Printed, Flexible and Organic Electronics

Printed, Flexible and Organic Electronics

Printed Electronics, being thin film silicon or inorganic or organic semiconductors, can be used to form Thin Film Transistor Circuits (TFTCs), such as replacing the functionality of simple silicon chips. TFTCs also employ thin film conductors and dielectrics and the ultimate objective is to make many different components at the same time - such as displays, batteries, sensors, microphones etc using the same materials or at least the same deposition techniques thus saving cost and improving reliability. Some TFTCs will be capable of covering large areas to affordably form electronic billboards, smart shelves and so on. They will be lightweight, rugged and mechanically flexible. Often they will be made by rapid, high-volume reel-to-reel processing even forming a part of regular printing processes for graphics. These circuits will be cheap enough to permit electronics where envisaged silicon chips are always or almost always too expensive, where multiple components and needed, and where silicon is impracticle (e.g. not flexible, brittle, thick etc).
フィルター:
Printed, Flexible and Organic Electronics
Company
Topic
Show
 
2015
21 Apr 2015

Companies with One Trillion Euros sales present at the IDTechEx Show!

Companies with over One Trillion Euros in combined sales will present at IDTechEx's Event on Emerging Technologies. Tesco, Qualcomm, Ericsson, United Technologies, Jaguar Land Rover, Shell provide insights, products and use cases on printed electronics, energy harvesting, wearable technologies, IoT and more.
21 Apr 2015

India Sets Up Centre of Excellence for Large Area Flexible Electronics

A Centre of Excellence for Large Area Flexible Electronics (FlexE Center) at IIT Kanpur in India has been established by the Department of Electronics and Information Technology, MCIT, Government of India.
21 Apr 2015

Innovative materials for future products

The Fraunhofer Institute for Silicate Research ISC will present multifunctional materials for new applications and novel products at the IDTechEx trade show in Berlin on 28 and 29 April.
20 Apr 2015

Ceradrop and Optomec Expand Partnership

Optomec, a global supplier of 3D Additive Manufacturing systems has expanded its current distribution partnership with Ceradrop, a MGI Group company. Under the expanded agreement, Ceradrop will now integrate core Aerosol Jet Sprint technology into their line of inkjet printers, while continuing their role as reseller of Optomec standard Aerosol Jet systems in France. Aerosol Jet, combined with Inkjet technology, brings new and complementary capabilities, permitting printing of finer features and processing of a wider variety of materials, all in a unique digital material deposition platform.
20 Apr 2015

GCell discusses their photovoltaics technologies and markets

GCell shows an iPad keyboard powered by their photovoltaic device.
17 Apr 2015

OLED Lighting at Panasonic: Video interview with IDTechEx

IDTechEx interviews Prof Komoda of Panasonic, finding out more about their work with OLED lighting.
16 Apr 2015

Inkjet printer could produce tool to identify infectious disease

Consumers are one step closer to benefiting from packaging that could give simple text warnings when food is contaminated with deadly pathogens like E. coli and Salmonella, and patients could soon receive real-time diagnoses of infections such as C. difficile right in their doctors' offices, saving critical time and trips to the lab.
16 Apr 2015

Thermal interface materials market set to grow to $3.7bn by 2025

New research conducted by IDTechEx finds that the thermal interface materials market - including tapes, adhesives, greases, gels, pastes, elastomeric pads, phase change materials, graphite, solders, compressible materials and liquid metals - will grow from $1.7 billion in 2015 to $3.7 billion in 2025.
16 Apr 2015

VTT develops a method for printing WORM memories

VTT has developed a method for printing memory circuits directly, e.g. onto consumer packaging.
16 Apr 2015

Megatrend Electronics at the IDTechEx Show! 28-29 April, Berlin

Today's megatrends are easy to identify. They are changes that will endure for a long time and profoundly impact most of us on earth.
15 Apr 2015

Experts present disruptive technologies at Wearable Technology Europe

There are just two weeks to go until IDTechEx host Printed Electronic Europe 2015, at Berlin's Estrel Conference Center on 28 & 29 April.
14 Apr 2015

Will Printed Electronics & 3D Printing disrupt PCB rapid prototyping?

The vast majority of electronic circuits are currently made using Printed Circuit Boards (PCBs) that are both rigid and flat. The market for traditional Printed Circuit Boards (PCBs) currently stands at around $60bn. This established technology is used across a variety of different final applications. Several technologies related to traditional PCBs are now emerging in the form of commercial products that address one or more of the limitations with traditional PCBs. Some of these new technologies aim to improve the current workflow by allowing traditional PCB designs to be prototyped more quickly, cheaply and locally. Other new technologies aim to fill gaps in markets such as wearable technologies where rigid PCBs have significant limitations. Finally, some new technologies promise to completely revolutionise the electronics industry by allowing fully 3D printed electronics with traces and components used anywhere inside an object.
14 Apr 2015

Cambridge Nanosystems

Cambridge Nanosystems is a UK-based start-up born out of Cambridge University that specialises in advanced materials. In this profile update, Dr Khasha Ghaffarzadeh covers their latest developments.
Included are:
14 Apr 2015

Grafoid

Grafoid is an unusual graphene company. It is in fact an investment company that is active in the field of graphene and utilizes the graphene hype.
13 Apr 2015

AGFA and printed electronics - interview with IDTechEx

This interview with AGFA and IDTechEx was conducted at Printed Electronics USA - the largest event in the world on the topic.
10 Apr 2015

New Dow Corning EA-4600 hot melt adhesive

Dow Corning introduced new Dow Corning® EA-4600 Hot Melt Room-Temperature Vulcanization (RTV) Black Adhesive for improved assembly of consumer electronics and other demanding high-volume manufacturing operations.
10 Apr 2015

BASF acquires nanowire technology from Seashell

BASF Corporation and Seashell Technology have announced that BASF has acquired Seashell's technology, patents and know-how for silver nanowires.
10 Apr 2015

RR Donnelley CustomWave brand of RFID printed electronics

R. R. Donnelley & Sons Company have announced the introduction of CustomWave RFID Solutions
9 Apr 2015

Carestream Tollcoating interview with IDTechEx at Printed Electronics

Carestream Tollcoating offers precision toll coating services, specializing in the application of aqueous and solvent coatings on flexible substrates for a wide range of industrial, medical, electronic and other advanced materials applications.
8 Apr 2015

Why does co-locating our graphene event make sense?

The graphene technology and industry is too nascent to stand on its own legs as a stand-alone conference unless the focus is purely academic. The industry is at a stage where it needs to aggressively building up its application pipeline.