Technology evolution for the die and substrate attach paste
24 July 2019 by Dr Khasha Ghaffarzadeh
This is part III of our series on metal sintering in power electronics (PE). In the last two parts, we considered (1) the key trends shaping the power electronic technology, and (2) the key existing and emerging approach seeking to replace Al wire bonding to boost thermal reliability in PE packages. In this article, we examine how and why metal sintering is emerging as an alternative to, or as the next generation of, die attach technology, seeking to replace solder in demanding applications.
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