Conductive adhesives for high speed assembly: low temperature, spot cure technology (Smart Labels USA 2005)

Ms Wanda O'Hara, Senior Applications Engineer
Emerson & Cuming, United States


Emerson & Cuming presentation - updated 5 Jul*
Emerson & Cuming audio*

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Presentation Summary

  • Low cost substrates have limited temperature conditions to bond electronics to
  • Low temperature, fast cure adhesives for RFID Smart Labels

Speaker CV

Wanda O'Hara is a Sr. Applications Engineer with Emerson & Cuming, specializing in Conductive Adhesives.
She has been with the company for 4 years and has a BA in Material Sciences.
Other publications include the use of conductive adhesives as solder alternatives, on flexible circuits, hybrids and RFID applications.

Company Profile

For over 50 years, Emerson & Cuming's focus has been on designing and manufacturing high performance material solutions for electronic industries around the world. Our expansive breadth of encapsulant, adhesive, and thermal management technologies combined with our decades of experience allow us to create solutions to difficult electric and electronic engineering challenges, providing maximum design latitude for our customers. Our vision is to be your first choice for circuit and component assembly solutions in the broadest sense.
We offer real solutions for virtually any environment. From Automotive Electronics, Wireless and Component assembly applications, to exciting new industries like Photovoltaic cells, RFID tags and OLEDs, Emerson & Cuming products have been engineered to perform in many different operating environments. With formulations based on epoxy, polyurethane, and silicone chemistries, we are capable of a broad range of solutions regardless of the application specifics.