Ultra-Low Power OLED Microdisplay In Wearable Near-To-Eye Visualization (Wearable Europe 2017)

Dr Uwe Vogel, Hd of Div. Microdisplays & Sensors Deputy Director
Fraunhofer FEP
Germany
 

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Europe 2017 Presentation - Fraunhofer FEP*
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プレゼンテーション概要

Augmented-reality (AR) near-to-eye (NTE) applications regularly demand long battery life above full-frame rate. This is to report on a new backplane architecture combined with highly efficient OLED to achieve tremendously reduced power consumption. This approach is going to enable low-form factor and low-weight clip-on NTE visualization modules attachable to regular prescription glasses.

講演者の経歴 (Uwe Vogel)

Uwe Vogel: Skilled worker in semiconductor microelectronics in 1983, diploma in information technology in 1991, doctoral degree in biomedical engineering in 1999. Center for Applied Optics Studies at Rose-Hulman Institute of Technology (Terre Haute/Indiana, 1992), Dresden University hospital/hearing research (1995-98). With Fraunhofer in Dresden/Germany since 1998, starting as analog IC designer. Since 2000 head of Analog/Mixed-Signal IC design group, later on focusing on OLED-on-Silicon, i.e., design of OLED-on-silicon devices, technology and applications (e.g., in smart glasses or/and optoelectronic sensors), backplanes, OLED microdisplay for near-to-eye display/augmented-reality, 3D displays, display driver IC, high-speed data transmission. Since 2010 head of division "Microdisplays and Sensors", since 2014 Deputy Director of Fraunhofer FEP.

会社紹介 (Fraunhofer FEP)

Fraunhofer FEP logo
The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (www.fep.fraunhofer.de) is located in Dresden/Germany and focuses on developing innovative solutions, technologies and processes for surface modification and organic electronics. Along with strong experience in electron beam and plasma technology Fraunhofer FEP is the leading independent applied R&D service provider which combines organic electronics technology with silicon CMOS integrated circuitry (IC) design and process integration. Its aim is to transfer the results of R&D in the field of combined silicon-organic micro-electronic devices towards production by focusing on specific process development, components, system integration and applications based on OLED-on-Silicon technology. Therefore we are continuously seeking partners to further develop and commercialize recent achievements and topics, such as unique OLED microdisplay architectures, large-area OLED microdisplays for VR, ultra-low power/low-latency and 'bi-directional' micro-displays combining image display with embedded image sensing for AR, or micro-patterning for improved power efficiency and color of RGB OLED displays. Beyond that the technology and design expertise also becomes applied to opto-electronic sensor solutions making use of silicon-CMOS-based and/or organic photodetectors (OPD) and embedded illumination for interactive optical fingerprint or surface topology imaging sensors, single-chip reflection light barriers, optical sensors requiring embedded illumination (such as slope, stray light, wave front sensors), lab-on-chip modules with embedded microfluidics, or bio- and environmental monitoring.
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