Printed, Flexible and Organic Electronics

Printed, Flexible and Organic Electronics

Printed Electronics, being thin film silicon or inorganic or organic semiconductors, can be used to form Thin Film Transistor Circuits (TFTCs), such as replacing the functionality of simple silicon chips. TFTCs also employ thin film conductors and dielectrics and the ultimate objective is to make many different components at the same time - such as displays, batteries, sensors, microphones etc using the same materials or at least the same deposition techniques thus saving cost and improving reliability. Some TFTCs will be capable of covering large areas to affordably form electronic billboards, smart shelves and so on. They will be lightweight, rugged and mechanically flexible. Often they will be made by rapid, high-volume reel-to-reel processing even forming a part of regular printing processes for graphics. These circuits will be cheap enough to permit electronics where envisaged silicon chips are always or almost always too expensive, where multiple components and needed, and where silicon is impracticle (e.g. not flexible, brittle, thick etc).
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Printed, Flexible and Organic Electronics
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2009
30 Nov 2009

Progress at Artificial Muscle

IDTechEx recently visited Artificial Muscle in Sunnyvale, CA. The company develops, designs and manufactures actuators, sensors, and power generation components based on electroactive polymers. The main focus of the company today is on haptic feedback systems - i.e. systems that give the user a physical response to the touch. Conventionally, metal dome switches are employed in keypads, for example, to provide sensory feedback to the user when something has been pressed. However, with the move to touch screen displays, the haptic response is lacking.
27 Nov 2009

Western Michigan University and Daetwyler progress Gravure Printing

Western Michigan University and Daetwyler R&D Corporation partnership. The AccuPress printing system is Daetwyler R&D's high-precision gravure press for the printing of sheet-fed, layer-to-layer applications. The unit includes many features to maintain the high-accuracy required for printed electronics uses. The unit is scheduled to be delivered to WMU in April of 2010.
27 Nov 2009

New Pressurex Extreme Low® sensor film

Sensor Products Inc. announces Pressurex Extreme Low®, the newest addition to its tactile pressure-indicating sensor films.
27 Nov 2009

Pressurex® Film promotes uniform nip pressure distribution

Pressurex® film from Sensor Products Inc. is a quick, accurate and economical way to detect and correct pressure variations in the lamination of dry film resist to the board substrate.
27 Nov 2009

Pressurex® sensor film and solar module manufacturing

Pressurex® provides a low cost solution for quality control checks during equipment setup, calibration, as well as re-qualification of a solar module production line.
26 Nov 2009

Teijin's world first silicon-on-plastic integration technology

Teijin Limited (Teijin) have developed the world's first technology to integrate silicon onto general-purpose plastic substrates, working in cooperation with NanoGram Corporation (NanoGram), a world-leading company in the development of nano materials.
26 Nov 2009

Spin-coating and inkjet printing of conductive silver

Room temperature preparation of conductive silver features using spin-coating and inkjet printing
24 Nov 2009

Aerotech APT Series Pan and Tilt Systems Meet the Needs of Security...

Aerotech Pan and Tilt (APT) systems are designed for your most demanding positioning requirements. Building on Aerotech's extensive experience in building AZ/EL positioning systems, direct-drive rotary stages, and motion simulators for the military, government agencies, academic institutions, and private industry, the APT series expands our product line to meet the needs of the security, defense, and surveillance markets worldwide.
24 Nov 2009

Printed Electronics: What end users want

Over 2,250 organizations around the world are developing an entirely new platform of materials, manufacturing processes and associated equipment for printed electronics. This printed electronics industry will eventually become far larger than the semiconductor industry today
23 Nov 2009

Printed power at Printed Electronics USA 2009

Electronics and electrics are becoming ubiquitous, the devices appearing on and in higher and higher volume products including e-labels and e-packaging. This calls for different forms of battery, capacitor and other energy storage because priorities such as environmental credentials, thinness and compatibility with energy harvesting (eg. solar cells) come to the fore alongside life and cost.
23 Nov 2009

SonoPlot® introduces new Microplotter® II product

SonoPlot, Inc. have announced the release of the company's new GIX Microplotter II printing instrument at the Printed Electronics USA 2009 show in San Jose, CA.
23 Nov 2009

EDI at PE USA focuses on specialised coating and film capabilities

Multi-layer flexible or thin-film structures will play a central role in coming generations of both photovoltaic (PV) and metal-ion battery technologies. At Stand 55 during Printed Electronics USA / Photovoltaics USA, Extrusion Dies Industries, LLC (EDI) will highlight film and coating die systems that it has developed for such structures—systems already applied successfully in both solar and battery applications.
23 Nov 2009

Palo Alto Research Center Inc exhibits at Printed Electronics USA 2009

PARC showcasing material characterization, application development, and full system prototyping capabilities at Printed Electronics USA 2009
23 Nov 2009

Nano ePrint secures grant for research and development

Nano ePrint has already demonstrated that its nano-scale devices not only dramatically simplify manufacture, but also achieve over 10 times the performance and over 100 times the density of conventional printed electronics.
23 Nov 2009

Fairchild Semiconductor's MicroFET™

Fairchild Semiconductor's MicroFET thin package helps designers avoid compromising their designs by providing them with an industry-leading low profile package. Working with design engineers and procurement managers, Fairchild developed an integrated P-Channel PowerTrench® MOSFET and Schottky diode, as a single-package solution to meet critical efficiency and thermal needs in battery charging and power-multiplexing applications.
23 Nov 2009

Rogers Durel to showcase printed electronics & EL lighting solutions

The Durel Division of Rogers Corporation will be showcasing its Printed Electronics and EL Lighting Solutions at the upcoming Printed Electronics show, December 2-3, in San Jose, CA (Rogers booth #43).
20 Nov 2009

Stanford-led research helps overcome barrier for organic electronics

Electronic devices can't work well unless all of the transistors, or switches, within them allow electrical current to flow easily when they are turned on. A team of engineers has determined why some transistors made of organic crystals don't perform well, yielding ideas about how to make them work better.
19 Nov 2009

Applied Materials, Merck and Braunschweig University awarded funding

Applied Materials, Inc., Merck KGaA and the Braunschweig University of Technology (TU-BS) have announced that they have been awarded a grant by Germany's Federal Ministry of Education and Research (BMBF) to develop processes to lower the cost of manufacturing organic light-emitting diode (OLED) lighting for general illumination applications. Applied will spearhead the three-year project, named Light InLine (LILi), joining forces with Merck, a leading manufacturer of high performance OLED materials and TU-BS, an internationally recognized center for OLED research. Work on the LILi project will be centered at Applied Materials' advanced development facility in Alzenau, Germany.
18 Nov 2009

Printed electronics needs new design rules

The first cars looked like horse drawn carriages - suboptimal and using the design rules of the past. So it is with most printed electronics today. It is frequently burdened with old fashioned components like silicon chips, cylindrical capacitors, chip resistors and button batteries.
18 Nov 2009

Taiyo America Expands Conductive Ink Offerings for Printed Electronics

Taiyo America, Inc. (Carson City, NV), a subsidiary of Taiyo Ink Mfg. Co., Ltd.® (Tokyo, Japan) the leader in solder mask technology for printed circuit boards, now offers an expanded line of conductive ink products for printed electronics and photovoltaic applications. Taiyo Ink, who has long offered conductive inks for printed wiring board and flat panel display applications, is introducing the ECM®-100 line of conductive inks.