次世代AIシステム向けCPO（コパッケージド・オプティクス）技術と市場展望

As data center architectures evolve to support rapidly expanding AI, HPC, and cloud workloads, they face mounting pressure from exponential growth in I/O requirements. Future server designs must accommodate far more pins per package, larger silicon areas, and rising I/O power consumption, factors that increasingly strain traditional electrical interconnects. Optical interconnects are emerging as a compelling solution, offering greater reach, higher bandwidth, and improved energy efficiency. At the same time, pluggable optical modules, the workhorse of today's network switches, are encountering limitations in power efficiency and bandwidth density due to their constrained integration. Collectively, these pressures are steering system architects toward co-packaged optics (CPO), where tighter electrical-optical integration can fundamentally overcome the scaling limits of pluggable modules.

 

 

In this webinar, Dr. Yu-Han Chang, a Principal Technology Analyst, will share some insights from IDTechEx's brand new "Co-Packaged Optics (CPO) 2026-2036: Technologies, Markets, and Forecasts" market research report. This brand-new report explores technical innovations and packaging trends, analyzing the value chain. It evaluates industry players and forecasts CPO's impact on AI architecture. Central to the report is the recognition of advanced semiconductor packaging (2.5D & 3D) as the cornerstone of co-packaged optics technology. IDTechEx places significant emphasis on understanding the potential roles that various semiconductor packaging technologies may play within the realm of CPO.

 

 

Key points covered in this webinar will include: