Emerson & Cuming
Emerson & Cuming
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HQ Country
United States
Profile
For over 50 years, Emerson & Cuming has focused on providing high performance conductive inks and adhesives for the most demanding electronic industries around the world. Their state-of-the-art antenna inks provide the best solution for solvent and temperature-sensitive substrates, while their novel snap cure die attach adhesives enable low cost tag assembly at high production speeds. The company remains at the forefront as a proven leader with exceptional antenna inks and die attach adhesives for RFID tag assembly.
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Emerson & Cuming
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2019
8 Feb 2019
Barrier Films and Thin Film Encapsulation for Flexible and/or Organic Electronics 2019-2029
IDTechEx Report:
2008
4 Jul 2008
Henkel in China
To promote electronics material advancement in China, Henkel and Shanghai University, in conjunction with several leading research universities, have now entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center.13 Feb 2008
IDTechEx Review: Flexible Displays Conference Part 2
Part 2 of the IDTechEx review of the Flexible Displays Conference in Phoenix.2007
19 Nov 2007
Printable circuit assembly materials
Emerson & Cuming has added the well-known series of polymer thick films, conductive inks and coatings of sister company Acheson Electronic Materials to its own circuit assembly materials offerings.13 Jun 2007
Inorganic Printed Electronics - The Great Opportunity
The future $300 billion market for printed electronics is emerging via thin film electronics. The contribution of organic materials to this is greatly publicized but the best devices being developed usually rely on inorganic or combined inorganic/organic technology. The more select groups developing these inorganic materials and devices have a great future. IDTechEx has published the first study on Inorganic Printed and Thin Film Electronics. Here Dr Peter Harrop summarises some of the findings.3 Apr 2007
Europe Takes Leadership in Printed Electronics
Surprisingly, Europe has been pulling ahead of the rest of the world in many aspects of printed and potentially printed electronics just lately. Learn more in this article.2006
29 Mar 2006
Development of Isotropic conductive adhesive for metallic substrates used in RFID tag assembly
Emerson & Cuming, United States
2005
21 Sep 2005
Novel enabling technology for high speed RFID tag assembly
Emerson & Cuming, Belgium
29 Jun 2005
Options for conductive inks
Acheson Colloids, United States
29 Jun 2005
Conductive adhesives for high speed assembly: low temperature, spot cure technology
Emerson & Cuming, United States
7 Jun 2005
Implementing RFID - Smart Labels Europe 2005
6 May 2005
Smart Labels USA 2005
RFID from pallet to item level: How to manufacture, implement and use RFID Smart Labels20 Jan 2005
Smart Labels USA launched
