Mr Patrick Duis, Growth Program Manager 3D Printing
DSM Engineering Plastics
IDTechEx Show! USA Presentation - DSM Engineering Plastics*
USA 2016 Audio Presentation - DSM Engineering Plastics*
If you already have access, please [Login]
Access can be purchased via IDTechEx Credits
DSM and Nexeo (Nexeo3d.com) are committed to enter the 3D printing industrial market with new polymers that are specially developed for 3D printing. By Adding a totally new PA6, TPE and PETP into the market we are able to create parts that can handle more mechanical loads and demanding environment. In DSM we have developed materials by understanding the process by predictive modelling of the process (warpage and fusion) and translate this in state of the art FDM materials for industrial application
Speaker Biography (Patrick Duis)
Patrick Duis is Growth program manager 3D printing at DSM engineering plastics. Before this role he was 8 years in application development for the electrical and electronics team. The last 3 years he worked as Global innovation manager identifying new trends, markets and products for DSM engineering plastics. After his study in plastics technology in the Netherlands he started working 7 years as plastics engineer and tool designer at TE connectivity and later at Polynorm.
Company Profile (DSM)
View DSM Timeline
DSM is a global 3D Printing materials provider committed to helping our clients design whatever their imaginations can create. Through collaborative partnerships and groundbreaking materials innovation, we're pushing the boundaries of possibilities to deliver brighter lives for generations to come. Since the late 1980s, DSM's Somos® group has earned a global reputation for stereolithography material innovation. Prototypes made from Somos® resins closely replicate the functionality of engineered thermoplastics, but are delivered with increased speed and accuracy.
We are continually advancing the performance benefits of our extensive line of Somos® materials. You'll find a solution for just about any stereolithography application.