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熱伝導材料 (サーマルインターフェイスマテリアル)2023-2033年:技術、市場、予測

材料需要、ベンチマーク評価、市場トレンド、新市場の成長要因: EMIシールディング、5G、電気自動車、データセンター、ADAS、家電製品。高性能熱伝導性材料。

製品情報 概要 目次 価格 Related Content
「熱伝導材料 (サーマルインターフェイスマテリアル)2023-2033年」が対象とする主なコンテンツ
● 熱伝導性材料: 形態、検討事項、ベンチマーク比較:
□ ギャップ充填材料
□ ギャップフィラー
□ グリースとペースト
□ 相変化材料(PCM)
□ テープ/熱伝導性接着剤
□ ポッティング材/封止材
□ 液体金属
● 先進的TIM
□ カーボン充填ポリマー製TIM(炭素繊維、カーボンナノチューブ、グラフェン等)
□ 金属充填ポリマー製TIM(インジウム、ガリウム、GaIn合金等)
□ 窒化ホウ素ナノチューブ
● EVバッテリーパックのTIM
● 電磁干渉(EMI)シールディングのTIM(EMI TIM)
● データセンターのTIM
● 家電製品のTIM
● ADASエレクトロニクスのTIM
● 5GインフレのTIM
● 市場予測
□ TIM単価予測: 2023~2033年(米ドル)
□ 用途別TIM面積(平米)
□ 用途別TIM重量(kg)
□ 用途別TIM売上(米ドル)
□ その他
● 企業プロファイル
「熱伝導材料 (サーマルインターフェイスマテリアル)2023-2033年 」は以下の情報を提供します
  • TIMの形態
  • TIM形態、TIMフィラー材料とTIMマトリックス材料のベンチマーク比較
  • 形態別商品のサマリーと比較
  • TIM組成の進化: フィラーとフォーマット
  • 全般的なTIM向上の要因
  • 業界の主要な買収事案
  • 電気自動車用バッテリー
  • EMIシールディング
  • データセンター
  • ADASエレクトロニクス
  • 5Gインフラ
  • 家電製品
  • スマートフォン
  • タブレット
  • ノートパソコン
  • 上記カテゴリー詳細と使用事例
This report provides an in-depth technical analysis of thermal interface materials for electric vehicles, data centers, EMI shielding, 5G, ADAS, and consumer electronics. 10-year granular area (m2), mass (kg), revenue (US$), and TIM unit price (US$) forecasts are given by application. The report covers recent developments of high-performance TIMs, successful commercial uses, and historic TIM player acquisition/partnerships. The report also identifies the future TIM trends.
A Thermal Interface Material (TIM) is a material used to improve heat transfer between two surfaces, typically a heat source (such as a computer processor) and a heat sink (such as a metal heatsink or other cooling system). TIMs are used everywhere ranging from batteries in electrical vehicles on the road, data center server boards to your personal smart phones and laptops, 5G base stations and advanced driver-assistance systems (ADAS) electronics.
With all these emerging technologies and fast-growing markets, the TIM market is expecting 21% CAGR growth over the next 10 years. The purpose of a TIM is to fill the small gaps and imperfections between the two surfaces, reducing the thermal resistance and increasing the heat transfer efficiency.
TIMs come in various forms, including pastes, pads, liquids, films, and many others. A TIM typically consists of a highly conductive filler in a polymer matrix. Some common matrices include silicones, polyurethanes, acrylics, and more. Each type of TIM has its own advantages and disadvantages, and the best choice for a particular application depends on factors such as cost, thermal conductivity, ease of application, and durability.
TIMs have been widely adopted in many industries such as consumer electronics, electrical vehicles, data centers, 5G, and advanced driver-assistance systems (ADAS). However, with the fast growth of many of these areas and increasing power density, TIMs are facing greater challenges in balancing costs, thermal conductivities, and other physical properties. At the same time, there are key design transitions in the target applications, such as EV batteries becoming more integrated, or data centers trending to higher powers, trends like these, among others are expected to drive a revolution of the TIM market.
This report from IDTechEx considers the forms, filler materials, and matrix materials of TIMs, benchmarks commercial products, details recent high-performance materials and their commercial successes, and identifies the market trends based on the collaboration and acquisitions of leading TIM suppliers. It also analyzes current TIM applications in fast-growing industries, along with the key drivers and requirements in each of these areas such as electric vehicle batteries, data centers, 5G infrastructure, consumer electronics (smartphones, tablets, and laptops), EMI shielding, and ADAS electronics (e.g., LiDAR, cameras, etc.). In addition, 10-year granular area (m2), mass (kg), revenue (US$), and TIM unit price (US$) forecasts were given for EV batteries, data centers, consumer electronics, ADAS electronics, and 5G infrastructure.
Emerging industries require TIMs and will impact the landscape of demand. EV remains the largest target application for TIMs but the other applications are growing very fast. Source: Thermal Interface Materials 2023-2033
Electric Vehicle Batteries
Electric vehicle (EV) batteries are currently the largest target application for thermal interface materials (TIMs). With the increasing popularity of EVs, the market demand has been increasing rapidly and this trend is expected to continue for the upcoming decade. Battery technology, as one of the core technologies in EVs is also seeing rapid changes. With the increasing demand for long mileage, there is a trend towards higher energy density, reduced weight, faster charging, and fire safety, all of which require effective thermal management and materials to support. Within EV batteries, the TIM choice highly depends on cell formats, thermal management strategies, and pack designs. This report conducts extensive research into EV battery designs, covering the transition from modular designs to cell-to-pack designs and analyzes its impacts on energy density and TIM forms. 10-year TIM area (m2), mass (kg), and revenue (US$) forecasts are provided across multiple vehicle segments (cars, buses, trucks, vans, and two-wheelers) and by TIM form (thermally conductive adhesives, gap fillers, and gap pads).
TIMs for EV can be split by TIM form, such as gap pad, gap filler, and thermally conductive adhesive. With the EV battery transition from modular design to cell-to-pack design, TCAs will have faster growth than the others. Source: Thermal Interface Materials: 2023-2033
Data Centers and ADAS Electronics
As data centers become more powerful and densely packed, the heat dissipation challenges for these components increases rapidly. If the heat is not dissipated properly, it can lead to decreased performance, shortened lifespan, and even hardware failure, thereby causing significant technical issues. This report conducts extensive research into data center components, analyzing TIMs used in commercially available server boards, line cards, switches/supervisors, and power supplies with a number of case studies. 10-year TIM area (m2), mass (kg), and revenue (US$) forecasts are provided across key data center components (processors, chipsets, switches, and power supplies) with analysis of the TIM requirements for data center applications.
With the greater demand for autonomous driving, advanced driver assistance systems (ADAS) are becoming increasingly popular. In ADAS, various electronic components such as sensors, cameras, and processors are used to collect and process data, and make decisions. These components can generate heat during operation, and with the continuous densification of designs, the heat dissipation will become a bigger challenge. If the heat is not properly managed, it can cause damage to the components, thereby affecting sensors' performance. This report provides a detailed analysis of TIM requirements for ADAS LiDAR, cameras, radar, and computers with commercial use-cases and 10-year granular TIM area (m2), mass (kg), and revenue (US$) forecasts.
Unit TIM price forecast for data centers and ADAS. Note: The prices are subject to many factors including order volume, customer relationship, TIM form and many others.
Source: Thermal Interface Materials: 2023-2033
Electromagnetic Interference (EMI) Shielding and 5G
EMI shielding plays a critical role across many industries ranging from ADAS radar, 5G antenna, to smartphones. One of the exciting segments is 5G. Compared with 4G, 5G uses higher frequencies and shorter wavelengths. The increasing frequency shrinks the sizes of antenna and associated electronics, leading to greater heat dissipation challenges. Further to this, a large number of 5G base stations need to be deployed locally because of the inherent short transmission lengths. 5G presents more EMI challenges since the effectiveness of EMI mitigation measures declines with higher frequencies because smaller wavelengths allow energy to escape through gaps in shields. To mitigate this issue, this report analyzes several EMI TIMs that can provide both EMI shielding and high thermal conductivities. In contrast to traditional board-level shields (BLSs), with a layer of TIM inside and outside the shield, a single layer of TIM and EMI absorber can be used directly on the chip to make contact with the heat sink, which not only improves overall thermal performance but also reduces manufacturing complexity.
Schematic drawing of an EMI TIM being applied directly on an integrated circuit (IC) component. Source: IDTechEx
The increased infrastructure density and power dissipation requirement in 5G infrastructure combined with the technology transition leads to a large market for TIMs. This report highlights and discusses the thermal and EMI challenges around 5G infrastructure, along with the solutions from current designs in the form of teardowns or use-cases and progression for the future design with granular market forecasts for station size and frequency.
In addition to the topics discussed above, this report from IDTechEx also covers the TIM markets for many other fast-growing areas including smartphones, tablets and laptops. Further to this, the report analyzes the prices and thermal conductivities of various high-performance TIMs segmented by carbon-based fillers (graphene, graphite, carbon nanotubes, etc.) and metal-based fillers (gallium, indium, etc.) to provide a comprehensive analysis of the high-performance TIM trends.
Report MetricsDetails
Historic Data2018 - 2022
CAGRThermal Interface Material market to exhibit 21% CAGR over the next 10 years.
Forecast Period2023 - 2033
Forecast UnitsUS$, kg, m2
Regions CoveredWorldwide
Segments CoveredElectric Vehicle Battery Packs, Data Centers, 5G, Consumer Electronics, Electromagnetic Interference Shielding, ADAS (advanced driver-assistance system)
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アイディーテックエックス株式会社 (IDTechEx日本法人)
担当: 村越美和子
Table of Contents
1.1.Introduction to Thermal Interface Materials (TIM)
1.2.Properties of Thermal Interface Materials
1.3.Thermal Conductivity Comparison of TIM Formats
1.4.Comparisons of Price and Thermal Conductivity
1.5.Differences between thermal pads and grease - (1)
1.6.Differences between thermal pads and grease - (2)
1.7.TIM by application - area forecast
1.8.TIM by application - mass forecast
1.9.TIM by application - market size/revenue forecast
1.10.TIM Forecast for EV Batteries
1.11.TIM Forecast for Data Centers
1.12.TIM requirements for data center applications
1.13.TIM Forecast for ADAS Sensors
1.14.TIM requirements for ADAS components
1.15.Trends in consumer electronics: TlM utilization
1.16.TIM & Heat Spreader Forecast For Consumer Electronics
1.17.Total TIM area forecast for 5G stations
1.18.Company Profiles
2.1.1.Introduction to TIMs - (1)
2.1.2.Introduction to TIMs - (2)
2.1.3.Key Factors in System Level Performance
2.1.4.Thermal Conductivity vs Thermal Resistance
2.2.Comparison of Key Factors by TIM Form
2.2.1.Properties of Thermal Interface Materials
2.2.2.Comparisons of Price and Thermal Conductivity
2.2.3.Thermal Conductivity by TIM Format
2.2.4.Price Comparison of TIM Fillers and TIM Matrix Gap Pads
2.2.6.SWOT - Gap Pads Thermal Gels/ Gap Fillers
2.2.8.SWOT - Thermal Gels/Gap Fillers Thermal Greases
2.2.10.SWOT - Thermal Greases Phase Change Materials (PCMs)
2.2.12.SWOT - Phase Change Materials (PCMs) Adhesive Tapes
2.2.14.SWOT - Adhesive Tapes and TCA Potting/Encapsulants
2.2.16.SWOT - Potting/Encapsulants
2.3.Advanced TIMs
2.3.1.Summary of Advanced TIMs
2.3.3.Metal Filled Polymer TIMs
2.3.4.Boron Nitride Nanostructures
2.4.TIM Dispensing Equipment
2.4.1.Dispensing TIMs Introduction
2.4.2.Challenges for Dispensing TIM
2.4.3.Low-volume Dispensing Methods
2.4.4.High-volume Dispensing Methods
2.4.5.Compatibility of Meter, Mix, Dispense (MMD) System
2.4.6.TIM Dispensing Equipment Suppliers
2.4.7.Use cases - TIM PrintTM - Suzhou Hemi Electronics
2.5.Historic Major TIM Acquisition
2.5.1.Henkel Acquires Bergquist
2.5.2.Parker Acquires Lord
2.5.3.DuPont Acquires Laird
2.5.4.Henkel Acquires Thermexit Business From Nanoramic
2.5.5.DuPont Failed to Acquire Rogers
3.1.1.Introduction to EMI shielding
3.1.2.EMI use-cases
3.1.3.Considerations of TIMs in EMI Shielding
3.1.4.EMI Shielding - Dielectric Constant
3.2.EMI and TIMs in ADAS
3.2.1.Applications of TIMs in EMI Shielding for ADAS Radars
3.2.2.Laird's - CoolShield and CoolShield-Flex Series
3.2.3.Density and Thermal Conductivity of TIMs for Radar — TIM and EMI for ECUs
3.3.EMI and TIMs in 5G
3.3.1.EMI is More Challenging in 5G
3.3.2.EMI Shielding - Next Growth Driver for TIMs
3.3.3.Antenna De-sense
3.3.4.Multifunctional TIMs as a Solution
3.3.5.Dual functionalities - heat dissipation and EMI shielding - Laird's CoolZorb (1)
3.3.6.Dual functionalities - heat dissipation and EMI shielding - Laird's CoolZorb (2)
3.3.7.EMI Gaskets
3.3.9.Schlegel - TIM and EMI
3.3.10.TIM Combined with EMI Shielding Properties
3.4.EMI and TIMs in other applications
3.4.1.Consumer Electronics - Graphite
3.4.2.Use-Case: Synthetic Graphite Sheet - DSN
3.4.3.Price Comparison of Graphite Sheets
3.4.4.Use Case: Panasonic G-TIM (1)
3.4.5.Use Case: Panasonic G-TIM (2)
3.4.6.Players - EMI TIMs
4.1.1.Introduction to thermal interface materials for EVs
4.1.2.TIM pack and module overview
4.1.3.TIM application - pack and modules
4.1.4.TIM application by cell format
4.1.5.Key properties for TIMs in EVs
4.1.6.Gap pads in EV batteries
4.1.7.Switching to gap fillers from pads
4.1.8.Dispensing TIMs introduction
4.1.9.Challenges for dispensing TIM
4.1.10.Thermally conductive adhesives in EV batteries
4.1.11.Material options and market comparison
4.1.12.TIM chemistry comparison
4.1.13.The silicone dilemma for the automotive market
4.1.14.Thermal interface material fillers for EV batteries
4.1.15.TIM filler comparison and adoption
4.1.16.Thermal conductivity comparison of suppliers
4.1.17.Factors impacting TIM pricing
4.2.TIM in cell-to-pack designs
4.2.1.TIM pricing by supplier
4.2.2.What is cell-to-pack?
4.2.3.Drivers and challenges for cell-to-pack
4.2.4.What is cell-to-chassis/body?
4.2.5.Cell-to-pack and Cell-to-body Designs Summary
4.2.6.Gravimetric energy density and cell-to-pack ratio
4.2.7.Outlook for cell-to-pack & cell-to-body designs
4.2.8.Gap filler to thermally conductive adhesives
4.2.9.Thermal conductivity shift
4.3.TIM players in EVs
4.3.1.TCA requirements
4.3.8.Epoxies Etc.
4.3.9.H.B. Fuller
4.3.12.Parker Lord
4.3.13.Polymer Science
4.3.16.Wacker Chemie
4.4.TIM EV use cases
4.4.1.Audi e-tron
4.4.2.BYD Blade
4.4.3.Chevrolet Bolt
4.4.4.Fiat 500e
4.4.5.Ford Mustang Mach-E
4.4.6.MG ZS EV
4.4.7.Nissan Leaf
4.4.8.Smart Fortwo (Mercedes)
4.4.9.EV use-case: Hyundai IONIQ 5/Kia EV6
4.4.10.Rivian R1T
4.4.11.Tesla Model 3/Y
4.4.12.Tesla 4680 pack
4.4.13.EV use-case summary
4.5.TIM forecasts for EVs
4.5.1.TIM use by vehicle and by year
4.5.2.TIM demand per vehicle
4.5.3.TIM Forecast for EV batteries by TIM type (kg)
4.5.4.TIM forecast for EV batteries by TIM type (revenue, US$)
4.5.5.TIM Forecast for EV batteries by vehicle type (kg and US$)
5.1.1.Introduction to data centers
5.1.2.Thermal management needs for data centers
5.1.3.Power use effectiveness
5.1.4.Data center downtime causes significant problems
5.1.5.Data center equipment - top level overview
5.1.6.Data center structure
5.1.7.Data center switch topology - three layer and spine-leaf architecture
5.1.8.K-ary fat tree topology
5.2.TIM data center players and use cases
5.2.1.Where are TIMs used in data centers?
5.2.2.Common types of TIMs in data centers - line card level
5.2.3.TIMs in data centers - line card level - transceivers
5.2.4.TIMs in server boards
5.2.5.Server board layout
5.2.6.TIMs for data center - server boards, switches and routers
5.2.7.Data Center Switch Players
5.2.8.How TIMs are used in data center switches - FS N8560-32C 32x 100GbE Switch
5.2.9.WS-SUP720 supervisor 720 module
5.2.10.Ubiquiti UniFi USW-Leaf Switch
5.2.11.FS S5850-48S6Q 48x 10GbE and 6x 40GbE Switch
5.2.12.Cisco Nexus 7700 Supervisor 2E module
5.2.13.How does data center power supply system work?
5.2.14.TIMs for power supply converters (1): AC-DC and DC-DC
5.2.15.TIMs for data center power supplies (2)
5.2.16.TIMs for data center power supplies (3)
5.2.17.How TIMs are used in data center power supplies (4)
5.2.18.How TIMs are Used in Data Center Power Supplies (5)
5.2.19.How TIMs are used in data center power supply (6)
5.2.20.TIMs for data centers - power supply converters
5.3.TIMs in data center - trends and forecasts
5.3.1.TIM trends in data centers
5.3.2.Estimating the TIM areas in server boards
5.3.3.Number of server boards per rack and data center
5.3.4.Total TIM area in server boards
5.3.5.Estimating the number of data center switches
5.3.6.Area of TIM per switch
5.3.7.TIM area for leaf and spine switch
5.3.8.TIM area for leaf and spine switch forecast
5.3.9.TIM consumption in data center power supplies
5.3.10.Number of power supplies forecast and TIM area forecast
5.3.11.Forecast summary - TIM area for different data center components
5.3.12.Forecast summary - TIM mass for different data center components
5.3.13.Forecast summary - TIM revenue for different data center components
5.3.14.TIM requirements for data center applications
6.1.2.Thermal Management Differences: 4G vs 5G Smartphones
6.2.Use cases
6.2.1.Overview of Thermal Management Materials Application Areas
6.2.2.Use-case: Apple iPhone X
6.2.3.Use-case: Samsung Galaxy S9 (1)
6.2.4.Use-case: Samsung Galaxy S9 (2)
6.2.5.Galaxy Note 9 Carbon Water Cooling System
6.2.6.Use-case: Oppo R17
6.2.7.Use-case: Samsung Galaxy S10 and S10e
6.2.8.Use-case: LG v50 ThinQ 5G
6.2.9.Use-case: Samsung Galaxy S10 5G
6.2.10.Use-case: Samsung Galaxy Note 10+ 5G
6.2.11.Use-case: Apple iPhone 12
6.2.12.Use-case: LG v60 ThinQ 5G
6.2.13.Use-case: Nubia Red Magic 5G
6.2.14.Use-case: Samsung Galaxy S20 5G
6.2.15.Use-case: Samsung Galaxy S21 5G
6.2.16.Use-case: Samsung Galaxy Note 20 Ultra 5G
6.2.17.Use-case: Huawei Mate 20 X 5G
6.2.18.Use-case: Sony Xperia Pro
6.2.19.Use-case: Apple iPhone 13 Pro
6.2.20.Use-case: Google Pixel 6 Pro
6.2.21.Use-case: iPhone 14 Pro Max
6.2.22.Use case: Samsung Galaxy Z Fold4
6.2.23.Use case: Oneplus Pro 10
6.2.24.Smartphone Thermal Material Estimate Summary
6.2.25.Trends in Smartphone Thermal Material Utilization
6.2.26.Graphitic Heat Spreaders
6.2.27.Emerging Advanced Material Solutions
6.2.28.Insulation Material
6.2.29.Insulation Material (2)
6.2.30.Use case: iPad Pro 9.7"
6.2.31.Use case: iPad Pro 11"
6.2.32.Use case: Samsung galaxy tab A8
6.2.33.Use case: MacBook Pro 2019
6.2.34.Use case: MacBook Air 2022 - could more effective TIM help to remove traditional fan cooling?
6.2.35.Use case: Microsoft Surface Laptop 3 13.5''
6.2.36.Use case: Microsoft Surface Laptop 5
6.2.37.Use case: HUAWEI MateBook D 14
6.2.38.Trends in Consumer Electronics: TIM Utilization
6.3.1.Consumer Electronics Unit Forecast
6.3.2.Thermal Interface Material and Heat Spreader Area Forecast in Consumer Electronics
6.3.3.Thermal Interface Material and Heat Spreader Mass Forecast in Consumer Electronics
6.3.4.Thermal Interface Material and Heat Spreader Market Size Forecast in Consumer Electronics
7.1.1.Typical Sensor Suite for Autonomous Cars
7.1.2.The Sensor Trifactor
7.1.3.Sensors and Their Purpose
7.2.Thermal Management in ADAS Sensors
7.2.1.What are the Challenges?
7.3.TIMs for ADAS Cameras
7.3.1.Camera Anatomy
7.3.2.Thermal Interface Materials for ADAS Cameras
7.3.3.Bosch ADAS Camera
7.3.4.Tesla's Triple Lens Camera
7.3.5.ZF S-Cam4 Triple and Single Lens Cameras
7.4.TIMs for ADAS Radar
7.4.1.Radar Anatomy
7.4.2.Board Trends
7.4.3.Radars are Getting Smaller
7.4.4.Thermal Interface Materials for ADAS Radars
7.4.5.Bosch 77 GHz Radar
7.4.6.Bosch Mid-Range Radar
7.4.7.MANDO Long-Range Radar
7.4.8.DENSO DNMWR006 Radar
7.4.9.DENSO DNMWR010 Radar
7.4.10.GM Adaptive Cruise Control Radar
7.4.11.TIM with Radar Board Trends
7.5.TIMs for ADAS LiDAR
7.5.1.Temperature and LiDAR
7.5.2.LiDAR Thermal Considerations
7.5.3.Thermal for LiDAR
7.5.4.Thermal Interface Materials for ADAS LiDAR Delta3
7.5.6.Continental Short-Range LiDAR
7.5.7.Ouster OS1-64 LiDAR
7.5.8.Valeo Scala LiDAR
7.6.TIMs for ADAS Computers and ECUs
7.6.1.Possible New TIM Locations: Laser Driver Dies
7.6.2.Computers and ECUs in ADAS
7.6.3.Lack of TIMs in Previous ECU Designs
7.6.4.Audi zFAS Computer
7.6.5.Tesla's Computer Generations
7.6.6.Tesla's Liquid-Cooled MCU/ECU
7.6.7.Thermal Interface Materials in the ECU
7.6.8.ADAS Chip Power Progression — TIM and EMI for ECUs
7.6.10.Henkel — ECU Case Study
7.6.11.Audi zFAS
7.6.12.Tesla HW 2.5
7.6.13.Tesla HW 3.0
7.7.TIM Players in ADAS
7.7.5.Henkel — TIM for Cameras
7.7.6.Henkel — TIM for Radars
7.7.7.Laird — ADAS TIMs
7.7.9.Parker — TIMs for Cameras
7.7.11.Shin Etsu
7.7.12.Summary of Performance for TIM Players
7.7.13.Thermal Interface Materials for ADAS Sensors
7.8.TIM Requirements and Total Forecasts for ADAS Sensors
7.8.1.TIM Requirements for ADAS Components
7.8.2.TIM Properties by Application
7.8.3.Density and Thermal Conductivity of TIMs for ADAS
7.8.4.TIM Requirements for ADAS Components
7.8.5.TIM Forecast for ADAS (Area) 2020-2033
7.8.6.TIM Forecast for ADAS (Tonnes) 2020-2033
7.8.7.TIM: Price Analysis
7.8.8.TIM Forecast for ADAS ($ Millions) 2020-2033
8.1.1.Anatomy of a Base Station: Summary
8.1.2.Baseband Processing Unit and Remote Radio Head
8.1.3.Path Evolution from Baseband Unit to Antenna
8.1.4.TIM Types in 5G
8.1.5.Value Proposition for Liquid TIMs
8.2.TIM Suppliers for 5G - Boron Nitride Fillers
8.2.3.Henkel - Liquid TIMs for Data & Telecoms
8.2.5.Laird (DuPont)
8.2.9.TIM Suppliers Targeting 5G Applications
8.2.10.TIM Properties and Players for 5G Infrastructure
8.3.TIMs for Antenna
8.3.1.TIM Example: Samsung 5G Access Point
8.3.2.TIM Example: Samsung Outdoor CPE Unit
8.3.3.TIM Example: Samsung Indoor CPE Unit
8.3.4.TIM Forecast for 5G Antenna by Station Size
8.3.5.TIM Forecast for 5G Antenna by Station Frequency
8.4.TIMs for BBU
8.4.1.The Six Components of a Baseband Processing Unit
8.4.2.Thermal Material Opportunities for the BBU
8.4.3.Examples of 5G BBUs
8.4.4.TIM in BBUs
8.4.5.BBU Parts I: Main Control Board
8.4.6.BBU Parts II & III: Baseband Processing Board & Transmission Extension Board
8.4.7.BBU Parts IV & V: Radio Interface Board & Satellite-card Board
8.4.8.BBU parts VI: TIM Area in the Power Supply Board
8.4.10.TIM for 5G BBU
8.5.TIMs for 5G Power Supplies
8.5.1.Power Consumption in 5G
8.5.2.Challenges to the 5G Power Supply Industry
8.5.3.The Dawn of Smart Power?
8.5.4.GaN Systems - GaN Power Supply and Wireless Power
8.5.5.Power Consumption Forecast for 5G
8.5.6.TIM Forecast for Power Supplies
8.6.Total TIM Forecasts for 5G
8.6.1.Total TIM Area Forecast for 5G Stations: 2023-2033
8.6.2.Total TIM Mass Forecast for 5G Stations: 2023-2033
8.6.3.Total TIM Revenue Forecast for 5G Stations: 2023-2033
8.6.4.Total TIM Area Forecast for 5G Stations: 2023-2033
9.1.TIM area forecast summary by application
9.1.1.TIM By Application - Area Forecast: 2023-2033
9.1.2.TIM Area Forecast for EV Batteries: 2023-2033
9.1.3.TIM Area Forecast for 5G Stations: 2023-2033
9.1.4.TIM Area Forecast for ADAS: 2023-2033
9.1.5.TIM and Heat Spreader Area Forecast for Consumer Electronics: 2023-2033
9.1.6.TIM Area Forecast For Data Centers: 2023-2033
9.2.TIM mass forecast by application
9.2.1.TIM By Application - Mass Forecast: 2023-2033
9.2.2.TIM Mass Forecast for 5G Stations: 2023-2033
9.2.3.TIM Mass Forecast for ADAS: 2023-2033
9.2.4.TIM and Heat Spreader Mass Forecast For Consumer Electronics: 2023-2033
9.2.5.TIM Mass Forecast For Data Centers: 2023-2033
9.2.6.TIM Mass Forecast for EV batteries: 2023-2033
9.3.TIM revenue forecast by application
9.3.1.Unit TIM Price Forecast: 2023 - 2033
9.3.2.TIM Revenue Forecast: 2023-2033
9.3.3.TIM Revenue Forecast for 5G Stations: 2023-2033
9.3.4.TIM Revenue Forecast For ADAS: 2020-2033
9.3.5.TIM and Heat Spreader Mass Forecast For Consumer Electronics: 2023-2033
9.3.6.TIM Revenue Forecast For Data Center: 2023-2033
9.3.7.TIM Revenue Forecast for EV Batteries: 2023-2033
10.2.ADA Technologies
10.4.AOS Thermal
10.11.Cambridge Nanotherm
10.15.Deyang Carbonene
10.16.Dow Corning
10.21.Hitek Electronic Materials
10.22.HyMet Thermal Interfaces
10.23.Indium Corporation
10.25.KULR Technology
10.26.Nanoramic Laboratories
10.27.NeoGraf Solutions
10.28.Parker Lord
10.30.Schlegel Electronic Materials
10.31.Sixth Element
10.32.Smart High Tech


スライド 447
企業数 32
フォーキャスト 2033
ISBN 9781915514547

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