Thermomechanical Reliability and Integration Challenges for New Hybrid and Organic Materials with Multi-Functional Property Sets (Printed Electronics USA 2012)


Prof Reinhold H. Dauskardt, Professor and Associate Chair
Stanford University
United States
 
Dec 06, 2012.

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Speaker Biography (Reinhold H. Dauskardt)

Dr. Reinhold H. Dauskardt, is Professor and Associate Chair of the Department of Materials Science and Engineering and Prof. in the Dept. of Mechanical Eng. and in the Dept. of Surgery at Stanford. His research interests lie in the study of the relationship between chemistry and molecular structure of thin films and bulk materials and their adhesive and cohesive properties, thermomechanical behavior, and fracture and fatigue properties. Material interests include thinfilm and layered structures and metal-polymer laminates with hierarchical interphase regions for aerospace, IC and energy technologies, bulk metallic glasses, biomaterials, and soft tissues, specifically regeneration processes in cutaneous wounds. He has won numerous awards including U.S. Department of Energy Outstanding Scientific Accomplishment Award (1989), Alexander von Humboldt Research Award (2002), ASM International Silver Medal (2003), IBM Faculty Award (2006), the Semiconductor Industry Association University Researcher Award (2010), the Henry Maso Award for fundamental contributions to skin science (2011) and the IBM Shared University Research Award (2011). He was elected Fellow of the American Ceramics Society (2008), and of the ASM International (2010).

Company Profile (Stanford University)

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