This report is no longer available. Click here to view our current reports or contact us to discuss a custom report.
If you have previously purchased this report then please use the download links on the right to download the files.
1. | EXECUTIVE SUMMARY AND CONCLUSIONS |
1.1. | Changing the world |
1.2. | Purpose of this report |
1.3. | Primary conclusions |
1.3.1. | Technological megatrend |
1.3.2. | Benefits |
1.3.3. | Challenges |
1.3.4. | Why now? |
1.3.5. | Focus |
1.4. | Evolution |
1.5. | Most promising SE functions in business potential with examples |
1.6. | SE opportunity vs progress by business sector |
1.7. | SE manufacturing and technology readiness by applicational sector and date |
1.8. | Structural electronics as protective coating or wrap: applications compared |
1.9. | Structural electronics as load bearing structure: applications compared |
1.10. | Structural electronics technologies compared |
1.10.1. | Thickness vs area |
1.10.2. | In use |
1.10.3. | Working well in laboratory and trials |
1.10.4. | Later |
1.11. | Formats of technology |
1.12. | Status of multifunctional composites by application |
1.13. | Much more can be done with metal patterning on appropriate substrates |
1.14. | Some organisations attempting significant SE advances |
1.15. | Patent analysis |
1.15.1. | Structural electronics |
1.15.2. | Structural solar |
1.16. | Market forecasts |
1.16.1. | Overview 2020-2030 |
1.16.2. | Solar energy-independent cars 2019-2030 - Number of vehicles (thousand) |
1.16.3. | Solar energy-independent cars 2019-2030 - Market Value (US$ billion) |
1.16.4. | Smart glass market size ($ million) 2019-2030 |
1.16.5. | Building integrated photovoltaics BIPV |
1.16.6. | RFID sensor tags and systems $ million |
1.17. | SE product and technology roadmaps 2019-2040 |
1.17.1. | General |
1.17.2. | Roadmap to flexible displays and phones |
1.17.3. | Roadmap for solar and supercapacitor cars |
2. | INTRODUCTION: PHONES, WEARABLES, VEHICLES, STRUCTURES |
2.1. | Progression to structural electronics |
2.1.1. | Sequence |
2.1.2. | Multiple sources |
2.1.3. | Beginnings: PCBs: multilayer, heat pipe vias, load bearing PCB |
2.1.4. | True structural electronics: Plastic Electronic, Smart Plastics Network |
2.1.5. | Hybrid structural-conventional |
2.1.6. | Hybrid structural conventional: wearables Matrix Powerwatch |
2.1.7. | Flexible mobile phones |
2.2. | Emerging structural electronics |
2.2.1. | Tesla sunroof with electric tinting and integrated lighting |
2.2.2. | Energy harvesting suitable for SE |
2.3. | Combining many functions |
2.3.1. | Ocean wave blanket power |
2.3.2. | Triboelectric integrated with other sensing/ harvesting |
2.4. | Vehicles |
2.4.1. | Load bearing supercapacitors replace steel bodywork |
3. | VEHICLE INTEGRATED PHOTOVOLTAICS VIPV |
3.1. | Basics |
3.1.1. | Definitions and history |
3.1.2. | Energy positive vehicles |
3.1.3. | New user propositions enabled by structural solar |
3.2. | Importance of solar cars |
3.3. | Tipping points for sales of solar cars |
3.4. | Tipping points for sales of solar trucks, buses and trains |
3.5. | Corporate and geographical positioning |
3.6. | Chemistry |
3.7. | Format |
3.8. | Leading solar cars compared: Sono, Lightyear, Hanergy, Toyota |
3.9. | Solar buses and trucks |
3.10. | Energy Independent Electric Vehicles EIEV |
4. | SMART ROADS, BRIDGES, BUILDINGS |
4.1. | Overview |
4.2. | Smart roads and other paving |
4.2.1. | Overview |
4.2.2. | Smart road probability of success vs current investment |
4.2.3. | Piezoelectric motion harvesting US, UK |
4.2.4. | Realistic solar roads, parking, paths, barriers overview |
4.2.5. | Solar roads in France and Germany a failure |
4.2.6. | Mirai Labo Japan¶ |
4.2.7. | Pavenergy China |
4.2.8. | Platio Hungary |
4.2.9. | Solar Roadways USA |
4.2.10. | Tokyo Government Japan |
4.2.11. | TNO SolaRoad Netherlands |
4.3. | Gantry vs road surface: Korea, China |
4.4. | Solar wind / sound barriers: Eindhoven University of Technology |
4.5. | Building integrated photovoltaics |
4.5.1. | Overview |
4.5.2. | BAPV vs BIPV |
4.5.3. | BIPV technologies and location |
4.6. | BIPV adds more SE |
5. | MATERIALS AND MANUFACTURING: LARGE STRUCTURAL ELECTRICS |
5.1. | Overview |
5.2. | Dream for supercapacitors and their derivatives: other planned benefits |
5.3. | Structural battery technology |
5.4. | Structural supercapacitor technology |
5.4.1. | Imperial College London; Chalmers Sweden |
5.4.2. | Queensland University of Technology Australia, Rice University USA |
5.4.3. | Trinity College Dublin Ireland |
5.4.4. | Vanderbilt University USA |
5.4.5. | ZapGo UK |
5.5. | Smart glass technology |
5.5.1. | Active smart glass in buildings - Market drivers |
5.5.2. | Active and passive glass darkening materials |
5.6. | Smart cement technology |
5.6.1. | Batteries as cement |
5.6.2. | Battery charging cement Magment (TM) |
5.7. | Structural photovoltaic materials and future |
5.7.1. | Choice of operating principles |
5.7.2. | Comparison of performance and issues |
5.7.3. | Sharp conversion efficiency 37.9% |
5.7.4. | Perovskite silicon tandem: record 25.2% efficiency |
5.7.5. | CIGS PV in action |
5.7.6. | pcSi PV in action |
5.7.7. | scSi PV in action |
5.7.8. | GaAs PV in action |
5.7.9. | Future structural photovoltaics plus structural supercapacitor |
5.7.10. | Three in one PV window material |
5.7.11. | Building integrated photovoltaic thermal (BIPVT) |
5.8. | Multi-functional PV materials |
5.8.1. | Optimising crop growth in greenhouses |
5.8.2. | Desalination and optimising growth |
5.8.3. | Fiber making and storing electricity |
5.8.4. | Fiber and film making electricity two ways and storing |
6. | MONOLITHIC FLEXIBLE DISPLAY MATERIALS AND TECHNOLOGY |
6.1. | First step: OLED on plastic substrate |
6.2. | Inkjet printing organic materials for thin film encapsulation of OLEDs |
6.3. | Printed OLED: key players |
6.4. | Printing for monolithic flexible displays is near |
6.5. | Printing flexible quantum dot displays |
6.6. | Resulting flexible devices 2018-2020 |
6.7. | Key components for flexible OLEDs |
7. | VEHICLE AND CONSUMER GOODS SIMPLIFICATION: IN MOLD ELECTRONICS |
7.1. | What is in-mould electronics? |
7.1.1. | IME products have exceptional environmental tolerance |
7.1.2. | Aircraft aerofoil flap with integral heater for de-icing using in-mold electronics |
7.1.3. | IME: 3D friendly process for circuit making |
7.1.4. | Related processes comparison IMD, IME, MID/LDS |
7.2. | What is the in-mold electronic process? |
7.2.1. | Comments on requirements |
7.3. | Conductive ink requirements for IME |
7.3.1. | New ink requirements: stretchability |
7.3.2. | New ink requirements: portfolio approach |
7.4. | Diversity of material portfolio |
7.4.1. | New ink requirements: surviving heat stress |
7.4.2. | New ink requirements: stability |
7.4.3. | All materials in the stack must be reliable |
7.4.4. | Design: general observations |
7.5. | Expanding range of functional materials |
7.5.1. | Stretchable carbon nanotube transparent conducting films |
7.5.2. | Beyond IME conductive inks: adhesives |
7.5.3. | Beyond conductive inks: thermoformed polymeric actuator? |
7.6. | Overview of applications, commercialization progress, and prototypes |
7.6.1. | In-mold electronic application: automotive |
7.6.2. | White goods, medical and industrial control (HMI) |
7.6.3. | Is IME commercial yet? |
7.6.4. | First (ALMOST) success story: overhead console in cars |
7.6.5. | Commercial products: wearable technology |
7.6.6. | Automotive: direct heating of headlamp plastic covers |
7.6.7. | Automotive: human machine interfaces |
7.6.8. | White goods: human machine interfaces |
7.6.9. | Mobile phone storage |
7.7. | IME functional material suppliers |
7.7.1. | Emerging value chain |
7.7.2. | Stretchable conductive ink suppliers multiply |
7.7.3. | IME conductive ink suppliers multiply |
7.7.4. | IME with functional films made with evaporated lines |
7.8. | Approach of TactoTek: the IME SE leader |
7.8.1. | TactoTek Profile |
8. | CONFORMAL PRINTING, MID, 3DPE, SPRAYING |
8.1. | Printing directly on a 3D surface |
8.1.1. | Optomec Aerosol: market leader |
8.1.2. | Conformal printing examples: Harvard University, University of Illinois at Urbana Champaign, Optomec |
8.1.3. | Pulse Electronics |
8.1.4. | Spraying leading edge 787 heater GKN, Boeing |
8.1.5. | Nano Dimension Israel, Ceradrop France |
8.1.6. | Neotech, Novacentrix, nScrypt |
8.2. | Molded Interconnect Devices: Laser Direct Structuring |
8.2.1. | Overview |
8.2.2. | MID and LDS: LPKF, Festo |
8.2.3. | Applications of laser direct structuring in IME |
8.2.4. | MID - LPKF and Molex examples |
8.2.5. | MID - TRW example |
8.3. | Genuinely Printed PCB |
8.3.1. | Progress towards rapid PCB prototyping using Ag nanoparticle inks |
8.3.2. | Printed PCB: Newcomers |
8.4. | Transfer printing: printing test strips & using lamination to compete with IME |
8.5. | 3D printed electronics |
8.5.1. | Overview |
8.5.2. | Toyota Japan |
8.5.3. | Aconity3D Germany, USA |
8.5.4. | Functionalise USA |
8.5.5. | Harvard University |
8.5.6. | Princeton University |
8.5.7. | Nascent Objects |
8.5.8. | aGic Japan, Voltera Canada |
8.5.9. | Cartesian USA, Botfactory USA |
8.5.10. | Voxel8 |
8.6. | Manufacturing options compared |
Slides | 303 |
---|---|
Forecasts to | 2030 |