Lowest Power FRAM MCU + Thermoharvesting Enable 'Lean WSN' (Energy Harvesting and Storage Europe 2012)

Burkhard Habbe is Vice President Business Development at Micropelt. He holds a degree in Mechanical Engineering from Munich's Technical University. Starting in automation Burkhard acquired a multi-disciplinary background through technical consultancy, sales and marketing in Software, Video Communications, Automated Microelectronics and Photonics Assembly, Machine Vision and High Speed Video. Today Burkhard develops markets and applications for Micropelt's thin film thermoelectrics, bringing free harvested energy to low power wireless sensors and actuators. He is still very open to discuss other target applications including photonics micro-cooling, rapid thermal cycling, and high speed, high gain thermal sensing

Horst Diewald is the world-wide Chief Architect of the MSP430 core, with responsibilities in system and product definition. In his WW role, Horst's main focus is on the future evolution of the MSP430 architecture, the "ultra-low-power" and analog features.

 

During his career at TI, Horst developed the architecture of the MSP430 with a team of engineers. He defined the CPU core, wake-up and interrupt scheme, bus architecture and peripheral system to optimize ease-of-use, high performance at lowest current consumption, and system cost of the MSP430. He holds the basic patent of the low-power scheme, and is co-inventor of the basic patent of the low-power and fast clock scheme which enables "burst-mode" concepts. He also holds a patent for the integrated FLL oscillator concept, among others.

 

He was elected Member Group Technical Staff in 1991, Senior Member of the Technical Staff in 2000, and Distinguished Member of the Technical Staff in 2003

 

Horst is affectionately known within TI as 'The Godfather of MSP430".

Micropelt GmbH, Freiburg, Germany, develops, produces and markets the world's smallest and most effective thermoelectric elements for clean-tech micro energy harvesting, thermal sensing, cycling and cooling. The company employs 20 staff and currently commissions their first million-unit production facility, also located in Germany.

Micropelt's thermoelectric chips are based on a patented scalable thin film micro-structuring platform technology, which minimizes component size while maximizing power density for energy harvesting, cooling or thermal cycling applications. Process-inherent economies-of-scale break previous cost and price barriers of conventional thermoelectrics. Batteries become obsolete as cost-free electricity from waste heat powers wireless sensor networks for their entire life. Chip-thermogenerators also boast unprecedented sensitivity, resolution and dynamics in sensing heat flux and temperature change.

Texas Instruments (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. With over 100,000 products, TI offers technology that is shaping tomorrow's innovations. Learn more at www.ti.com .