5G mmWave 및 6G 에서의 안테나 패키징 (AiP) 기술
with Dr Yu-Han Chang, Principal Technology Analyst
14 Mar 2024
미래 통신기술을 위한 저손실 소재의 부상
with Sona Dadhania, Principal Technology Analyst
15 Feb 2024
2.5D 와 3D 반도체 패키징의 진화
with Dr Yu-Han Chang, Principal Technology Analyst
17 Jan 2024
5G 에서 6G 로 넘어가는 여정
with Dr Yu-Han Chang, Principal Technology Analyst
10 Nov 2023
데이터 센터에서 액침냉각 기술의 채택 현황 및 향후 전망
with Yulin Wang, Senior Technology Analyst
20 Jul 2023
6G 산업동향 및 기회요소
with Dr Yu-Han Chang, Principal Technology Analyst
1 Feb 2023
5G용 저손실 재료에 영향을 미치는 요소 및 장벽에 대한 분석
with Sona Dadhania, Principal Technology Analyst
26 Jan 2023
Where Are We at With 5G, and Where Are We Going With 6G?
with Dr Yu-Han Chang, Principal Technology Analyst
5 Dec 2022
Prospects for All Sensors and Preparation for Sensor-Centric 6G Communications in 2022
with Dr Peter Harrop, Chairman
3 Nov 2021
Commercially Compelling Printed/Flexible Sensor Innovations
with Dr Matthew Dyson, Principal Technology Analyst
30 Sep 2021
Reconfigurable Intelligent Surfaces Vital to 6G Communications
with Dr Peter Harrop, Chairman
1 Apr 2021
6G Communications: The Trillion Dollar Battle Commences
with Dr Peter Harrop, Chairman
3 Feb 2021