インモールドエレクトロニクス 2022年-2032年:技術、特許、市場予測、有力企業: IDTechEx

電子機器の統合化が進む中、インモールドエレクトロニクス(IME)市場は2032年までに15億ドルに拡大

インモールドエレクトロニクス 2022年-2032年:技術、特許、市場予測、有力企業

インモールド構造エレクトロニクス、フィルムインサート成形、3Dエレクトロニクス、構造エレクトロニクス、静電容量式タッチセンサー、伸縮性導電性インク、アディティブエレクトロニクス製造、自動車内装、ヒューマンマシンインターフェースなど


製品情報 概要 目次 価格 Related Content
インモールドエレクトロニクスとは、成形・熱成形されたプラスチック部品に電子機能を埋め込むことができる技術です。IMEは、静電容量式タッチ、照明、さらにはハプティクスを統合し、最大70%の小型軽量化を実現した、曲面タッチセンシティブインターフェースの効率的な製造方法です。これらの利点を踏まえ、IDTechExはIMEが2032年までに15億ドルの市場となり、主に自動車や家電分野で応用されると予測しています。
「インモールドエレクトロニクス 2022年-2032年」が対象とする主なコンテンツ
(詳細は目次のページでご確認ください)
• 全体概要および結論
• インモールドエレクトロニクスの市場規模、市場展望、市場予測を用途別に売上高と数量(m2)で提供。
• モチベーション、課題、現状など、インモールドエレクトロニクス(IME)の概要。
• IMEおよび同様装飾的なタッチセンシティブインターフェースの製造方法。
• 静電容量式タッチ センシング、照明、ハプティクスなど、IMEデバイス機能の説明と事例。
• 導電性および誘電性インク、導電性接着剤、透明導電体、基板、熱可塑性プラスチックなど、IME用の材料。
• 自動車、家電製品などのIME応用分野。現状評価を含む複数のプロトタイプ事例。将来の可能性と脅威。
• ライフサイクルアセスメントを含む、IMEの持続可能性。
• 電子部品のさらなる統合を含む、IMEの将来的な技術開発概要。
• 技術開発者、メーカー、材料サプライヤーなど、インタビューに基づいた複数の企業プロフィール。
 
「インモールドエレクトロニクス 2022年-2032年」は以下の情報を提供します
技術動向とメーカー分析:
  • インモールドエレクトロニクス(IME)の製造方法と関連する商業環境の概要。可能性と脅威の分析とともに、IMEを開発するモチベーション。
  • IMEの製造要件、最大の技術的課題がどこにあるのか? 対処方法についての詳細な説明。
  • 導電性インク、誘電性インク、導電性接着剤、透明導電体、基板など、IME特有の材料環境と技術的要件の分析。
  • IMEと従来方法を使用して製造された自動車部品のライフサイクルアセスメントの事例。
  • フィルムインサート成形、3D表面への機能性フィルム塗布、3D表面へのレーザー直接構造化とプリントなど、IMEと競合する製造方法の概要。
  • FLEX2021およびLOPEC2021を含む2021年イベントからの更新。
市場予測および分析:
  • IMEの10年間の詳細な市場予測、応用分野別(自動車の各ユースケースを含む)。売上高および数量。
  • 関連する材料要件の10年にわたる市場予測。
  • さまざまなIME応用および統合レベルに対する技術的および商業的準備レベルの評価。
 
Greater integration of electronics within 3D structures is an ever-increasing trend, representing a more sophisticated solution compared to the current approach of encasing rigid printed circuit boards. In-mold electronics (IME) facilitates this trend, by enabling multiple integrated functionalities to be incorporated into components with thermoformed 3D surfaces. IME offers multiple advantages relative to conventional mechanical switches, including reduction in weight and material consumption of up to 70% and much simpler assembly.
 
A new manufacturing approach
 
The IME manufacturing process can be regarded as an extension of the well established in-mold decorating (IMD) process, in which thermoforming plastic with a decorative coating is converted to a 3D component via injection molding. Since IME is an evolution of an existing technique, much of the existing process knowledge and capital equipment can be reused.
 
IME differs from IMD though the initial screen printing of conductive thermoformable inks, followed by deposition of electrically conductive adhesives and the mounting of SMDs (surface mount devices, primarily LEDs at present) are similar. More complex multilayer circuits can also be produced by printing dielectric inks to enable crossovers. The figure below shows a schematic of the IME manufacturing process flow.
 
 
Manufacturing process flow for in-mold electronics (IME)
 
Challenges and innovation opportunities
 
Despite the similarities to IMD, there are multiple technical challenges associated with the integration of electronic functionality that have to withstand thermoforming and injection molding. A very high manufacturing yield is crucial since the circuitry is embedded, and thus a single failure can render the entire part redundant. This comprehensively updated report covers the commercial and emerging solutions from the key players as IME progresses from R&D to gaining widespread adoption in multiple application sectors.
 
On the material side, conductive inks, dielectric inks, and electrically conductive adhesives need to survive the forming and molding steps that involve elevated temperatures, pressure, and elongation. Furthermore, all the materials in the stack will need to be compatible. As such, many suppliers have developed portfolios of functional inks designed for IME. Establishing an IME material portfolio before widespread adoption means that material suppliers are well positioned to benefit from forthcoming growth. This is because production processes and products are designed with their materials in mind, thus serving as a barrier to switching suppliers.
 
This report examines the current situation in terms of material performance, supply chain, process know-how, and application development progress. It also identifies the key bottlenecks and innovation opportunities, as well as emerging technologies associated with IME such as thermoformable particle-free inks.
 
 
Commercial progress
 
IME is most applicable to use cases that requires a decorative touch-sensitive surface, such as control panels in automotive interiors and on kitchen appliances. It enables a 3D, smooth, wipeable, decorative surface with integrated capacitive touch, lighting and even haptic feedback and antennas.
 
Despite the wide range of applications and the advantageous reductions in size, weight and manufacturing complexity, commercial deployment of IME integrated SMD components has thus far been fairly limited. This relatively slow adoption, especially within the primary target market of automotive interiors, is attributed to both the challenges of meeting automotive qualification requirements and the range of less sophisticated alternatives such as applying functional films to thermoformed parts. Competing technologies to IME for electronically functionalizing 3D decorative surfaces are discussed in the report.
 
Furthermore, COVID-19 has delayed the widespread adoption of IME as the automotive sector faced factory shut-downs and a temporary sales decline. Despite this setback, the market is beginning to change character towards product production, with equipment suppliers developing specialist capabilities and development projects reaching their conclusion. IDTechEx expects the market to show accelerated growth from 2024/2025 onwards, starting from simpler small-area devices then progressing towards more complex larger-area and higher-volume applications with more stringent reliability requirements.
 
The long-term target for IME is to become an established platform technology, much the same as rigid PCBs are today. Once this is achieved getting a component/circuit produced will be a simple matter of sending an electronic design file, rather than the expensive process of consulting with IME specialists that is required at present. Along with greater acceptance of the technology, this will require clear design rules, materials that conform to established standards, and crucially the development of electronic design tools.
 
 
Overview
 
IDTechEx has been researching the emerging printed electronics market for well over a decade, launching our first printed and flexible sensor report back in 2012. Since then, we have stayed close to the technical and market developments, interviewing key players worldwide, attending numerous conferences, delivering multiple consulting projects, and running classes and workshops on the topic. This report discusses the manufacturing methodologies, material requirements, applications, and challenges associated with IME in considerable detail. The report includes 10-year market forecasts by application sector, expressed as both revenue and IME panel area.
 
Note that IME is not the only manufacturing methodology that enables 3D electronics. Other approaches involve fully additive electronics manufacturing (i.e. 3D printing of electronics), and applying electronics directly to 3D surfaces using techniques such as aerosol jet printing and laser direct structuring (LDS). These methods are briefly explored within this report, but more detailed discussion and analysis can be found in the IDTechEx Report 3D Electronics.
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詳細
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アイディーテックエックス株式会社 (IDTechEx日本法人)
担当: 村越美和子 m.murakoshi@idtechex.com
Table of Contents
1.EXECUTIVE SUMMARY
1.1.Introduction to in-mold electronics (IME)
1.2.IME manufacturing process flow
1.3.Commercial advantages of IME
1.4.IME facilitates versioning and localization
1.5.IME value chain overview
1.6.10-year forecast for IME component area by application (in m2)
1.7.10-year forecast for IME component revenue by application (in USD millions)
1.8.IME forecast pushed back due to COVID-19
1.9.Reviewing the previous in-mold electronics report (2020-2030)
1.10.SWOT: In-mold electronics (IME)
1.11.Porters' five forces analysis of in-mold electronics market
1.12.Overview of IME manufacturing requirements
1.13.Overview of manufacturing methods for touch sensitive interfaces and 3D electronics
1.14.Distinguishing manufacturing methods for 3D electronics
1.15.Benchmarking competitive processes to IME
1.16.Overview of specialist materials for IME
1.17.Overview of IME applications
1.18.Overview of functionality within IME components
1.19.Overview of IME and sustainability
1.20.Main overall conclusions (I)
1.21.Main overall conclusions (II)
2.MARKET FORECASTS
2.1.Forecast methodology
2.2.IME forecast pushed back due to COVID-19
2.3.Addressable market for IME: Automotive
2.4.Addressable market for IME: White goods
2.5.10-year forecast for IME component area by application (in m2)
2.6.10-year forecast for IME component revenue by application (in USD millions)
2.7.10-year forecast for automotive applications of IME - area (thousand m2)
2.8.10-year forecast for automotive applications of in-mold electronics - revenue (USD millions)
2.9.Future (2032) IME market breakdown by application
2.10.IME value capture estimate at market maturity (2032)
2.11.Ten-year market forecasts for IME by value capture element (revenue, USD millions)
2.12.Value capture by functional ink type (2021)
2.13.10-year market forecasts for functional inks in IME (by type)
3.INTRODUCTION TO IN-MOLD ELECTRONICS
3.1.Introduction to in-mold electronics (IME)
3.2.Transition from 2D to 2.5D to 3D electronics
3.3.Deciphering integrated/3D electronics terminology (I)
3.4.Deciphering integrated/3D electronics terminology (II)
3.5.Deciphering integrated/3D electronics terminology (III)
3.6.IME value chain - a development of in-mold decorating (IMD)
3.7.Current status of main IME technology developer (Tactotek)
3.8.IME value chain overview
3.9.In-mold electronics vs film insert molding
3.10.The long road to IME commercialization
3.11.Tactotek's funding continues to increase
3.12.Comparative advantage of in-mold electronics likely to increase over time
3.13.Regional differences in IME development
3.14.IME players divided by location and value chain stage
4.MANUFACTURING METHODS
4.1.1.Distinguishing manufacturing methods for 3D electronics
4.2.Manufacturing IME
4.2.1.Manufacturing IME components
4.2.2.IME manufacturing process flow (I)
4.2.3.IME manufacturing process flow (II)
4.2.4.IME manufacturing process flow (III)
4.2.5.Progression towards 3D electronics with IME
4.2.6.Manufacturing methods: Conventional electronics vs. IME
4.2.7.Alternative IME component architectures
4.2.8.Equipment required for IME production
4.2.9.Hybrid approach provides an intermediate route to market
4.2.10.Forecast progression in IME complexity
4.2.11.Surface mount device (SMD) attachment: Before or after forming
4.2.12.Component attachment cross-sections
4.2.13.One-film vs two-film approach
4.2.14.Multilayer IME circuits require cross-overs
4.2.15.IC package requirements for IME
4.2.16.IME requires special electronic design software
4.2.17.Faurecia concept: traditional vs. IME design
4.2.18.Conventional vs. IME comparison (Faurecia)
4.2.19.IME: value transfer from PCB board to ink
4.2.20.Print-then-plate for in-mold electronics
4.2.21.Automating IME manufacturing
4.2.22.Overview of IME manufacturing requirements
4.3.Similar manufacturing methodologies to IME
4.3.1.Multiple manufacturing methods similar to IME
4.3.2.Comparative advantage of in-mold electronic likely to increase over time
4.3.3.Applying functional foils (transfer printing) (I)
4.3.4.Applying functional films (evaporated lines)
4.3.5.Adding capacitive touch with films (Plastic Electronic)
4.3.6.Applying functional films into 3D shaped parts (I) (PolyIC)
4.3.7.Applying functional films into 3D shaped parts (II) (PolyIC)
4.4.Other 3D metallization methods
4.4.1.Molded interconnect devices (MIDs) for 3D electronics
4.4.2.3D electronics manufacturing method flowchart
4.4.3.Approaches to 3D printed electronics
4.4.4.Aerosol deposition of conductive inks onto 3D surfaces
4.4.5.Laser direct structuring (LDS)
4.4.6.Applications of LDS
4.4.7.LDS MID application examples: Automotive HMI
4.4.8.Extruding conductive paste for structurally-integrated antennas
4.4.9.Two shot molding - an alternative method for high volume MID devices.
4.4.10.Printing electronics on 3D surfaces for automotive applications (Neotech-AMT)
4.4.11.Replacing wiring bundles with printed electronics (Q5D Technology)
4.4.12.Application targets for printing wiring onto 3D surfaces (Q5D Technologies)
4.4.13.The premise of 3D printed electronics
4.4.14.Emerging approach: Multifunctional composites with electronics (Tecnalia)
4.4.15.Emerging approach: Electrical functionalization by additive manufacturing (CEA)
4.4.16.Benchmarking competitive processes to 3D electronics
4.4.17.Overview of electronics on 3D surfaces
5.FUNCTIONALITY WITHIN IME COMPONENTS
5.1.1.Integrating functionality within IME components
5.2.Capacitive touch sensing
5.2.1.Capacitive touch sensors overview
5.2.2.Capacitive sensors: Operating principle
5.2.3.Hybrid capacitive / piezoresistive sensors
5.2.4.Emerging current mode sensor readout: Principles
5.2.5.Benefits of current-mode capacitive sensor readout
5.2.6.SWOT analysis of capacitive touch sensors
5.3.Lighting
5.3.1.Motivation for integrating lighting with IME
5.3.2.Comparing conventional backlighting vs integrated lighting with IME (I)
5.3.3.Comparing conventional backlighting vs integrated lighting with IME (II)
5.4.Additional functionalities
5.4.1.Integration of haptic feedback
5.4.2.Thermoformed polymeric haptic actuator
5.4.3.Thermoformed 3D shaped reflective LCD display
5.4.4.Thermoformed 3D shaped RGD AMOLED with LTPS
5.4.5.Molding electronics in 3D shaped composites
5.4.6.Antenna integration with IME
6.MATERIALS FOR IME
6.1.1.IME requires a wide range of specialist materials
6.1.2.Materials for IME: A portfolio approach
6.1.3.All materials in the stack must be compatible: Conductivity perspective
6.1.4.Material composition of IME vs conventional HMI components
6.1.5.Stability and durability is crucial
6.1.6.Company profiles of IME material suppliers
6.2.Conductive inks
6.2.1.Comparing different conductive inks materials
6.2.2.Challenges of comparing conductive inks
6.2.3.Comparing conductive inks: Conductivity vs sheet resistance.
6.2.4.Stretchable vs thermoformable conductive inks
6.2.5.In-mold electronics requires thermoformable conductive inks (I)
6.2.6.Bridging the conductivity gap between printed electronics and IME inks
6.2.7.Gradual improvement over time in thermoformability.
6.2.8.Thermoformable conductive inks from different resins
6.2.9.The role of particle size in thermoformable inks
6.2.10.Selecting right fillers and binders to improve stretchability (Elantas)
6.2.11.The role of resin in stretchable inks
6.2.12.All materials in the stack must be compatible: forming perspective
6.2.13.New ink requirements: Surviving heat stress
6.2.14.New ink requirements: Stability
6.2.15.Particle-free thermoformable inks (I) (E2IP/National Research Council of Canada)
6.2.16.Particle-free thermoformable inks (II) (E2IP/National Research Council of Canada)
6.2.17.Polythiophene-based conductive films for flexible devices (Heraeus)
6.2.18.In-mold conductive inks on the market
6.2.19.In-mold conductive ink examples
6.2.20.Suppliers of thermoformable conductive inks for IME multiply
6.3.Dielectric inks
6.3.1.Dielectric inks for IME
6.3.2.Multilayer IME circuits require cross-overs
6.3.3.Cross-over dielectric: Requirements
6.4.Electrically conductive adhesives
6.4.1.Electrically conductive adhesives: General requirements and challenges for IME
6.4.2.Electrically conductive adhesives: Surviving the IME process
6.4.3.Specialist formable conductive adhesives required
6.4.4.Different types of conductive adhesives
6.4.5.Comparing ICAs and ACAs.
6.4.6.Attaching components to low temperature substrates
6.5.Transparent conductive materials
6.5.1.Stretchable carbon nanotube transparent conducting films
6.5.2.Prototype examples of carbon nanotube in-mold transparent conductive films
6.5.3.3D touch using carbon nanobuds
6.5.4.Prototype examples of in-mold and stretchable PEDOT:PSS transparent conductive films
6.5.5.In-mold and stretchable metal mesh transparent conductive films
6.5.6.Other in-mold transparent conductive film technologies
6.6.Substrates and thermoplastics
6.6.1.Substrates and thermoplastics for IME
6.6.2.Different molding materials and conditions
6.6.3.Special PET as alternative to common PC?
6.6.4.Can TPU also be a substrate?
6.6.5.Covestro: Plastics for IME
7.APPLICATIONS, COMMERCIALIZATION, AND PROTOTYPES
7.1.1.IME interfaces break the cost/value compromise
7.2.Automotive
7.2.1.Motivation for IME in automotive applications
7.2.2.Opportunities for IME in automotive HMI
7.2.3.Addressable market in vehicle interiors in 2020 and 2025
7.2.4.Automotive: In-mold decoration product examples
7.2.5.Early case study: Ford and T-ink
7.2.6.GEELY seat control: Development project not pursued
7.2.7.Capacitive touch panel with backlighting
7.2.8.Direct heating of headlamp plastic covers
7.2.9.Steering wheel with HMI (Canatu)
7.2.10.Quotes on the outlook for IME in automotive applications
7.2.11.Readiness level of printed/flexible electronics in vehicle interiors
7.2.12.Threat to automotive IME: Touch sensitive interior displays (I)
7.2.13.Alternative to automotive IME: Integrated stretchable pressure sensors
7.2.14.Alternative to automotive IME: Integrated capacitive sensing
7.3.White goods
7.3.1.Opportunities for IME in white goods
7.3.2.Example prototypes of IME for white goods (I)
7.3.3.Example prototypes of IME for white goods (II)
7.4.Other applications
7.4.1.Other IME applications: Medical and industrial HMI
7.4.2.Home automation creates opportunities for IME
7.4.3.IME for home automation becomes commercial
7.4.4.Consumer electronics prototypes to products
7.4.5.Commercial products: wearable technology
8.IME AND SUSTAINABILITY
8.1.1.IME and sustainability
8.1.2.IME reduces plastic consumption
8.1.3.VTT life cycle assessment of IME parts
8.1.4.IME vs reference component kg CO2 equivalent (single IME panel): Cradle to gate
8.1.5.IME vs reference component kg CO2 equivalent (100,000 IME panels): Cradle-to-grave
8.1.6.Summary of results from VTT's life cycle assessment
9.FUTURE DEVELOPMENTS FOR IME
9.1.IME with incorporated ICs (I)
9.2.Laser induced forward transfer (LIFT) could replace screen printing (I)
9.3.Thin film digital heaters for in-mold electronics thermoforming (Wattron)
9.4.S-shape copper traces facilitate stretchability without loss of conductivity
 

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インモールドエレクトロニクス 2022年-2032年:技術、特許、市場予測、有力企業

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レポート概要

スライド 228
フォーキャスト 2032
発行日 Sep 2021
ISBN 9781913899745
 

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