Mr Paul Berry, Global Application Engineering Center Leader
Dow Corning, United States
Dow Corning presentation - updated 5 Jul*
Dow Corning audio*
If you already have access, please [Login]
Access can be purchased via IDTechEx Credits
Paul Berry, Application Engineering Center Manager, Dow Corning Corporation
Marjorie Dwane, Market Manager, Dow Corning Corporation
Denley Baghurst, Application Engineer, Polymeric Interconnect, Inc.
Paul Berry is the Global Application Engineering Center leader for Dow Corning's Electronics Industry. In this role, he coordinates Dow Corning's application support among its five labs worldwide. He has application experience in product lines such as conformal coatings, gels and encapsulants, pads for connector sealing, thermally conductive materials and conductive inks. Paul has over seven years of experience in the electronics field. He is a licensed Professional Engineer. Paul earned his B.S.M.E. from Michigan State University and his MBA from Central Michigan University.
Dow Corning Electronics is a global provider of innovative materials and solutions, advanced applications technologies and unique services to the entire electronics chain - from silicon manufacturing and semiconductor fabrication to device packaging and complete module and system assembly.