Designing and Making Parts Using Injection Molded Structural Electronics (IMSE™) (Printed Electronics Europe 2019)

Dr Antti Keranen, CTO, Co-Founder
TactoTek
Finland
 

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Presentation Summary

Injection Molded Structural Electronics (IMSE™) is a solution that combines in-mold labeling and surface decoration, printed electronics and discrete electronic components inside of 3D plastic structures. We'll demonstrate a specific use case: mechanical, electrical, and optical design techniques and considerations for an elegant IMSE™ automotive overhead control panel (OHCP).

Speaker Biography (Antti Keranen)

Dr. Antti Keränen is the technology mastermind behind TactoTek structural electronics. His main responsibilities are developing and maintaining the IP portfolio, directing R&D innovation activities, and communicating the company technology vision and practical applications to the community. Antti has been a major contributor to the technology of in-mold electronics since 2005, when he joined the VTT printed electronics team. He is an Adjunct Professor of theoretical physics at the University of Oulu where he earned his PhD in 2002.

Company Profile (TactoTek Corporation)

TactoTek Corporation logo
TactoTek Injection Molded Structural Electronics (IMSE™) is a revolutionary technology that changes the way electronic parts such as HMI surfaces are designed and built. It integrates printed electronics (circuitry, sensors, and antennas) and discrete electronic components (LEDs, ICs, etc.) inside of thin 3D plastic structures. Embedding functionality such as lighting, controls, gesture sensors and antennas within 3D-shaped surface structures significantly reduces the thickness and weight of parts, delivers excellent touch and antenna performance and brings unique design opportunities for the next generation of HMIs.
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