New Conductive inks Bring enhanced Performance & Design Flexibility to RFID Labels (Smart Labels USA 2005)

Mr Paul Berry, Global Application Engineering Center Leader
Dow Corning, United States
 

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Dow Corning presentation - updated 5 Jul*
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Authors

Paul Berry, Application Engineering Center Manager, Dow Corning Corporation
Marjorie Dwane, Market Manager, Dow Corning Corporation
Denley Baghurst, Application Engineer, Polymeric Interconnect, Inc.

Presentation Summary

  • New generation of highly conductive silver inks for smart label antennas
  • Significant conductivity gains, tailored surfaces and process flexibility enable manufacturers to take advantage of thinner films and achieve longer read distances and improved cost of ownership in high frequency and UHF applications
  • Objective is to offer guidance for selecting the most appropriate silver ink for your application and process.

Speaker CV

Paul Berry is the Global Application Engineering Center leader for Dow Corning's Electronics Industry. In this role, he coordinates Dow Corning's application support among its five labs worldwide. He has application experience in product lines such as conformal coatings, gels and encapsulants, pads for connector sealing, thermally conductive materials and conductive inks. Paul has over seven years of experience in the electronics field. He is a licensed Professional Engineer. Paul earned his B.S.M.E. from Michigan State University and his MBA from Central Michigan University.

Company Profile

Dow Corning Electronics is a global provider of innovative materials and solutions, advanced applications technologies and unique services to the entire electronics chain - from silicon manufacturing and semiconductor fabrication to device packaging and complete module and system assembly.