Mr Nicholas Langston, Sr. Manager Business Development
USA 2015 Presentation - TE Connectivity*
USA 2015 Audio Presentation - TE Connectivity*
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The burgeoning wearables market is creating opportunities for technologists and designers to collaborate in ways never before possible. Still, finding the killer application in smart garments remains a challenge. This talk will look at some of the challenges in bridging the gap between textiles and electronics and propose some solutions.
講演者の経歴 (Nicholas Langston)
Nick Langston is an experienced technology professional, driven by a passion for innovation and design. He worked in the semiconductor industry for twenty years beginning as a mechanical designer of hardware interfaces for IC test and characterization, managed product teams and business development. As a sought after speaker, he's presented at conferences and technical workshops around the world and has published several articles relating to semiconductor test hardware, as well as served as an authority on wearable trends and technologies. Most recently, Nick held the position of Executive Vice President at R&D Circuits, a PCB manufacturer based in New Jersey. He joined TE Connectivity in December of 2013 to lead the newly formed Wearable Lab Team in Menlo Park, CA which is dedicated to driving innovative design, products and technologies, and partnerships in the emerging wearables space.
会社紹介 (TE Connectivity)
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TE Connectivity (NYSE: TEL) is a US$14 billion global technology leader. Our connectivity and sensor solutions are essential in today's increasingly connected world. We collaborate with engineers to transform their concepts into creations - redefining what's possible using intelligent, efficient and high-performing TE products and solutions proven in harsh environments. Our 80,000 employees, including 7,500 design engineers, partner with customers in over 150 countries across a wide range of industries. We believe EVERY CONNECTION COUNTS - http://www.TE.com.