FPD Production Of Flexible Oxide TFT Circuits On GEN2 Substrate: Challenges And Horizons (Printed Electronics Europe 2018)

 

TENFlecs is a contract manufacturing facility for thin-film ICs and TFT backplanes based on IGZO and organic TFT technologies. Target applications are logic (RFID, NFC, memory, CMOS), sensors (fingerprint, X-Ray, pressure) and displays (LCD, OLED and EPD) with total capacity of up to 10,000 sqm of TFTs a year.

TENFlecs technology partners IMEC, Holst Centre and FlexEnable have decades of applied R&D experience in various fields of flexible electronics. TENFlecs partners with the leading material and equipment suppliers which make the line compatible with the technologies of Asian foundries for ramp up when demand is secured.