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1. | INTRODUCTION |
1.1. | Introduction to flexible encapsulation & barrier layers |
1.2. | The need for flexible encapsulation & barrier layers |
1.3. | Comparison of performance metrics for different encapsulation solutions |
1.4. | Comparison of performance metrics for different encapsulation solutions |
2. | BARRIER TECHNOLOGY - COMMERCIALIZATION STATUS |
2.1. | Technology trends from major adopters - Samsung |
2.2. | Technology trends from major adopters - LG & others |
2.3. | Technology trends:TFE vs. barrier lamination |
2.4. | Technology trends: Single or multilayer - Substrate handling |
2.5. | Technology trends: The future of ALD in encapsulation |
2.6. | Technology trends: The future of ALD in encapsulation |
2.7. | Technology trends: plastics vs. flexible glass |
2.8. | Technology trends: plastics vs. flexible glass (2) |
3. | ENCAPSULATION- BASIC PRINCIPLES |
3.1. | Barrier technology principles |
3.2. | Barrier key requirements |
3.3. | Barrier key requirements |
3.4. | Encapsulation: Dyads |
4. | SURFACE SMOOTHNESS - DEFECTS |
4.1. | Surface smoothness considerations |
4.2. | Porosity pinholes and cracks |
4.3. | Barrier properties as a function of the thickness of the deposited film |
4.4. | Micro defects |
4.5. | Pinholes |
4.6. | Particles |
4.7. | Eliminating scratches and cracks |
4.8. | Resistance to scratching/cracking |
4.9. | Nano-defects |
5. | BARRIER TECHNOLOGIES - PAST DEVELOPMENTS |
5.1. | Vitex - The PML process |
5.2. | Vitex - Multilayers and dyads |
5.3. | The multilayer barrier and the Vitex flexible glass. |
5.4. | Vitex - Multilayers and dyads |
5.5. | Vitex - hybrid encapsulation and Samsung acquisition |
5.6. | GE - graded barrier |
5.7. | GE - graded barrier - Sabic acquisition |
5.8. | POLO - Fraunhofer |
6. | ADVANCES IN ENCAPSULATION MANUFACTURING PROCESSES |
6.1. | Advances in encapsulation manufacturing processes - ALD |
6.2. | R2R ALD |
6.3. | PECVD will compete head to head with ALD |
7. | BARRIER ADHESIVES |
7.1. | Barrier adhesives |
7.2. | Barrier adhesives: 3M |
7.3. | Barrier adhesives: DELO - Henkel |
7.4. | Barrier adhesives: tesa |
8. | ADDRESSABLE MARKET SEGMENTS FOR ENCAPSULATION TECHNOLOGIES |
8.1. | Addressable markets - Flexible OLED displays & lighting |
8.2. | Addressable markets - plastic rigid precede fully flexible OLED displays |
8.3. | Addressable markets: Quantum dot (QD) LCDs |
8.4. | Addressable markets: Integration approaches for QD LCDs |
8.5. | Addressable markets: quantum dot enhancement film |
8.6. | Addressable markets: OTFTs, LCDs and electrophoretic displays |
8.7. | Addressable markets: flexible photovoltaics |
9. | MARKET FORECASTS |
9.1. | The potential significance of organic and printed inorganic electronics: flexibility, robustness & lower cost |
9.2. | Challenges with non rigid substrates |
9.3. | Inkjet printing for organic material deposition |
9.4. | ALD entering maturity in encapsulation applications |
9.5. | Application driven choice between in-line TFE and barrier film: Flexible PV and Quantum Dots |
9.6. | Barrier material forecasts 2017-2027 (sq. m) |
9.7. | Barrier revenues forecasts 2017-2027 ($ million) |
10. | COMPANY PROFILES |
10.1.1. | Toppan Printing |
10.1.2. | Vitriflex |
10.1.3. | TNO Holst Centre |
10.1.4. | Mitsubishi |
10.1.5. | 3M |
10.1.6. | Amcor |
10.1.7. | Tera-Barrier Films |
10.1.8. | Fujifilm |
10.1.9. | UDC |
10.1.10. | Konica Minolta |
10.1.11. | Samsung |
10.1.12. | LG Display |
10.1.13. | Applied Materials |
10.1.14. | Meyer Burger Group |
10.2. | Flexible glass |
10.2.1. | Schott AG |
10.2.2. | Corning |
10.2.3. | Asahi Glass Company (AGC) |
10.2.4. | Nippon Electric Glass (NEG) |
10.3. | ALD deposition for flexible barriers |
10.3.1. | ALD deposition for flexible barriers |
10.3.2. | Lotus |
10.3.3. | Beneq |
10.3.4. | Encapsulix |
11. | BARRIER MEASUREMENTS |
11.1. | The Calcium Test |
11.2. | MOCON |
11.3. | Vinci Technologies |
11.4. | SEMPA |
11.5. | VG Scienta |
11.6. | Fluorescent Tracers |
11.7. | Black Spot Analysis |
11.8. | Tritium Test |
11.9. | CEA |
11.10. | 3M |
11.11. | IMRE |
11.12. | Mass Spectroscopy - gas permeation (WVTR & OTR potential applications) |
11.13. | Kisco Uniglobe |
Slides | 208 |
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Forecasts to | 2027 |