Development of Isotropic conductive adhesive for metallic substrates used in RFID tag assembly (RFID Smart Labels USA 2006)

Mr Jay Shah, Senior Associate
Emerson & Cuming, United States


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For over 50 years, Emerson & Cuming has focused on providing high performance conductive inks and adhesives for the most demanding electronic industries around the world. Their state-of-the-art antenna inks provide the best solution for solvent and temperature-sensitive substrates, while their novel snap cure die attach adhesives enable low cost tag assembly at high production speeds. The company remains at the forefront as a proven leader with exceptional antenna inks and die attach adhesives for RFID tag assembly.
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