Research Articles

As AI workloads continue to scale, thermal management has become one of the most critical and costly elements of data center infrastructure. The cost analysis of server cooling components highlights an important reality: while cold plates often receive the most attention, they represent only a fraction of the total thermal system cost. The true economic picture emerges when server-level cooling is aggregated to the rack and facility level.

With the ever-increasing need for heat dissipation, high-performance thermal interface materials (TIMs) with higher thermal conductivity and other properties are becoming essential. Driven by this trend, a number of high-performance TIMs are emerging. This article primarily introduces the advantages and drawbacks of advanced carbon-based TIMs. However, it is worth noting that many other TIMs offer superior performance. For a holistic view of the TIM industry, please refer to IDTechEx's research report, "Thermal Interface Materials 2026-2036: Technologies, Markets and Forecasts".

As of 2025, single-phase direct-to-chip (D2C) cooling remains the dominant solution for high-end GPU thermal management. However, as thermal design power (TDP) continues to climb, two-phase D2C cooling is expected to become essential, with large-scale adoption projected around 2026-2027.

Thermal interface materials (TIMs) are composed of thermal fillers and matrix materials. The choice of thermal filler materials, geometries, and loading percentages can greatly impact not only the thermal properties of TIMs but also other aspects such as cost, dielectric strength, compressibility, and viscosity. This article shares more about some common thermal fillers, pros and cons of different fillers, and market trends,.

As of 2025, single-phase direct-to-chip (D2C) liquid cooling remains the dominant solution for high-end GPU thermal management. However, with thermal design power (TDP) continuing to rise, the industry is approaching the limits of what single-phase cooling can handle. Two-phase D2C cooling is expected to enter large-scale deployment around 2027.

As semiconductor packaging surges toward 2.5D and 3D architectures, managing thermal resistance at the interface becomes mission-critical. With traditional thermal interface materials (TIMs) no longer sufficient, the next generation of TIMs offers the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. The market size of next-generation TIM1 and TIM1.5 for advanced semiconductor packaging will exceed at a CAGR of 31% from 2026 to 2036.

IDTechEx forecasts that the market size of thermal interface materials (TIMs) will exceed US$7 billion, covering multiple industries including EV batteries, EV power electronics (TIM1 and TIM2), data centers, advanced semiconductor packaging (TIM1 and TIM1.5), ADAS sensors, consumer electronics, and 5G. Find out more in this new article by Senior Technology Analyst Yulin Wang.

In this article, IDTechEx explores the power and thermal challenges associated with 3D-stacked chips, as well as the emerging solution trends the industry is adopting or proposing for both 2.5D and 3D packaging technologies. The insights are based on IDTechEx's latest report, "Thermal Management for Advanced Semiconductor Packaging 2026-2036: Technologies, Markets, and Opportunities", which offers a comprehensive analysis of thermal management strategies for advanced semiconductor packaging technologies.

In this video, IDTechEx analyst Yulin Wang talks you through the state-of-play of humanoid robots.

Collaborative robots (cobots), driven by AI, machine vision, and modular designs, are revolutionizing smart factories by enhancing human-robot collaboration, achieving 95%+ accuracy in tasks, and targeting a US$29.8 billion market by 2035.

Faced with rising raw material costs from tariffs, labor shortages, and increasing operational pressures, the automotive and material-handling industries are turning to collaborative robots (cobots) as a flexible, cost-saving solution to boost efficiency, reduce downtime, and remain competitive in a rapidly evolving manufacturing landscape.

The article highlights the rapid growth of the humanoid robot market through 2035, emphasizing a projected $10 billion opportunity in sensory components, especially tactile sensors, LiDAR, and cameras, as demand for dexterous and spatially aware robots increases

In-cabin sensing innovations from Tesla, Seeing Machines, and LG Electronics—leveraging radar, 3d cameras, and AI—are transforming vehicle safety and personalization, setting the stage for a US$6 billion market by 2035.

By 2025, major automotive players such as Tesla and BYD are set to scale humanoid robot deployment over 10x, paving the way for a projected 1.6 million units in use across the industry by 2035, according to IDTechEx. While current unit costs exceed US$100,000, prices are forecast to drop to US$20,000, driving broader adoption in both the automotive and logistics sectors.

Collaborative robots (cobots) are reshaping automotive manufacturing by enabling safe, flexible, and efficient human-robot collaboration across tasks like assembly, screwing, and polishing, thanks to advanced force sensing, AI-driven vision, and intuitive programming. As electric vehicle production grows and factories seek greater agility, cobots offer a scalable solution, with their market projected to expand significantly through 2045.

The article highlights how automotive OEMs are increasingly integrating AI-driven in-cabin sensing technologies into software-defined vehicle architectures, particularly in response to upcoming regulatory requirements like the EU's Advanced Driver Distraction Warning (ADDW).

As regulatory frameworks such as the EU's Advanced Driver Distraction Warning (ADDW) near enforcement, automotive OEMs increasingly integrate in-cabin sensing technologies with software-defined vehicle architectures. This shift, evident at CES 2025, marks a pivotal moment in the automotive industry as OEMs leverage existing hardware—such as infrared and RGB cameras—to develop new revenue streams and enhance user experiences.

The total market size of liquid cooling is set to have a 6-fold increase over the upcoming decade. In this short video, IDTechEx Senior Technology Analyst Yulin Wang explains some of the commercial trends for data center liquid cooling.

The data center cooling value chain is long, complicated, and chaotic, consisting of multiple stakeholders. Data center cooling happens on multiple levels including chip and server level, as well as the rack and facility level.

In this article, IDTechEx will summarize the main trends of thermal management in the data center and EV power electronics industries, as well as the recent developments of thermal interface materials used.

As of 2024, single-phase direct-to-chip (D2C) cooling dominates the high-end GPU thermal management market. However, with the increasing thermal design power (TDP), two-phase D2C cooling will be required.

The rapid rise of AI and HPC (high performing computing) applications is driving a fundamental shift in data center cooling strategies. As chips like Nvidia's B200 and Intel's Falcon Shores GPU push the limits of thermal design power, direct-to-chip and immersion cooling solutions are becoming critical to managing the heat loads in modern data centers.

With the ever-increasing need for heat dissipation, high-performance thermal interface materials with higher thermal conductivity and other properties are becoming essential. Driven by this trend, a number of high-performance TIMs are emerging. This article primarily introduces the advantages and drawbacks of advanced carbon-based TIMs. However, it is worth noting that many other TIMs offer superior performance.

Thermal interface materials (TIMs) are composed of thermal fillers and matrix materials. Thermal fillers are highly thermally conductive substances, while matrix materials are typically used to enhance mechanical properties.

With the trend from Si IGBT to SiC MOSFET in electric vehicle (EV) power electronics, the junction temperature is expected to increase from 150°C to 175°C with the potential to exceed 200°C. This brings significant challenges for thermal management.

Thermal management for EV power electronics has long posed significant challenges. The ongoing shift from Si IGBT and SiC MOSFET to potentially GaN HEMT in the future results in higher junction temperatures and increased demand for die-attach materials in EV power modules. In traditional Si IGBT power modules, die-attach materials like Pb95Sn5 and Pb92.5Sn5Ag2.5 struggle to meet reliability requirements for packaging power devices in high-temperature applications due to creep-fatigue concerns.

Thermal interface materials (TIMs) are increasingly adopted, with the market size expected to exceed US$8 billion by 2034. Thermal fillers play a crucial role in TIMs as they directly affect properties such as thermal conductivity, viscosity, cost, abrasiveness, and several other factors.

The move towards 800V and above in electric vehicles is already well underway, spearheaded by numerous automotive OEMs such as GM, Hyundai, VW, and Lucid Motors. These platforms enhance efficiency by minimizing joule losses and allowing for the downsizing of high-voltage cabling, thus reducing weight.

In-cabin monitoring, comprising both Driver Monitoring System (DMS) and Occupancy Monitoring System (OMS), has experienced significant growth since the start of 2024. Traditionally, DMS relies on 2D infrared cameras, while OMS utilizes 3D sensing modules like 3D time-of-flight (ToF) cameras or radar modules.

With the shift towards electric vehicles, end-users are becoming less concerned about traditional differentiators like engine horsepower and are placing greater emphasis on smart interior functions. This trend is compelling automotive OEMs to invest more efforts in enhancing interior features, thereby adding greater value to their products and distinguishing them from other vehicles.

Due to rising labor costs and labor shortages, coupled with the surge in e-commerce and logistics demands, the mobile robotics market is rapidly expanding. IDTechEx's forecast indicates that the annual market size for mobile robotics in logistics and delivery is set to approach US$150 billion, marked by a robust double-digit compound annual growth rate (CAGR) over the next two decades.

Driver monitoring systems (DMS) have gained considerable momentum, driven by the escalating SAE autonomous driving levels and regulatory frameworks in key regions like the USA, Europe, China, Japan, and others.

Flytrex is one of the leading companies in autonomous drone delivery. In 2022, the company reported a 765% increase in deliveries after achieving regulatory approval from the Federal Aviation Agency to begin its automated drone delivery services in the Dallas-Fort Worth area. Founded in 2013, Flytrex has made significant efforts in developing their autonomous drones for delivery services. However, as a common barrier for the drone industry, it takes Flytrex a long time before they get the green light from regulatory bodies.

The battery deservedly takes the major focus when it comes to technology development in EVs. But an EV's powertrain has to act holistically to operate with optimal performance and interact with the passenger cabin's conditioning system. This means that the thermal management of the motors, power electronics, and how this all interacts is just as important as the battery.

In the realm of automation, where innovation meets industry, a groundbreaking revolution is sweeping through the landscape of automated guided vehicles (AGVs). Traditionally confined indoors for tasks like intralogistics and material handling, AGVs are breaking free into the great outdoors, driven by advancements in navigation technologies and the emergence of Autonomous Mobile Robots (AMRs).

As reported by Nvidia's Q2 financial statement, its second-quarter data center's revenue was a record US$10.32 billion, up 141% from the previous quarter and up 171% from a year ago. With the increasing demand for high-performance servers in data centers, IDTechEx has seen challenges in data center thermal management and tremendous opportunities in this industry.