Dr Kai Baer, Managing Director
adphos Digital Printing GmbH
Adphos - presentation*
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Speaker Biography (Kai Baer)
Since July 2009 Dr. Bär is the Managing Director/President of the adphos Innovative Technologies GmbH, adphos Thermal Processing GmbH and adphos Digital Printing GmbH. In November 2008 Dr. Bär adopts the position of the Chief Executive Officer of the AdPhos AG. In January 2005 he adopts the work of the Managing Director/President of the AdPhos Steel GmbH. From August 2001 till December 2004 he was acting as Chairman of the Board of AdPhos AG and from March 1999 till July 2001 he was one of the Members of the Boards. Dr. Bär was one of the founders of the IndustrieSerVis GmbH (Rechtsvorgänger of the AdPhos AG) and he practiced as Managing Partner from April 1996 till February 1999 of the IndustrieSerVis GmbH (foundation October 1995 till March 1996). He was the leader of the business segment "High Temperature Technology and Installations" at IABG, Ottobrunn from June 1993 till September 1996 and he was responsible for the Technology-Program "HERMES-Heatstructure-Tests" from June 1990 till December 1993 at IABG, Ottobrunn. From August 1989 till Mai 1990 he was working as academic staff member at IABG, Ottobrunn. Dr. Bär graduated on July 1990 as Dr.-Ing. (with award) at the faculty of mechanical engineering at the RWTH Aachen.
Company Profile (adphos Digital Printing GmbH)
View adphos Digital Printing GmbH Timeline
adphos Group is focused on the development of adphosNIR® technology which dramatically reduces the time and space required for thermal processes and provides quantum leaps forward in efficiencies for our global customers.
adphos applications are suitable for process color inkjet and also functional coatings (pre-post coatings) as well as printed electronics applications.
Working together with coating application manufactures (like flexo, screen or InkJet) adphos can allow customers to enter the world of printed electronics without compromise to substrate and running speed.
adphos will highlight this year its ultrafast sintering of e.g. Nanosilver based real conductive structure on 3D-components.