LPKF
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LPKF
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2025
27 Nov 2025
Co-Packaged Optics (CPO) 2026-2036: Technologies, Market, and Forecasts
IDTechEx Report: Dr Yu-Han Chang
20 Aug 2025
Glass in Semiconductors 2026-2036: Applications, Emerging Technologies, and Market Insights
IDTechEx Report: Dr Xiaoxi He
27 Jan 2025
Silicon Photonics and Photonic Integrated Circuits 2025-2035: Technologies, Market, Forecasts
IDTechEx Report: Dr Yu-Han Chang
2024
13 Dec 2024
Hardware for HPC, Data Centers, and AI 2025-2035: Technologies, Markets, Forecasts
IDTechEx Report: Dr Shababa Selim and Dr Yu-Han Chang
29 Nov 2024
In-Mold Electronics 2025-2035: Forecasts, Technologies, Markets
IDTechEx Report:
23 Oct 2024
Materials and Processing for Advanced Semiconductor Packaging 2025-2035: Technologies, Players, Forecasts
IDTechEx Report: Dr Yu-Han Chang
17 Oct 2024
Advanced Semiconductor Packaging 2025-2035: Forecasts, Technologies, Applications
IDTechEx Report: Dr Yu-Han Chang
11 Apr 2024
3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets
IDTechEx Report:
2023
6 Dec 2023
Vitron (Through-Glass Via Manufacturing) — A LPKF Trademark
Vitron is a supplier that offers laser drilling tools and manufacturing services to its clientele in advanced semiconductor packaging industry (glass packaging). IDTechEx spoke with Vitron at SEMICON Europe 2023.
Included are:
6 Sep 2023
EMI Shielding for Electronics 2024-2034: Forecasts, Technologies, Applications
IDTechEx Report: Dr Yu-Han Chang
17 Jul 2023
Flexible Hybrid Electronics 2024-2034
IDTechEx Report:
2022
12 Dec 2022
LPKF
IDTechEx interviewed LPKF regarding the company's latest developments, with a focus on technologies for advanced semiconductor packaging.
Included are:
2020
14 Jul 2020
LPKF (Laser Direct Structuring)
LPKF provides laser based manufacturing solutions, spanning many applications including thin glass processing, plastic welding, laser-transfer printing and electronics manufacturing. In this profile, we focus on laser direct structuring (LDS), a method of selectively metallizing molded plastic.
Included are:
