OLED Backplane Manufacturing Processes for High Temperature Resistant PEEK Film from Victrex (Printed Electronics USA 2012)

Dr Iryna Yakimets, Program Manager
Holst Centre
Dec 05, 2012.


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Presentation Summary

Dennis van den Berg(1), Martin van Neer(1), Karin Tempelaars(1), Linda van Leuken(1), Stuart Green(2), Iryna Yakimets(1)
(1) Holst Centre TNO, (2) Victrex Polymer Solutions
A novel PEEK film, optimized for flexible electronics with high dimensional stability, optical clarity, chemical and moisture resistant properties, has been developed by Victrex Polymer Solutions. This PEEK film can be used as substrate for the flexible electronics and allows the processing temperature window above 250°C for extensive period of time. In this paper we are presenting an overview of the work which has been done in order to develop the processes and technologies for the manufacturing of the thin film transistors based OLED backplanes compatible with the high temperature resistant films such the engineered PEEK from Victrex.

Speaker Biography (Iryna Yakimets)

Dr. Iryna Yakimets studied Mechanics of Materials at the Universite de Technologie de Compiegne (France) and gained her PhD in 2004. After working few years at Nottingham University (UK) on water dependent mechanical behavior of biopolymer films, she obtained a Research Position at Holst Centre (Eindhoven, Netherlands) in 2008. Dr. Yakimets currently working on dimensional stability of polymer foils used as substrates for flexible electronics.

Company Profile (Holst Centre)

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Holst Centre is an independent open-innovation R&D centre in Netherlands that develops generic technologies for Wireless Autonomous Sensor Technologies and Flexible Electronics. Holst Centre was set up in 2005 by imec (Flanders, Belgium) and TNO (The Netherlands) with support from the Dutch Ministry of Economic Affairs and the Government of Flanders.
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