Mr Nicholas Langston, Sr. Manager Business Development
Nov 19, 2014.
• Overview of wireless power technology
• Challenges in deploying wireless charging in wearables
• Vision of how wireless power will evolve in devices and apparel
Speaker Biography (Nicholas Langston)
Nick Langston is an experienced technology professional, driven by a passion for innovation and design. He worked in the semiconductor industry for twenty years beginning as a mechanical designer of hardware interfaces for IC test and characterization, managed product teams and business development. As a sought after speaker, he's presented at conferences and technical workshops around the world and has published several articles relating to semiconductor test hardware, as well as served as an authority on wearable trends and technologies. Most recently, Nick held the position of Executive Vice President at R&D Circuits, a PCB manufacturer based in New Jersey. He joined TE Connectivity in December of 2013 to lead the newly formed Wearable Lab Team in Menlo Park, CA which is dedicated to driving innovative design, products and technologies, and partnerships in the emerging wearables space.
Company Profile (TE Connectivity)
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TE Connectivity (NYSE: TEL) is a $13 billion world leader in connectivity. The Company designs and manufactures products at the heart of electronic connections for the world's leading industries including automotive, energy and industrial, broadband communications, consumer devices, healthcare, and aerospace and defense. TE Connectivity's long-standing commitment to innovation and engineering excellence helps its customers solve the need for more energy efficiency, always-on communications and ever-increasing productivity. With nearly 90,000 employees in more than 50 countries, TE Connectivity makes connections the world relies on to work flawlessly every day.