Automotive industry, logistics, home-use, key players and suppliers, AI chip, battery, actuator, motor, screw, tactile sensor, camera, bearing, LiDAR, PEEK materials, cost analysis of components, 10-year volume and market size forecast
Ten-year forecasts of edge AI chips for different applications: automotive, consumer electronics, humanoid robots, predictive maintenance. Supply chain analysis, including CPUs, NPUs, GPUs. Autonomous driving, intelligent cockpits, AI smartphones, AI PCs.
20-year forecasts for materials opportunities in quantum computing, quantum sensing, and quantum communications. Technologies, key players, supply chain dynamics for superconductors, photonics, PICs, nanomaterials, and diamond for quantum applications.
Granular 10-year forecasts on BESS for data centers and C&I applications. Analyses on players, key projects, applications, battery storage technology trends & benchmarking, LFP Li-ion costs & manufacturing. Insights from dozens of primary interviews.
Global sensor market including future mobility, LiDAR, radar, cameras, IR; MEMS, wearables; AI, edge sensors; quantum sensors; printed sensors; gas sensors; battery sensors; silicon photonics, image sensors, with 10-year granular sensor market forecast
Low-loss materials for 5G, 6G, automotive radars, high-speed digital, with market assessment, player overview, trends, detailed benchmarks, and forecasts.
Granular ten-year forecast for data center cooling technologies and components, including air cooling, single-phase/two-phase D2C/immersion cooling and their associated components. Comprehensive analysis of TIM2 for data center components.
Market for secondary source critical material extraction technology, critical material recovery technology, rare earth recycling, lithium-ion battery technology metal recovery, critical semiconductor recovery, platinum group metal recovery
Glass in semiconductors technology benchmarks & analysis, supply-chain deep dive, market forecasts across carrier, panel, IC-substrate, interposer, IPD, RF-MEMS & photonic glass segments, challenges, opportunities and adoption outlook
Key players, technologies, applications, materials, and 20-year granular quantum sensor market forecasts for: atomic clocks, quantum magnetic field sensors, gravimeters, gyroscopes, accelerometers, quantum RF, and single photon detectors.
Material demand, benchmarking, market trends, TIM1/TIM1.5/TIM2, TIMs in 5G, EV batteries and power electronics, semiconductor packaging, space/satellite, data centers, ADAS, consumer electronics, TIM fillers, 10-year forecast by industry.
The complete analysis of the global RFID industry.
Autonomous consumer cars by SAE level (L1, L2, L2+, L3, L4), Level 4 driverless robotaxis, commercial robotaxi services, autonomous driving rules and regulations, autonomous driving software, ADAS software
20 year forecasts for quantum computing: superconducting, photonic, silicon spin, neutral atom, trapped ion, diamond defect, annealers, topological qubits. Infrastructure, applications, and materials for quantum computing, quantum and AI.
SDVs, Connected and Autonomous Vehicles (CAVs), In-Car AI Assistants, V2X, Autonomy as a Service, Connected Vehicles, E/E Architecture, Intelligent Transportation Systems (ITS-G5), DSRC, C-V2X, Features as a Service, ADAS
Ten-year TIM1/TIM1.5 forecast for advanced semiconductor packaging (ASP) split by graphene, liquid metal, thermal gel, and indium foil. 10-year forecast for microfluidic cooling. Detailed analysis on thermal and power management for ASP.
Emerging MEMS innovations in inertial sensing, gravimetry, and speaker technology. Granular 10-year market forecasts with player coverage, performance benchmarking, and competing technologies.
재료과학 분야의 설계 및 개발에서의 데이터 중심 접근방식, 데이터 인프라, 머신러닝, AI 분야에서의 주목할만한 발전 및 주요 기업 분석, 기술 동향 및 전망을 포괄하는 보고서
그래픽 처리장치(GPU), 중앙 처리장치(CPU), 맞춤형 AI ASIC, 기타 AI 가속기, 관련 주요 기업에 대한 분석, 기술동향, 공급망 분석 및 시장 전망을 포괄하는 보고서
AI, HPC, 데이터센터, 클라우드, 엣지, IoT, 임베디드 애플리케이션을 위한 HBM, QLC SSD, 차세대 HDD(HAMR, MAMR), 차세대 메모리(MRAM, RRAM, FeRAM, PCM) 동향 및 향후 10년간 시장전망을 포괄하는 보고서