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1. | EXECUTIVE SUMMARY AND CONCLUSIONS |
1.1. | Displays |
1.1. | The current market for printed, organic and flexible electronics |
1.1. | Comparison of Printing Technologies |
1.1.1. | Output performance comparison |
1.1.2. | Running performance comparison |
1.1.3. | Printing Type by Application |
1.1.4. | Value chain for equipment for printed electronics |
1.1.5. | Profitability |
1.1.6. | Opportunities - Component Attach |
1.2. | Lighting |
1.2. | Forecasts by printing equipment type vs component 2015-2025 |
1.2. | Four main types of printed technologies being pursued for printed electronics |
1.3. | Printed performance characteristics of the different printing types relevant to printed electronics |
1.3. | Printed Electronics Equipment Sales: Companies Look to Asia |
1.3. | Sensors |
1.3.1. | Europe Government Funding for Equipment Declines |
1.4. | PV |
1.4. | Comparison of the different printing types by a number of running parameters |
1.5. | Current status of printing by volume |
1.5. | Energy Storage |
1.6. | Touch Screens |
1.6. | The value chain for equipment supply for printed electronics |
1.7. | Printed electronics centers worldwide |
1.7. | Logic and Memory |
1.8. | Other Components |
1.9. | Leading providers of inkjet |
1.10. | Leading providers of flexo, gravure and offset |
1.11. | Leading providers of screen printing |
1.12. | Leading providers of coating |
1.13. | Leading providers of photonic curing/sintering |
1.14. | Leading providers of other |
1.15. | Logic/memory |
1.16. | OLED Display |
1.17. | OLED Light |
1.18. | Electrophoretic/E-wetting/BiStable LCD |
1.19. | Electrochromic |
1.20. | Electroluminescent |
1.21. | Battery |
1.22. | Photovoltaics |
1.23. | Sensors |
1.24. | Conductors (ink only) |
2. | INTRODUCTION |
2.1. | What is printed electronics |
2.1. | Description and analysis of the main technology components of printed and potentially printed electronics |
2.1. | Market value $ billions of only printed electronics 2015-2025 |
2.2. | Market value $ billions of only printed electronics 2015-2025 |
2.2. | Why printing? |
2.3. | Types of Printed electronics technologies/components |
2.3. | Printing techniques with a physical master vs those without a physical master |
2.4. | Market size of printed electronics 2015-2025 |
2.5. | Printing Technologies |
3. | PRINTED ELECTRONICS MARKET |
3.1. | Crystalline Silicon Photovoltaics |
3.1. | SWOT Analysis |
3.1. | Example of a grid structure |
3.2. | Sheet resistance as a function of optical transmission for different materials. Metal grids have the best performance, i.e., sheet resistance of 10 Ohm at 95% transmission. |
3.2. | Thin Film Photovoltaics |
3.3. | Touch screens |
3.3. | Comparing the optical clarity of TCFs made using different materials/processes. It is noted that the directly printed metal mesh TCFs are not completely invisible and the naked eye can detect the grid structures. |
3.4. | Players |
3.4. | Logic and memory |
3.5. | OLED displays and lighting |
3.6. | Smart Packaging |
3.7. | Transparent Conductive Films |
3.8. | Direct Printing |
4. | SCREEN PRINTING |
4.1. | Introduction |
4.1. | Key mechanical variables |
4.1. | Screen printing is one of the oldest printing processes. It incorporates a frame (E), mesh (D), image (C), squeegee (B) and ink (A). |
4.2. | Rotary screen printing wraps the mesh around a cylinder |
4.2. | Output variables |
4.2. | Screen printing forecasts 2015-2025 |
4.3. | Suitability to different devices/ components |
4.3. | Screen printing forecasts 2015-2025 |
4.3. | Screen printing forecasts 2015-2025 |
4.4. | Two of the largest markets along with their needs |
4.4. | The strengths and weaknesses of screen printing |
4.4. | Existing uses |
4.5. | Future uses |
4.6. | Innovation and technical progress |
4.6.1. | Resolution |
4.6.2. | Print on print (Double print) |
4.7. | Company profiles |
4.7.1. | A&M Kinzel Siebdruckmaschinen Ltd |
4.7.2. | Applied Materials Baccini |
4.7.3. | Asada Mesh |
4.7.4. | DEK Printing Machines Ltd |
4.7.5. | Dynamesh |
4.7.6. | Ever Bright Printing Machine Fty. Ltd |
4.7.7. | KIWO |
4.7.8. | Metal Etch Services Inc |
4.7.9. | p-tec GmbH |
4.7.10. | Saati Americas Corp |
4.7.11. | Sefar |
4.7.12. | Spartanics |
4.7.13. | SPGprints |
4.7.14. | Thieme Corporation |
4.7.15. | Thieme GmbH & Co KG |
4.7.16. | Ulano |
4.7.17. | UTZ Technologies |
4.7.18. | Werner Kammann Maschinenfabrik GmbH & Co. KG |
5. | INKJET PRINTING |
5.1. | Key variables |
5.1. | Introduction |
5.1. | Ink jet technology |
5.2. | Inkjet printing forecasts 2015-2025 |
5.2. | Inkjet printing forecasts 2015-2025 |
5.2. | Output characteristics |
5.3. | Inkjet printing forecasts 2015-2025 |
5.3. | Suitability to different devices/ components |
5.3. | Printed interconnects |
5.4. | Adaptive routing for board level packaging |
5.4. | Existing uses |
5.4. | The strengths and weaknesses of inkjet printing |
5.5. | Future uses |
5.5. | OLED/OPV encapsulation barriers, OPV/OLED lighting, signage and displays, touch screens |
5.5.1. | Printed interconnects |
5.5.2. | Mass customization |
5.5.3. | OLED and flat panel displays, OLED lighting, Touch screens, OPV |
5.5.4. | Touch panel bezels |
5.5.5. | Masking followed by plating |
5.5.6. | PV bus bars and fingers |
5.6. | Bezel (black matrix), conductive traces, spacers, bridges |
5.6. | Company profiles |
5.6.1. | Ceradrop |
5.6.2. | Fujifilm Dimatix |
5.6.3. | Kateeva |
5.6.4. | Meyer Burger PixDro |
5.6.5. | Optomec |
5.6.6. | Samsung Electro-Mechanics |
5.6.7. | SCHMID Group |
5.6.8. | Seiko Epson |
5.6.9. | SIJ Technology |
5.6.10. | Sonoplot |
5.6.11. | THG Inkjet |
5.6.12. | Unijet |
5.6.13. | Xaar |
5.7. | Less lateral growth during electroplating |
5.8. | Size of ink droplet volume versus it's radius |
6. | FLEXO PRINTING |
6.1. | Introduction |
6.1. | Flexo printing forecasts 2015-2025 |
6.1. | Flexo printing forecasts 2015-2025 |
6.2. | Flexo printed conductive lines. |
6.2. | The strengths and weaknesses of inkjet printing |
6.2. | Flexo printing forecasts 2015-2025 |
6.3. | Suitability to different devices/ components |
6.4. | Existing uses |
6.5. | Future uses |
6.6. | Company profiles |
6.6.1. | Gallus |
6.6.2. | Harper Corporation |
6.6.3. | Mark Andy |
6.6.4. | Multi Print Systems (MPS) |
6.6.5. | Nilpeter |
6.6.6. | Omet Varyflex |
7. | GRAVURE PRINTING |
7.1. | Introduction |
7.1. | Key variables |
7.1. | Gravure printing forecasts 2015-2025 |
7.2. | Output characteristics |
7.2. | Gravure printing forecasts 2015-2025 |
7.3. | Suitability to different devices/ components |
7.3. | Gravure printing forecasts 2015-2025 |
7.4. | The strengths and weaknesses of gravure printing |
7.4. | Existing uses |
7.5. | Future uses |
7.6. | Company profiles |
7.6.1. | Bobst Group |
7.6.2. | Chestnut Engineering |
7.6.3. | Comco |
7.6.4. | Harper Corporation |
7.6.5. | Komori |
7.6.6. | Mirwec Film |
7.6.7. | Nilpeter |
7.6.8. | Ohio Gravure Technologies Accupress |
8. | OTHER PRINTING TYPES |
8.1. | Other printing forecasts 2015-2025 |
8.1. | Other printing forecasts 2015-2025 |
8.1. | Other printing forecasts 2015-2025 |
8.2. | Transfer printed GaAs FETs on PET |
8.2. | Nano imprinting/embossing |
8.2.1. | Target applications |
8.2.2. | PragmatIC Printing |
8.2.3. | TNO |
8.3. | Transfer printing |
8.3. | Semprius opportunity space |
8.3.1. | Target applications |
8.3.2. | Semprius |
9. | COATING SYSTEMS: SLOT DIE AND ALTERNATIVES |
9.1. | Coating systems |
9.1. | A simplified schematic of a manufacturing process flow. |
9.2. | Target Applications |
9.3. | Company profiles |
9.3.1. | Coatema |
9.3.2. | MegTec |
9.3.3. | Mitsubishi Materials Corporation |
9.3.4. | Ntact |
10. | POST PRINTING PROCESSING |
10.1. | Thermal drying |
10.2. | IR and UV curing |
10.3. | Photonic curing |
10.4. | Company profiles |
10.4.1. | Adphos |
10.4.2. | Heraeus Noblelight |
10.4.3. | Novacentrix |
10.4.4. | Xenon Corporation |
11. | EQUIPMENT INTEGRATION, HANDLING |
11.1. | Company profiles |
11.1.1. | 3D Micromac |
11.1.2. | Aixtron |
11.1.3. | Applied Laser Engineering ALE |
11.1.4. | Beneq |
11.1.5. | Bosch Rexroth |
11.1.6. | DP Patterning |
11.1.7. | InkTec |
11.1.8. | Kimoto Tech |
11.1.9. | Kroenert |
11.1.10. | Martin Automatic |
11.1.11. | Mekoprint A/S |
11.1.12. | Nordson Asymtek |
11.1.13. | Northfield Automation Systems |
11.1.14. | Notion Systems |
11.1.15. | Owens Design |
11.1.16. | Rolith, Inc. |
11.1.17. | Sempa Systems GmbH |
11.1.18. | Soligie |
11.1.19. | TDK-Lambda |
11.1.20. | Teknek Ltd. |
11.1.21. | VDL FLOW |
11.1.22. | Von Ardenne |
11.1.23. | Vinci Technologies |
11.1.24. | Werner Kammann Maschinenfabrik GmbH & Co. KG |
11.1.25. | Xymox |
12. | GOVERNMENT FUNDED CENTERS |
12.1. | Center profiles |
12.1.1. | Acreo, Sweden |
12.1.2. | CEA, France |
12.1.3. | Cetemmsa, Spain |
12.1.4. | CPI, UK |
12.1.5. | CSEM, Switzerland |
12.1.6. | Flexible Display Center, Arizona, USA |
12.1.7. | Holst Center (TNO, IMEC, Dutch Ministry of Economy Affairs, Government of Flanders), The Netherlands |
12.1.8. | ITRI, Taiwan |
12.1.9. | NRC |
12.1.10. | Printable Electronics Research Center, China |
12.1.11. | The Thailand Organic and Printed Electronics Center (TOPIC), Thailand |
12.1.12. | VTT |
IDTECHEX RESEARCH REPORTS | |
IDTECHEX CONSULTANCY | |
TABLES | |
FIGURES |
Pages | 225 |
---|---|
Tables | 43 |
Figures | 31 |
Forecasts to | 2025 |