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Printing Equipment for Printed Electronics 2015-2025

Market opportunities for printing, curing and integration equipment

Show All Description Contents, Table & Figures List Pricing Related Content
This unique report assesses the applications, technologies and opportunities for equipment that is enabling printed electronics. It covers the different types of printing, curing/sintering and other key manufacturing equipment, providing assessment of the manufacturing requirements for different applications, growth areas, ten year forecasts for each printing method by application and detailed company assessments.
For each printing and sintering technology, the following is addressed:
  • Analysis of existing uses of the printing technology for printed electronics/electrics
  • Assessment of the capability and technology development and roadmaps for each printing type
  • Suitability of each process to the wide range of applications possible
  • Trends and emerging opportunities for each printing technology, with ten year forecasts segmented by printing type and technology type and assessment of markets
  • Leading suppliers and detailed company profiles of over 90 organizations from around the world, based almost entirely on direct interviews with each organization
This is assessed for the following printing and printed related manufacturing technologies:
  • Screen printing
  • Inkjet printing
  • Flexo printing (and offset)
  • Gravure printing (and offset)
  • Nano imprinting/embossing
  • Transfer printing
  • Coating systems (Slot die and alternatives)
Additionally, the following post-printing processes are also covered, including
  • Thermal drying
  • IR and UV curing
  • Photonic curing
This assessment also covers global organizations integrating equipment including complete solution providers, along with government/industry backed printed electronics initiatives and manufacturing centers.
Strong investment, strong growth, profitable but subsidized
Initially the printed, organic and flexible electronics industry was driven by significant investment and technological development from the fine chemicals industry. However, the equipment industry has become strongly involved, from equipment suppliers to the printing and electronics industries seeking growth opportunities to those having designed completely new equipment from the bottom-up specifically to address the current and emerging opportunity.
IDTechEx find that screen printing currently dominates commercial printed electronics products made by printing, but intense focus on inkjet printing and high volume flexo and gravure printing is beginning to see these printing types move from R&D to pilot and some commercial product production. Governments have made significant investments in equipment to help companies start to manufacture the technology, which has created a particularly strong market in Europe. America lags due to limited government funding and even though the government funded equipment purchases in Europe are now slowing that is offset by the growth in purchases from Asia. This report analyzes where, who and quantifies the market opportunity.
State of the market and emerging applications assessed
Each printing type is assessed against the manufacture needs of a range of emerging products. Often, printing is only part of the process to make the complete product and therefore this report addresses printing electronic or electrical materials by individual layers that build up to making the full components. We cover the printing requirements of over 80 functional layers that are used to create the following components:
  • Displays: OLED, electrophoretic, AC electroluminescent, electrochromic
  • Lighting: OLED, LED
  • Sensors: Biosensors, capacitive, piezoresistive, piezoelectric, temperature, gas, organic photodetector, hybrid CMOS photodetector, digital X-ray
  • Photovoltaics: crystalline silicon PV, OPV, DSSC, aSi, CIGs and others
  • Energy storage: batteries, supercapacitors
  • Touch screens: Capacitive
  • Logic and Memory: Logic, TFTs, memory
  • Others: Membrane keypads/switches, RF antennas, heating elements, smart packaging, flexible circuits
Granular ten year forecasts
IDTechEx find that in 2015 the value of products sold that will be made by printing will be $9.15 billion, rising to $15.57 billion in 2025. This report breaks down the value of each printing technology type by each of the main application categories listed above, providing a ten year forecast for each.
Sample: total value of printed components split by printing technology type
Source: IDTechEx Research
Over 90 organizations covered
Progress of over 90 organizations is covered, based on direct interviews with most of them, segmented by the products they provide and value chain positioning. The application priority and latest technology developments for each organization is given. Government backed printed electronics manufacturing centers are also covered. The market leaders are identified.
Expert insights that add value
IDTechEx has studied printed, organic and flexible electronics technologies and markets since 2002. We conduct hundreds of interviews each year with organizations involved in the topic and have developed accurate models for forecasting in addition to having global insights directly from leading executives across the supply chain. Additionally, IDTechEx hosts the world's largest events on the topic - Printed Electronics USA, Printed Electronics Europe and Printed Electronics Asia, giving us close interactions with all involved parties and particularly end users, assessing their needs and therefore the market pull.
Analyst access included to help guide you
All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.
Analyst access from IDTechEx
All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.
Further information
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Table of Contents
1.1.The current market for printed, organic and flexible electronics
1.1.Comparison of Printing Technologies
1.1.1.Output performance comparison
1.1.2.Running performance comparison
1.1.3.Printing Type by Application
1.1.4.Value chain for equipment for printed electronics
1.1.6.Opportunities - Component Attach
1.2.Forecasts by printing equipment type vs component 2015-2025
1.2.Four main types of printed technologies being pursued for printed electronics
1.3.Printed performance characteristics of the different printing types relevant to printed electronics
1.3.Printed Electronics Equipment Sales: Companies Look to Asia
1.3.1.Europe Government Funding for Equipment Declines
1.4.Comparison of the different printing types by a number of running parameters
1.5.Current status of printing by volume
1.5.Energy Storage
1.6.Touch Screens
1.6.The value chain for equipment supply for printed electronics
1.7.Printed electronics centers worldwide
1.7.Logic and Memory
1.8.Other Components
1.9.Leading providers of inkjet
1.10.Leading providers of flexo, gravure and offset
1.11.Leading providers of screen printing
1.12.Leading providers of coating
1.13.Leading providers of photonic curing/sintering
1.14.Leading providers of other
1.16.OLED Display
1.17.OLED Light
1.18.Electrophoretic/E-wetting/BiStable LCD
1.24.Conductors (ink only)
2.1.What is printed electronics
2.1.Description and analysis of the main technology components of printed and potentially printed electronics
2.1.Market value $ billions of only printed electronics 2015-2025
2.2.Market value $ billions of only printed electronics 2015-2025
2.2.Why printing?
2.3.Types of Printed electronics technologies/components
2.3.Printing techniques with a physical master vs those without a physical master
2.4.Market size of printed electronics 2015-2025
2.5.Printing Technologies
3.1.Crystalline Silicon Photovoltaics
3.1.SWOT Analysis
3.1.Example of a grid structure
3.2.Sheet resistance as a function of optical transmission for different materials. Metal grids have the best performance, i.e., sheet resistance of 10 Ohm at 95% transmission.
3.2.Thin Film Photovoltaics
3.3.Touch screens
3.3.Comparing the optical clarity of TCFs made using different materials/processes. It is noted that the directly printed metal mesh TCFs are not completely invisible and the naked eye can detect the grid structures.
3.4.Logic and memory
3.5.OLED displays and lighting
3.6.Smart Packaging
3.7.Transparent Conductive Films
3.8.Direct Printing
4.1.Key mechanical variables
4.1.Screen printing is one of the oldest printing processes. It incorporates a frame (E), mesh (D), image (C), squeegee (B) and ink (A).
4.2.Rotary screen printing wraps the mesh around a cylinder
4.2.Output variables
4.2.Screen printing forecasts 2015-2025
4.3.Suitability to different devices/ components
4.3.Screen printing forecasts 2015-2025
4.3.Screen printing forecasts 2015-2025
4.4.Two of the largest markets along with their needs
4.4.The strengths and weaknesses of screen printing
4.4.Existing uses
4.5.Future uses
4.6.Innovation and technical progress
4.6.2.Print on print (Double print)
4.7.Company profiles
4.7.1.A&M Kinzel Siebdruckmaschinen Ltd
4.7.2.Applied Materials Baccini
4.7.3.Asada Mesh
4.7.4.DEK Printing Machines Ltd
4.7.6.Ever Bright Printing Machine Fty. Ltd
4.7.8.Metal Etch Services Inc
4.7.9.p-tec GmbH
4.7.10.Saati Americas Corp
4.7.14.Thieme Corporation
4.7.15.Thieme GmbH & Co KG
4.7.17.UTZ Technologies
4.7.18.Werner Kammann Maschinenfabrik GmbH & Co. KG
5.1.Key variables
5.1.Ink jet technology
5.2.Inkjet printing forecasts 2015-2025
5.2.Inkjet printing forecasts 2015-2025
5.2.Output characteristics
5.3.Inkjet printing forecasts 2015-2025
5.3.Suitability to different devices/ components
5.3.Printed interconnects
5.4.Adaptive routing for board level packaging
5.4.Existing uses
5.4.The strengths and weaknesses of inkjet printing
5.5.Future uses
5.5.OLED/OPV encapsulation barriers, OPV/OLED lighting, signage and displays, touch screens
5.5.1.Printed interconnects
5.5.2.Mass customization
5.5.3.OLED and flat panel displays, OLED lighting, Touch screens, OPV
5.5.4.Touch panel bezels
5.5.5.Masking followed by plating
5.5.6.PV bus bars and fingers
5.6.Bezel (black matrix), conductive traces, spacers, bridges
5.6.Company profiles
5.6.2.Fujifilm Dimatix
5.6.4.Meyer Burger PixDro
5.6.6.Samsung Electro-Mechanics
5.6.7.SCHMID Group
5.6.8.Seiko Epson
5.6.9.SIJ Technology
5.6.11.THG Inkjet
5.7.Less lateral growth during electroplating
5.8.Size of ink droplet volume versus it's radius
6.1.Flexo printing forecasts 2015-2025
6.1.Flexo printing forecasts 2015-2025
6.2.Flexo printed conductive lines.
6.2.The strengths and weaknesses of inkjet printing
6.2.Flexo printing forecasts 2015-2025
6.3.Suitability to different devices/ components
6.4.Existing uses
6.5.Future uses
6.6.Company profiles
6.6.2.Harper Corporation
6.6.3.Mark Andy
6.6.4.Multi Print Systems (MPS)
6.6.6.Omet Varyflex
7.1.Key variables
7.1.Gravure printing forecasts 2015-2025
7.2.Output characteristics
7.2.Gravure printing forecasts 2015-2025
7.3.Suitability to different devices/ components
7.3.Gravure printing forecasts 2015-2025
7.4.The strengths and weaknesses of gravure printing
7.4.Existing uses
7.5.Future uses
7.6.Company profiles
7.6.1.Bobst Group
7.6.2.Chestnut Engineering
7.6.4.Harper Corporation
7.6.6.Mirwec Film
7.6.8.Ohio Gravure Technologies Accupress
8.1.Other printing forecasts 2015-2025
8.1.Other printing forecasts 2015-2025
8.1.Other printing forecasts 2015-2025
8.2.Transfer printed GaAs FETs on PET
8.2.Nano imprinting/embossing
8.2.1.Target applications
8.2.2.PragmatIC Printing
8.3.Transfer printing
8.3.Semprius opportunity space
8.3.1.Target applications
9.1.Coating systems
9.1.A simplified schematic of a manufacturing process flow.
9.2.Target Applications
9.3.Company profiles
9.3.3.Mitsubishi Materials Corporation
10.1.Thermal drying
10.2.IR and UV curing
10.3.Photonic curing
10.4.Company profiles
10.4.2.Heraeus Noblelight
10.4.4.Xenon Corporation
11.1.Company profiles Micromac
11.1.3.Applied Laser Engineering ALE
11.1.5.Bosch Rexroth
11.1.6.DP Patterning
11.1.8.Kimoto Tech
11.1.10.Martin Automatic
11.1.11.Mekoprint A/S
11.1.12.Nordson Asymtek
11.1.13.Northfield Automation Systems
11.1.14.Notion Systems
11.1.15.Owens Design
11.1.16.Rolith, Inc.
11.1.17.Sempa Systems GmbH
11.1.20.Teknek Ltd.
11.1.21.VDL FLOW
11.1.22.Von Ardenne
11.1.23.Vinci Technologies
11.1.24.Werner Kammann Maschinenfabrik GmbH & Co. KG
12.1.Center profiles
12.1.1.Acreo, Sweden
12.1.2.CEA, France
12.1.3.Cetemmsa, Spain
12.1.4.CPI, UK
12.1.5.CSEM, Switzerland
12.1.6.Flexible Display Center, Arizona, USA
12.1.7.Holst Center (TNO, IMEC, Dutch Ministry of Economy Affairs, Government of Flanders), The Netherlands
12.1.8.ITRI, Taiwan
12.1.10.Printable Electronics Research Center, China
12.1.11.The Thailand Organic and Printed Electronics Center (TOPIC), Thailand

Report Statistics

Pages 225
Tables 43
Figures 31
Forecasts to 2025

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