials, and 20-year granular quantum sensor market forecasts for: atomic clocks, quantum magnetic field sensors, gravimeters, gyroscopes, accelerometers, quantum RF, and single photon detectors.
Material demand, benchmarking, market trends, TIM1/TIM1.5/TIM2, TIMs in 5G, EV batteries and power electronics, semiconductor packaging, space/satellite, data centers, ADAS, consumer electronics, TIM fillers, 10-year forecast by industry.
The complete analysis of the global RFID industry.
Autonomous consumer cars by SAE level (L1, L2, L2+, L3, L4), Level 4 driverless robotaxis, commercial robotaxi services, autonomous driving rules and regulations, autonomous driving software, ADAS software
20 year forecasts for quantum computing: superconducting, photonic, silicon spin, neutral atom, trapped ion, diamond defect, annealers, topological qubits. Infrastructure, applications, and materials for quantum computing, quantum and AI.
SDVs, Connected and Autonomous Vehicles (CAVs), In-Car AI Assistants, V2X, Autonomy as a Service, Connected Vehicles, E/E Architecture, Intelligent Transportation Systems (ITS-G5), DSRC, C-V2X, Features as a Service, ADAS
Ten-year TIM1/TIM1.5 forecast for advanced semiconductor packaging (ASP) split by graphene, liquid metal, thermal gel, and indium foil. 10-year forecast for microfluidic cooling. Detailed analysis on thermal and power management for ASP.
Emerging MEMS innovations in inertial sensing, gravimetry, and speaker technology. Granular 10-year market forecasts with player coverage, performance benchmarking, and competing technologies.
在材料科学领域，以数据为中心的设计和发现方法。在数据基础设施、机器学习和人工智能方面取得显著进展。参与者简介、技术进步、市场前景、战略方法。
图形处理单元（GPUs）、中央处理单元（CPUs）、定制化AI专用集成电路（ASIC）及其他各类AI加速器，以及参与者分析、技术、趋势、供应链以及预测分析等。
10年详细预测及市场规模评估——本报告涉及HBM、QLC固态硬盘、下一代硬盘（HAMR、MAMR）以及用于AI、HPC、数据中心、云、边缘、物联网和嵌入式应用程序的新兴存储器（MRAM、RRAM、FeRAM、PCM）的发展。