NCP/ACP solutions for RFID components: high-speed assembly of flip-chips (Smart Labels Europe 2005)

Mr Robert Saller, Head of International Sales Division
Delo Industrial Adhesives, Germany
 

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Presentation Summary

  • fast-curing bonding solutions for RFID
  • performance of NCP/ACP connections
  • material and adhesive selection

Company Profile

Delo has nearly 45 years of experience in the field of industrial adhesives. DELO has been working in the smart card sector with several proven records of success: The DELO products for the flip-chip industry enable secure electrical contacting and very short production times; opaque chip encapsulation compounds protect the chip against unauthorized viewing and copying; the Dam&Fill method patented by DELO enables defined geometries as well as minimum encapsulation heights.
 

Speaker CV

Robert Saller joins Delo since 15 years already and had different appointment in the Technical & Sales Department. His graduation is mechanical engineering.
 
His main activities cover new business opportunities like the Smart Card or Smart Label business

Upcoming Event

Smart Labels USA 2006
Westin Copley, Boston, MA
March 28-29, 2006
 
The fifth event in this series - in previous years over 400 people and 45 exhibitors have attended.