Printed, Flexible and Organic Electronics

Printed, Flexible and Organic Electronics

Printed Electronics, being thin film silicon or inorganic or organic semiconductors, can be used to form Thin Film Transistor Circuits (TFTCs), such as replacing the functionality of simple silicon chips. TFTCs also employ thin film conductors and dielectrics and the ultimate objective is to make many different components at the same time - such as displays, batteries, sensors, microphones etc using the same materials or at least the same deposition techniques thus saving cost and improving reliability. Some TFTCs will be capable of covering large areas to affordably form electronic billboards, smart shelves and so on. They will be lightweight, rugged and mechanically flexible. Often they will be made by rapid, high-volume reel-to-reel processing even forming a part of regular printing processes for graphics. These circuits will be cheap enough to permit electronics where envisaged silicon chips are always or almost always too expensive, where multiple components and needed, and where silicon is impracticle (e.g. not flexible, brittle, thick etc).
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Printed, Flexible and Organic Electronics
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2015
29 Apr 2015

A Novel Sensor to Monitor Railway Earthworks - Energy Harvesting Case Study

TRW Conekt, United Kingdom
29 Apr 2015

Continuous Monitoring of Manufacturing Processes Dedicated to Printed Electronics

IN-CORE Systemes, France
29 Apr 2015

Low Cost Printed Electrochromic Film

Argil Inc, United States
29 Apr 2015

PowerWeave: Photovoltaic and Energy Storage Fibres, Towards a Self-Powered Fabric

Centexbel, Belgium
29 Apr 2015

Advances in Thin, Printable Conductors

Agfa-Materials, Belgium
29 Apr 2015

Cost-Efficient Barrier Films for Flexible OLED Applications

Aixtron SE, Germany
29 Apr 2015

Printed Electronics, Available Technologies, Possible Functions, Respective Costs

PragmatIC Printing Limited, United Kingdom
29 Apr 2015

Re imagining our Energy Future by Creating a Lasting Community Impact

Shell Brands International /Pavegen, Switzerland
29 Apr 2015

Development and Commercialization of Conductive Inks for Printed Electronic Applications

Clariant Produkte (Deutschland) GmbH, Germany
29 Apr 2015

High Resolution Printing Technology for R2R PE Process

Asahi Kasei Corporation, Japan
29 Apr 2015

Printed Hybrid Logic Circuits

Palo Alto Research Center, a Xerox company, United States
29 Apr 2015

Barrier Films for Technical Applications

Fraunhofer Institute for Silicate Research ISC, Germany
29 Apr 2015

Energy Harvesting: RMT Components, Solutions, Developments

RMT Ltd, Russia
29 Apr 2015

Development of High-Performing Semiconducting Polymers for Transistors and Solar Cells

Imperial College London, United Kingdom
29 Apr 2015

Characterization of Glass Like Barrier Coating with a Differential Pressure Method: Use in Research, Product Development, Fabrication and Measurement Based on Standard

Oike & Co Ltd, Japan
29 Apr 2015

Smart Functional Materials for Energy Harvesting: from Laboratory to Commercialisation

University of Bolton, United Kingdom
29 Apr 2015

Highly Efficient, Non-Phosphorescent OLED Solutions for the Whole Color Spectrum

CYNORA GmbH, Germany
29 Apr 2015

A Novel Capacitive Energy Harvesting Concept

Fraunhofer IZM, Germany
29 Apr 2015

Ultrathin Glass as Substrate for Thin Batteries

SCHOTT AG, Germany
29 Apr 2015

Assessment of MEMS Vibration Energy Harvesting for High Temperature Sensing Applications

GE Aviation Systems - Newmarket, United Kingdom