New and innovative possibilities for flip-chip bonding (Smart Labels USA 2005)

Stefan is responsible for project coordination and technical customer support for ACP and NCP applications in flip-chip bonding for smart label applications.

 

10/1997 - 02/2002 Studies of engineering physics with focus on micro-systems technology at the University of Applied Sciences in Munich, Germany; degree Dipl. Ing. (FH) similar to Master of Science

 

03/2002 - 06/2003 Process Applications, NanoPierce Technologies in Hohenbrunn, Munich; work content: development of NCP flip-chip processes i.e. for smart label and flip-chip LED applications

07/2003 - 03/2005 Application Engineer, DELO Industrial Adhesives in Landsberg

04/2005 - Project Manager Smart Label, DELO Industrial Adhesives in Landsberg

DELO has nearly 45 years of experience in the field of industrial adhesives. DELO develops for special applications and has established itself with high-tech adhesives and individual customer solutions on the international market. DELO has been working in the smart card sector with several proven records of success: The DELO products for the flip-chip industry enable secure electrical contacting and very short production times; opaque chip encapsulation compounds protect the chip against unauthorized viewing and copying; the Dam&Fill method patented by DELO enables defined geometries as well as minimum encapsulation heights. Detailed introductory tests, continuous monitoring and consequent further development guarantee first-class products. The special strength of the company are system solutions. In close cooperation with the customer technical requirements are analysed and extensive conceptions are created, e. g. for the integration of bonding processes in large production lines. DELO also offers curing lamps, dispensing units, cleaners and AUTOMIX systems for ideally adapted processes.