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| 1. | EXECUTIVE SUMMARY |
| 1.1. | Transparent conducting film or glass markets by application (value) |
| 1.2. | Transparent conducting film or glass markets by 10 technologies (value) |
| 1.3. | Transparent conducting film or glass markets by 10 technologies (area) |
| 1.4. | Market forecast for embedded solutions |
| 1.5. | 2019-2029 market forecasts segmented by major market groups (value) |
| 1.6. | 2019-2029 ITO film forecasts segmented by 26 applications (value) |
| 1.7. | 2019-2029 ITO glass forecasts segmented by 26 applications (value) |
| 1.8. | 2019-2029 silver nanowire forecasts segmented by 26 applications (value) |
| 1.9. | 2019-2029 metal mesh (etched) forecasts segmented by 26 applications (value) |
| 1.10. | 2019-2029 metal mesh (embossed/hybrid) forecasts segmented by 26 applications (value) |
| 1.11. | 2019-2029 metal mesh (directly printed) forecasts segmented by 26 applications (value) |
| 1.12. | Embedded touch OLED |
| 1.13. | 2019-2029 PEDOT and CNT forecasts segmented by application (value) |
| 1.14. | 2018-2028 graphene forecasts segmented by application (value) |
| 2. | TECHNOLOGY ASSESSMENT |
| 2.1. | ITO glass assessment: performance, manufacture & limitations |
| 2.2. | ITO glass in LCD displays |
| 2.3. | ITO film assessment: performance, manufacture and market trends |
| 2.4. | The Boom and Bust Cycle |
| 2.5. | ITO film shortcomings: flexibility |
| 2.6. | ITO film shortcomings: limited sheet conductivity |
| 2.7. | ITO film shortcomings: limited sheet resistance |
| 2.8. | ITO film shortcomings: index matching |
| 2.9. | ITO film shortcomings: thinness |
| 2.10. | ITO film shortcomings: price falls and commoditization |
| 2.11. | ITO films: current prices (2018) |
| 2.12. | Indium's single supply risk: real or exaggerated? |
| 2.13. | Recycling comes to the rescue? |
| 2.14. | Indium: price fluctuations drive innovation |
| 2.15. | Indium-free metal oxides win in high temperature applications |
| 2.16. | Silver nanowire transparent conductive films: principles |
| 2.17. | Silver nanowire transparent conductive films: growth and deposition |
| 2.18. | Silver nanowire transparent conductive films: performance levels and value proposition |
| 2.19. | Silver nanowire transparent conductive films: flexibility |
| 2.20. | Silver nanowire transparent conductive films: haze, migration, and single supplier risk |
| 2.21. | Comparing manufacturing cost of Ag NW and ITO |
| 2.22. | Silver nanowire transparent conductive films: target markets |
| 2.23. | Silver nanowire transparent conductive films: existing commercial applications on the market |
| 2.24. | Cambrios: rebirth possible under TPK? |
| 2.25. | C3Nano: low haze technology, high funding and strong investors |
| 2.26. | BASF: Silver nanowire transparent conductive films |
| 2.27. | N&B silver nanowire TCFs (Korea) |
| 2.28. | Nuovo Film: Chinese Ag NW supplier/coater making rapid progress? |
| 2.29. | Duksan Hi-Metal: success in transparent heaters for automotive? |
| 2.30. | Silver nanowire transparent conductive films: other companies (Dowa and Showa Denko) |
| 2.31. | Silver nanowire transparent conductive films: other companies (Huake and Seiko PMC Corp) |
| 2.32. | Silver nanowire transparent conductive films: other companies (Nanogap and NanoCnet) |
| 2.33. | Updates on others active or inactive (InnovaDynamics, Sinovia, BlueNano, Seashell, Carestream, Noritake, Henkel etc.) |
| 2.34. | Hitachi Chemical's TCTF |
| 2.35. | Metal mesh transparent conductive films: operating principles |
| 2.36. | Photopatterning for metal mesh production: leading production process but will it scale beyond depreciated assets? |
| 2.37. | Metal mesh: photolithography followed by etching |
| 2.38. | Fujifilm's photo-patterned metal mesh TCF |
| 2.39. | Mitsubishi Paper Mills Limited: Silver halide based metal mesh TCF |
| 2.40. | Early success of silver halide based metal mesh TCFs |
| 2.41. | Toppan Printing's copper mesh transparent conductive films |
| 2.42. | Dai Nippon Printing's transparent conductive film technology |
| 2.43. | DNP focusing on EMI shield and transparent antenna? |
| 2.44. | 3M's photo-patterned metal mesh TCF |
| 2.45. | Elotech metal mesh |
| 2.46. | Tanaka Metal's metal mesh technology |
| 2.47. | Rolith's novel photo patterning technique |
| 2.48. | Panasonic's Large Area Metal Mesh |
| 2.49. | Sharp(Foxconn): large-area metal mesh films |
| 2.50. | GiS (integrator): Large area metal mesh displays |
| 2.51. | Improving invisibility of metal mesh |
| 2.52. | SWOT analysis on photo patterned metal mesh TCFs |
| 2.53. | Embossing followed by printing/filling to create imbedded ultrafine metal mesh? |
| 2.54. | Embossing/imprinting metal mesh TCFs |
| 2.55. | Uni-Pixel's metal mesh performance (no longer active) |
| 2.56. | Unipixel's limited example of commercial products (no longer active) |
| 2.57. | Yield issues caused UniPixel to ultimately fail and never deliver? |
| 2.58. | Atmel offloads assets to UniPixel (no longer active) |
| 2.59. | Conductive Inkjet Technology's photo-patterned metal mesh TCF (no longer active?) |
| 2.60. | O-Film's metal mesh TCF technology: the basics |
| 2.61. | Will O-Film rejuvenate its metal mesh business after disappointing sales? |
| 2.62. | MNTech's metal mesh TCF technology (the incident) |
| 2.63. | J-Touch: substantial metal mesh capacity |
| 2.64. | Nanoimprinting metal mesh with 5um linewidth |
| 2.65. | Metal mesh TCF is flexible |
| 2.66. | Cost breakdown of metal mesh and yield |
| 2.67. | SWOT analysis on embossed metal mesh TCFs |
| 2.68. | Key players |
| 2.69. | Direct printing: finally making a comeback in metal mesh TCF as a viable ultrafine technology? |
| 2.70. | Direct printed metal mesh transparent conductive films: performance |
| 2.71. | Direct printed metal mesh transparent conductive films: major shortcomings |
| 2.72. | Komura Tech: improvement in gravure offset printed fine pattern (<5um) metal mesh TCF ? |
| 2.73. | Shashin Kagaku: offset printed metal mesh TCF |
| 2.74. | Komori: gravure offset all-printed metal mesh film? |
| 2.75. | Asahi Kasei: taking steps to commercialize its R2R ultrafine printing process |
| 2.76. | How is the ultrafine feature R2R mold fabricated? |
| 2.77. | Konica Minolta: inkjet printing large area fine pitch metal mesh TCFs with <10um linewidth? |
| 2.78. | Gunze: S2S screen printing finds a market fit? |
| 2.79. | Toray's photocurable screen printed paste for fine line metal mesh |
| 2.80. | Ishihara Chemical's gravure printed photo-sintered Cu paste |
| 2.81. | Toppan Forms: Ag salt inks to achieve 4um printed metal mesh? |
| 2.82. | Key players (Komori, LG Chem, Pchem, Goss, etc.) |
| 2.83. | Key players |
| 2.84. | Print and Plate |
| 2.85. | Eastman Kodak: Transparent ultra low-resistivity RF antenna using printed Cu metal mesh technology |
| 2.86. | Kuroki/ITRI: printed seed layer and plate Cu metal mesh? |
| 2.87. | Replacing photolithography with photoresist printing for ultra fine metal mesh |
| 2.88. | Replacing photolithography with photoresist printing for ultra fine metal mesh |
| 2.89. | LCY gravure printing photoresist then etching |
| 2.90. | Screen Holding: gravure printing photoresist then etching |
| 2.91. | Consistent Materials' photoresist for metal mesh |
| 2.92. | Other |
| 2.93. | Nippon Glass: Cu metal mesh TCF on flexible glass |
| 2.94. | Metal mesh on glass for automotive industry (Micro) |
| 2.95. | Introduction to Carbon Nanotubes (CNT) |
| 2.96. | CNTs: ideal vs reality |
| 2.97. | Not all CNTs are equal |
| 2.98. | Different production processes (laser ablation and arc discharge) |
| 2.99. | Different production processes (catalytic CVD) |
| 2.100. | Benchmarking of different CNT production processes |
| 2.101. | Price position of CNTs (from SWCNT to FWCNT to MWCNT) |
| 2.102. | Production capacity globally |
| 2.103. | Carbon nanotube transparent conductive films: performance |
| 2.104. | Carbon nanotube transparent conductive films: performance of commercial films on the market |
| 2.105. | Carbon nanotube transparent conductive films: matched index |
| 2.106. | Carbon nanotube transparent conductive films: mechanical flexibility |
| 2.107. | Carbon nanotube transparent conductive films: stretchability as a key differentiator for in-mold electronics |
| 2.108. | Example of 3D touch-sensing surface with CNTs |
| 2.109. | Example of wearable device using CNT |
| 2.110. | Key players |
| 2.111. | Graphene: background |
| 2.112. | Numerous ways of making graphene |
| 2.113. | Quantitative mapping of graphene morphologies on the market |
| 2.114. | Graphene platelet-type: pricing trends and strategies |
| 2.115. | CVD Graphene |
| 2.116. | Growth process of CVD graphene |
| 2.117. | The key role of oxygen in CVD graphene growth |
| 2.118. | R2R Growth? |
| 2.119. | The transfer challenge |
| 2.120. | Roll-to-roll transfer of CVD graphene |
| 2.121. | Novel methods for transferring CVD graphene |
| 2.122. | Sony's approach to transfer of CVD process |
| 2.123. | Wuxi Graphene Film Co's CVD graphene progress |
| 2.124. | LG Electronics: R2R CVD graphene targeting TCFs? |
| 2.125. | Ningbo Soft Carbon Electronics: R2R CVD graphene growth and transfer |
| 2.126. | 2D Carbon (Changzhou)Ltd: Moving away from CVD type graphene film? |
| 2.127. | Direct CVD graphene growth on an insulating substrate? |
| 2.128. | Graphene transparent conductive film: performance levels |
| 2.129. | Doping as a strategy for improving graphene TCF performance |
| 2.130. | Be wary of extraordinary results for graphene |
| 2.131. | Graphene transparent conducting films: flexibility |
| 2.132. | Graphene transparent conducting films: thinness and barrier layers |
| 2.133. | SWOT analysis on graphene TCFs |
| 2.134. | Key players |
| 2.135. | PEDOT:PSS |
| 2.136. | Patterning PEDOT:PSS |
| 2.137. | Performance of PEDOT:PSS has drastically improved |
| 2.138. | PEDOT:PSS is now on a par with ITO-on-PET |
| 2.139. | PEDOT:PSS is mechanically flexible |
| 2.140. | PEDOT:PSS is stretchable and can be thermoformed |
| 2.141. | Stability and spatial uniformity of PEDOT:PSS |
| 2.142. | Nippon Chemi-Con's polymeric transparent conductive film |
| 2.143. | Commercial product using PEDOT:PSS |
| 2.144. | Use case examples of PEDOT:PSS TCFs |
| 2.145. | Force Foundation: PEDOT used in solution coated smart windows |
| 2.146. | Use case examples of PEDOT:PSS TCFs |
| 2.147. | Key players |
| 2.148. | Fine wire TCF technology |
| 2.149. | UC Nano: Microwire and metal mesh for large area touch? |
| 2.150. | Displax: large area multi-touch capacitive touch |
| 2.151. | Performance of fine wire large-sized touch displays on the market |
| 2.152. | SWOT analysis on micro wire TCFs |
| 2.153. | CimaTech's self-assembled nanoparticle technology (no longer active) |
| 2.154. | Examples of Cima Nanotech's technology (no longer active) |
| 2.155. | ClearJet's inkjet printed nanoparticle-based TCFs: a failure? |
| 2.156. | E-Fly Corporation's sputtered silver film: an alternative to metal mesh for large area touch? |
| 2.157. | Young Fast/Nitto Denko: ITO-metal alloy as an alternative to metal mesh for large area touch? |
| 2.158. | Quantitative benchmarking of different TCF technologies |
| 2.159. | Technology comparison |
| 2.160. | Stretchable and in-mold transparent conductive film |
| 2.161. | In-mold electronics: processes and requirements |
| 2.162. | Stretchable conductive inks for in-mold electronics |
| 2.163. | Target applications for in-mold electronics |
| 2.164. | Product examples using in-mold conductive inks |
| 2.165. | Stretchable carbon nanotube transparent conducting films |
| 2.166. | Product examples of carbon nanotube in-mold transparent conductive films |
| 2.167. | PEDOT transparent conductive films |
| 2.168. | Product examples of in-mold and stretchable PEDOT:PSS transparent conductive films |
| 2.169. | In-mold and stretchable metal mesh transparent conductive films |
| 2.170. | Stretchable silver nanowire transparent conductive films |
| 2.171. | Other in-mold transparent conductive film technologies |
| 3. | APPLICATIONS |
| 3.1. | Small phones, tablets, AiO, Notebooks, etc. |
| 3.2. | Consumer electronic device shipment forecasts |
| 3.3. | Smart phones have been growing in size |
| 3.4. | Chinese brands are stealing market share in China |
| 3.5. | Smart phone market is highly diverse and fragmented |
| 3.6. | Different capacitive add-on touch architectures |
| 3.7. | Different capacitive embedded touch architectures |
| 3.8. | Transition from add-on to embedded touch |
| 3.9. | Applications: ultra large area touch screens |
| 3.10. | Optical touch systems for large area touch displays |
| 3.11. | Assessing different optical touch technologies |
| 3.12. | Metal mesh in large area capacitive touch screens |
| 3.13. | Non metal mesh large area capacitive displays |
| 3.14. | Finewire larger area capacitive large-sized displays |
| 3.15. | Applications: transparent LED |
| 3.16. | Transparent LEDs: need for low resistance flexible TCF |
| 3.17. | OLED lighting: solid-state, efficient, cold, surface emission, flexible......? |
| 3.18. | Performance challenge for R2R OLED lighting |
| 3.19. | Price targets as set by LED and other lighting sources |
| 3.20. | Current state of sheet-to-sheet |
| 3.21. | Current status with R2R OLED lighting |
| 3.22. | OLED lighting market |
| 3.23. | Transparent Electrodes for OLED Lighting |
| 3.24. | Requirements for Conductivity of Transparent Anode |
| 3.25. | Analysis for Square Single Stack Panels by Cambrios |
| 3.26. | Calculations showing the stringent sheet resistance requirements for TCF in OLED lighting |
| 3.27. | Silver nanowires for OLED lighting |
| 3.28. | Applications: Organic photovoltaics |
| 3.29. | Organic photovoltaics (OPV): the dream and the reality (so far)? |
| 3.30. | Basics of OPV operation |
| 3.31. | Typical OPV device architectures (single vs multi-junction) |
| 3.32. | Film morphology control (bulk heterojunction) is critical |
| 3.33. | Solution vs evaporation |
| 3.34. | Progress in solution processing so far (2010 TO NOW) |
| 3.35. | Progress in tandem cell evaporation so far (2007 to NOW) |
| 3.36. | OPV products and prototypes |
| 3.37. | OPV installations |
| 3.38. | Current status of commercial players and outlook |
| 3.39. | Market Forecast for Organic photovoltaics |
| 3.40. | Applications: flexible displays |
| 3.41. | The early years of flexible displays |
| 3.42. | Flexible EPD suppliers in 2017 |
| 3.43. | Flexible LCD |
| 3.44. | First step towards flexible: OLED on plastic substrate |
| 3.45. | The rise of plastic and flexible AMOLED |
| 3.46. | Plastic displays in mass production |
| 3.47. | But fully flexible displays are finally coming? |
| 3.48. | Large flexible displays demonstrated by LG |
| 3.49. | From rigid OLED, to flexible and foldable OLED |
| 3.50. | Major trends: the rise of flexible OLED displays |
| 3.51. | Changes in touch technology for flexible displays |
| 3.52. | Market forecasts for rigid, plastic and flexible OLED displays |
| 3.53. | Applications: automotive |
| 3.54. | Printed rear window de-foggers |
| 3.55. | Printing on polycarbonate car windows? |
| 3.56. | Metal mesh in window and mirror defrosters |
| 3.57. | Automotive touch market in sqm (2018 to 2028) |
| 4. | MARKET FORECASTS |
| 4.1. | Transparent conducting film or glass markets by application (value) |
| 4.2. | Transparent conducting film or glass markets by 10 technologies (value) |
| 4.3. | Transparent conducting film or glass markets by 10 technologies (area) |
| 4.4. | Market forecast for embedded solutions |
| 4.5. | 2019-2029 market forecasts segmented by major market groups (value) |
| 4.6. | 2019-2029 ITO film forecasts segmented by 26 applications (value) |
| 4.7. | 2019-2029 ITO glass forecasts segmented by 26 applications (value) |
| 4.8. | 2019-2029 silver nanowire forecasts segmented by 26 applications (value) |
| 4.9. | 2019-2029 metal mesh (etched) forecasts segmented by 26 applications (value) |
| 4.10. | 2019-2029 metal mesh (embossed/hybrid) forecasts segmented by 26 applications (value) |
| 4.11. | 2019-2029 metal mesh (directly printed) forecasts segmented by 26 applications (value) |
| 4.12. | Embedded touch OLED |
| 4.13. | 2019-2029 PEDOT and CNT forecasts segmented by application (value) |
| 4.14. | Graphene market prospects |
| 5. | COMPANY INTERVIEWS AND PROFILES |
| 5.1. | Interview-based profiles |
| 5.1.1. | Arkema, France |
| 5.1.2. | Blue Nano, USA |
| 5.1.3. | Bluestone Global Tech, USA |
| 5.1.4. | C3Nano |
| 5.1.5. | Cambrios, USA |
| 5.1.6. | Canatu, Finland |
| 5.1.7. | Carestream Advanced Materials, USA |
| 5.1.8. | Charmtron Inc |
| 5.1.9. | Chasm(ex SWeNT) |
| 5.1.10. | Cima Nanotech, USA |
| 5.1.11. | ClearJet, Israel |
| 5.1.12. | Dai Nippon Printing, Japan |
| 5.1.13. | Displax Interactive Systems, Portugal |
| 5.1.14. | E-Fly Optoelectronic Materials Co., Ltd. |
| 5.1.15. | Epigem Ltd |
| 5.1.16. | Goss International Americas, USA |
| 5.1.17. | Graphene Frontiers |
| 5.1.18. | Graphene Laboratories, USA |
| 5.1.19. | Graphene Square |
| 5.1.20. | Graphenea |
| 5.1.21. | Haydale Ltd |
| 5.1.22. | Heraeus, Germany |
| 5.1.23. | Kimoto |
| 5.1.24. | Komori Corporation |
| 5.1.25. | MicroContinuum |
| 5.1.26. | Multitaction |
| 5.1.27. | Nanogap, Spain |
| 5.1.28. | NanoIntegris |
| 5.1.29. | Nanomade |
| 5.1.30. | Neonode |
| 5.1.31. | OCSiAl |
| 5.1.32. | O-Film, China |
| 5.1.33. | PolyIC, Germany |
| 5.1.34. | Poly-Ink, France |
| 5.1.35. | Promethean Particles |
| 5.1.36. | Seashell Technology, USA |
| 5.1.37. | Showa Denko, Japan |
| 5.1.38. | Showa Denko K.K |
| 5.1.39. | Sinovia Technologies, USA |
| 5.1.40. | SouthWest NanoTechnologies, USA |
| 5.1.41. | Toppan Printing |
| 5.1.42. | UniPixel, USA |
| 5.1.43. | University of Exeter, UK |
| 5.1.44. | Visual Planet, UK |
| 5.1.45. | Wuxi Graphene Film |
| 5.1.46. | XinNano Materials, Taiwan |
| 5.1.47. | Zytronic, UK |
| 5.1.48. | Zyvex |
| 5.2. | Other Profiles |
| 5.2.1. | Chasm Technologies, USA |
| 5.2.2. | Cheil Industries, South Korea |
| 5.2.3. | Chimei Innolux, Taiwan |
| 5.2.4. | Chisso Corp., Japan |
| 5.2.5. | Dontech Inc., USA |
| 5.2.6. | Eikos, USA |
| 5.2.7. | ELK, South Korea |
| 5.2.8. | Flectrode Technology Limited |
| 5.2.9. | Hitachi Chemical, Japan |
| 5.2.10. | Holst Center, Netherlands |
| 5.2.11. | Komoro, Japan |
| 5.2.12. | Oike & CO., Ltd., Japan |
| 5.2.13. | Polychem UV/EB, Taiwan |
| 5.2.14. | TDK, Japan |
| 5.2.15. | Teijin Kasei America, Inc. / Teijin Chemical, USA |
| 5.2.16. | Top Nanosys, South Korea |
| 5.2.17. | Toyobo, Japan |
| スライド | 475 |
|---|---|
| 企業数 | 65 |
| フォーキャスト | 2029 |